JP2004001227A5 - - Google Patents

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Publication number
JP2004001227A5
JP2004001227A5 JP2003276542A JP2003276542A JP2004001227A5 JP 2004001227 A5 JP2004001227 A5 JP 2004001227A5 JP 2003276542 A JP2003276542 A JP 2003276542A JP 2003276542 A JP2003276542 A JP 2003276542A JP 2004001227 A5 JP2004001227 A5 JP 2004001227A5
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JP
Japan
Prior art keywords
polished
polishing
film thickness
detection means
thickness detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003276542A
Other languages
English (en)
Japanese (ja)
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JP2004001227A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003276542A priority Critical patent/JP2004001227A/ja
Priority claimed from JP2003276542A external-priority patent/JP2004001227A/ja
Publication of JP2004001227A publication Critical patent/JP2004001227A/ja
Publication of JP2004001227A5 publication Critical patent/JP2004001227A5/ja
Withdrawn legal-status Critical Current

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JP2003276542A 1995-07-20 2003-07-18 ポリッシング装置および方法 Withdrawn JP2004001227A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003276542A JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20659395 1995-07-20
JP2003276542A JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP20881496A Division JP3601910B2 (ja) 1995-07-20 1996-07-19 ポリッシング装置及び方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006322994A Division JP4451432B2 (ja) 1995-07-20 2006-11-30 ポリッシング方法
JP2007035070A Division JP4734269B2 (ja) 1995-07-20 2007-02-15 ポリッシング方法

Publications (2)

Publication Number Publication Date
JP2004001227A JP2004001227A (ja) 2004-01-08
JP2004001227A5 true JP2004001227A5 (enExample) 2005-05-26

Family

ID=30445440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003276542A Withdrawn JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

Country Status (1)

Country Link
JP (1) JP2004001227A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP5186296B2 (ja) * 2008-06-30 2013-04-17 信越半導体株式会社 ウェーハの研磨方法及び半導体素子の製造方法
JP5980476B2 (ja) 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
JP7012519B2 (ja) * 2017-11-29 2022-01-28 株式会社荏原製作所 基板処理装置

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