JP2004001227A - ポリッシング装置および方法 - Google Patents

ポリッシング装置および方法 Download PDF

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Publication number
JP2004001227A
JP2004001227A JP2003276542A JP2003276542A JP2004001227A JP 2004001227 A JP2004001227 A JP 2004001227A JP 2003276542 A JP2003276542 A JP 2003276542A JP 2003276542 A JP2003276542 A JP 2003276542A JP 2004001227 A JP2004001227 A JP 2004001227A
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JP
Japan
Prior art keywords
polishing
polished
film thickness
turntable
detecting means
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JP2003276542A
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English (en)
Japanese (ja)
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JP2004001227A5 (enExample
Inventor
Hirokuni Hiyama
桧山　浩国
Taketaka Wada
和田　雄高
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Ebara Corp
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Ebara Corp
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Priority to JP2003276542A priority Critical patent/JP2004001227A/ja
Publication of JP2004001227A publication Critical patent/JP2004001227A/ja
Publication of JP2004001227A5 publication Critical patent/JP2004001227A5/ja
Withdrawn legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2003276542A 1995-07-20 2003-07-18 ポリッシング装置および方法 Withdrawn JP2004001227A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003276542A JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20659395 1995-07-20
JP2003276542A JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

Related Parent Applications (1)

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JP20881496A Division JP3601910B2 (ja) 1995-07-20 1996-07-19 ポリッシング装置及び方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006322994A Division JP4451432B2 (ja) 1995-07-20 2006-11-30 ポリッシング方法
JP2007035070A Division JP4734269B2 (ja) 1995-07-20 2007-02-15 ポリッシング方法

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JP2004001227A true JP2004001227A (ja) 2004-01-08
JP2004001227A5 JP2004001227A5 (enExample) 2005-05-26

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JP2003276542A Withdrawn JP2004001227A (ja) 1995-07-20 2003-07-18 ポリッシング装置および方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010610A (ja) * 2008-06-30 2010-01-14 Shin Etsu Handotai Co Ltd ウェーハの研磨方法及び半導体素子の製造方法
WO2015167790A1 (en) * 2014-04-30 2015-11-05 Applied Materials, Inc. Serial feature tracking for endpoint detection
JP2016184770A (ja) * 2010-12-27 2016-10-20 株式会社荏原製作所 ポリッシング装置
KR20190063417A (ko) * 2017-11-29 2019-06-07 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치
US11183435B2 (en) 2005-08-22 2021-11-23 Applied Materials, Inc. Endpointing detection for chemical mechanical polishing based on spectrometry

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11715672B2 (en) 2005-08-22 2023-08-01 Applied Materials, Inc. Endpoint detection for chemical mechanical polishing based on spectrometry
US11183435B2 (en) 2005-08-22 2021-11-23 Applied Materials, Inc. Endpointing detection for chemical mechanical polishing based on spectrometry
JP2010010610A (ja) * 2008-06-30 2010-01-14 Shin Etsu Handotai Co Ltd ウェーハの研磨方法及び半導体素子の製造方法
US9969048B2 (en) 2010-12-27 2018-05-15 Ebara Corporation Polishing apparatus
JP2016184770A (ja) * 2010-12-27 2016-10-20 株式会社荏原製作所 ポリッシング装置
US10343255B2 (en) 2010-12-27 2019-07-09 Ebara Corporation Polishing apparatus
CN106463378B (zh) * 2014-04-30 2019-06-11 应用材料公司 用于终点检测的序列特征跟踪
CN106463378A (zh) * 2014-04-30 2017-02-22 应用材料公司 用于终点检测的序列特征跟踪
KR20160148676A (ko) * 2014-04-30 2016-12-26 어플라이드 머티어리얼스, 인코포레이티드 엔드포인트 검출을 위한 연속적인 피처 트래킹
US9352440B2 (en) 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
KR102368644B1 (ko) 2014-04-30 2022-02-25 어플라이드 머티어리얼스, 인코포레이티드 엔드포인트 검출을 위한 연속적인 피처 트래킹
WO2015167790A1 (en) * 2014-04-30 2015-11-05 Applied Materials, Inc. Serial feature tracking for endpoint detection
KR20190063417A (ko) * 2017-11-29 2019-06-07 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치
JP2019102518A (ja) * 2017-11-29 2019-06-24 株式会社荏原製作所 基板処理装置
JP7012519B2 (ja) 2017-11-29 2022-01-28 株式会社荏原製作所 基板処理装置
US11883922B2 (en) 2017-11-29 2024-01-30 Ebara Corporation Substrate processing apparatus
KR102644567B1 (ko) 2017-11-29 2024-03-08 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치

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