JP2007041107A - 感光性樹脂組成物並びにその硬化物 - Google Patents
感光性樹脂組成物並びにその硬化物 Download PDFInfo
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- JP2007041107A JP2007041107A JP2005222629A JP2005222629A JP2007041107A JP 2007041107 A JP2007041107 A JP 2007041107A JP 2005222629 A JP2005222629 A JP 2005222629A JP 2005222629 A JP2005222629 A JP 2005222629A JP 2007041107 A JP2007041107 A JP 2007041107A
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- Prior art keywords
- resin composition
- photosensitive resin
- aqueous solution
- alkaline aqueous
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000007864 aqueous solution Substances 0.000 claims abstract description 20
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 14
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 13
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims abstract description 11
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 25
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- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000007810 chemical reaction solvent Substances 0.000 description 4
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
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- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 3
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- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 3
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- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
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- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
Description
3)更に、光重合開始剤及び/又は反応性架橋剤を含有する上記1)又は2)に記載のアルカリ水溶液可溶性感光性樹脂組成物。
4)ソルダーレジストとして使用する上記1)〜3)のいずれか一項に記載のアルカリ水溶液可溶性感光性樹脂組成物。
6)上記5)に記載の硬化物の層を有する基材。
7)上記6)の基材を有する物品。
で表される化合物をグリシジルエーテル化することにより得られる。式(2)で表される化合物としては、例えば、KAYAHARD GPH−65、KAYAHARD GPH−78、KAYAHARD GPH−103(いずれも日本化薬(株)製)等の市販の化合物が挙げられる。
又、上記式(1)で表されるエポキシ樹脂としては、例えば、市販品としてのNC−3000、NC−3000H(いずれも日本化薬(株)製)等が挙げられる。
アクリル酸類としては、例えば、(メタ)アクリル酸、β−スチリルアクリル酸、β−フルフリルアクリル酸、飽和又は不飽和二塩基酸無水物と1分子中に1個の水酸基を有する(メタ)アクリレート誘導体との当モル反応物である半エステル類、飽和又は不飽和二塩基酸とモノグリシジル(メタ)アクリレート誘導体類との当モル反応物である半エステル類等が挙げられる。
不飽和モノカルボン酸(b)として特に好ましくは、感光性樹脂組成物としたときの感度の点から(メタ)アクリル酸、(メタ)アクリル酸とε−カプロラクトンとの反応生成物又は桂皮酸が挙げられる。
又、熱重合禁止剤として、ハイドロキノンモノメチルエーテル、2−メチルハイドロキノン、ハイドロキノン、ジフェニルピクリルヒドラジン、ジフェニルアミン、2,6−ジ−t−ブチル−p−クレゾール等を使用するのが好ましい。
なお,本発明において固形分酸価とは、樹脂1g中のカルボン酸の酸性を中和するのに必要な水酸化カリウムの量(mg)であり、酸価とは樹脂を含む溶液1gを中和するのに必要な水酸化カリウムの量(mg)であり、JIS K0070に準じて、通常の中和滴定法により測定される。又、溶液中の樹脂の濃度がわかれば、溶液の酸価から固形分酸価を計算して求めることもできる。
又、本発明のアルカリ水溶液可溶性感光性樹脂組成物には、アルカリ水溶液可溶性樹脂(A)のカルボキシル基と硬化剤(B)のエポキシ基を熱硬化させる際の触媒として熱硬化触媒を使用してもよく、該触媒としてはメラミン、イミダゾール、メチルイミダゾール等が挙げられ、これらの熱硬化触媒は基板表面の酸化を抑える効果も有する。
この硬化物層の膜厚は0.5〜160μm程度で、好ましくは1〜100μm程度である。
攪拌装置、還流管をつけた1Lフラスコ中に、エポキシ化合物(a)として日本化薬(株)製 NC−3000H(ビフェニル型エポキシ樹脂、エポキシ当量:215.0g/当量、軟化点69.2℃)を288.0g、分子中に不飽和モノカルボン酸化合物(b)としてアクリル酸(分子量:72.06)を74.2g、反応用溶媒としてカルビトールアセテートを155.2g、熱重合禁止剤として2,6−ジ−t−ブチル−p−クレゾールを1.552g及び反応触媒としてトリフェニルホスフィンを1.552g仕込み、98℃の温度で反応液の酸価が0.5mg・KOH/g以下になるまで反応させ、エポキシアクリレート樹脂を得た。
次いでこの反応液に反応用溶媒としてカルビトールアセテートを112.4g、多塩基酸無水物(c)としてテトラヒドロ無水フタル酸134.8g仕込み、95℃で5時間反応させ、アルカリ水溶液可溶性樹脂(A)を65重量%含む樹脂溶液を得た(この溶液をA−1とする)。酸価を測定したところ、67.0mg・KOH/g(固形分酸価:103.1mg・KOH/g)であった。
攪拌装置、還流管をつけた1Lフラスコ中に、エポキシ化合物(a)として日本化薬(株)製 NC−3000H(ビフェニル型エポキシ樹脂、エポキシ当量:215.0g/当量)を288.0g、不飽和モノカルボン酸化合物(b)としてアクリル酸(分子量:72.06)を74.2g、反応用溶媒としてカルビトールアセテートを155.2g、熱重合禁止剤として2,6−ジ−t−ブチル−p−クレゾールを1.552g及び反応触媒としてトリフェニルホスフィンを1.552g仕込み、98℃の温度で反応液の酸価が0.5mg・KOH/g以下になるまで反応させ、エポキシアクリレート樹脂(C’)を得た(この溶液をC−1とする)。
攪拌装置、還流管をつけた3Lフラスコ中に、エポキシ化合物として日本化薬(株)製 EOCN−103S(多官能クレゾールノボラック型エポキシ樹脂、エポキシ当量:215.0g/当量)を860.0g、不飽和モノカルボン酸化合物(b)としてアクリル酸(分子量:72.06)を288.3g、反応用溶媒としてカルビトールアセテートを492.1g、熱重合禁止剤として2,6−ジ−t−ブチル−p−クレゾールを4.921g及び反応触媒としてトリフェニルホスフィンを4.921g仕込み、98℃の温度で反応液の酸価が0.5mg・KOH/g以下になるまで反応させ、エポキシカルボキシレート化合物を得た。
次いでこの反応液に反応用溶媒としてカルビトールアセテートを169.8g、多塩基酸無水物(c)としてテトラヒドロ無水フタル酸201.6g仕込み、95℃で5時間反応させ、特許文献2の合成例1に記載のアルカリ水溶液可溶性樹脂を67重量%含む樹脂溶液を得た(この溶液をX−1とする)。酸価を測定したところ、69.4mg・KOH/g(固形分酸価:103.6mg・KOH/g)であった。
前記合成例1、2及び比較合成例1で得られた(A−1)、(C−1)、(X−1)、硬化剤(B)として上記式(1)の構造を有する日本化薬(株)製NC−3000(ビフェニル型エポキシ樹脂、エポキシ当量:272g/当量)、日本化薬(株)製EOCN−103S(多官能クレゾールノボラック型エポキシ樹脂、エポキシ当量:215.0g/当量)を用い、各々表1に示す配合割合で混合し、3本ロールミルで混練し感光性樹脂組成物を得た。
これをスクリーン印刷法により乾燥膜厚が15〜25μmの厚さになるようにプリント配線基板に塗布し、塗膜を80℃の熱風乾燥器で30分乾燥させた。次いで、紫外線露光装置((株)オーク製作所、型式HMW−680GW)を用い回路パターンの描画されたマスクを通して紫外線を照射し、1%炭酸ナトリウム水溶液でスプレー現像を行い、紫外線未照射部の樹脂を除去した。水洗乾燥した後、プリント基板を150℃の熱風乾燥器で60分加熱硬化反応させ硬化膜を得た。得られた硬化物について、タック性、現像性、解像性、光感度、表面光沢、難燃性、基板そり、屈曲性、密着性、鉛筆硬度、耐溶剤性、耐酸性、耐熱性、耐金メッキ性の試験を行った。それらの結果を表2に示す。
実施例 比較例
注 1 2 1 2
アルカリ水溶液可溶性樹脂溶液
A−1 46.55 36.55 46.55
X−1 46.55
エポキシアクリレート樹脂溶液
C−1 10.00
反応性架橋剤
DPHA *1 6.06 6.06 6.06 6.06
光重合開始剤
イルガキュアー907 *2 4.54 4.54 4.54 4.54
DETX−S *3 0.91 0.91 0.91 0.91
硬化剤(B)
NC−3000 17.62 17.62 17.62
EOCN−104S *4 17.62
熱硬化触媒
メラミン 0.76 0.76 0.76 0.76
添加剤
硫酸バリウム 24.22 24.22 24.22 24.22
フタロシアニンブルー 0.61 0.61 0.61 0.61
BYK−354 *5 0.39 0.39 0.39 0.39
KS−66 *6 1.21 1.21 1.21 1.21
溶剤
カルビトールアセテート 4.54 4.54 4.54 4.54
*1 日本化薬(株)製 :ジペンタエリスリトールヘキサアクリレート
*2 チバスペシャリティーケミカルズ製 :2−メチル−1−[4−(メチルチオ)フェニル]−2−モルホリノプロパン−1−オン
*3 日本化薬(株)製 :2,4−ジエチルチオキサントン
*4 日本化薬(株)製 :クレゾールノボラック型エポキシ樹脂
*5 ビックケミー製:レベリング剤
*6 信越化学(株)製 :消泡剤
(タック性)基板に塗布した乾燥後の膜に脱脂綿をこすりつけ、膜のタック性を評価した。
○・・・・脱脂綿は張り付かない。
×・・・・脱脂綿の糸くずが膜に張り付く。
○・・・・現像時、完全にインキが除去され現像できた。
×・・・・現像時、現像されない部分がある。
○・・・・パターンエッジが直線で解像されている。
×・・・・剥離若しくはパターンエッジがぎざぎざである。
○・・・・曇りが全く見られない。
×・・・・若干の曇りが見られる。
○・・・・消火する。
×・・・・燃えてしまう。
○・・・・基板にそりは見られない。
△・・・・ごくわずか基板がそっている。
×・・・・基板のそりが見られる。
○・・・・膜面に割れは見られない。
×・・・・膜面が割れる。
〇・・・・剥れがない。
×・・・・剥離する。
○・・・・塗膜外観に異常がなく、フクレや剥離がない。
×・・・・塗膜にフクレや剥離がある。
○・・・・塗膜外観に異常がなく、フクレや剥離がない。
×・・・・塗膜にフクレや剥離がある。
〇・・・・塗膜外観に異常がなく、フクレや剥離がない。
×・・・・塗膜にフクレや剥離がある。
○・・・・全く異常が無い。
×・・・・若干剥がれが観られた。
○・・・・塗膜外観に異常がなく、フクレや剥離がない。
×・・・・塗膜にフクレや剥離がある。
○・・・・塗膜にクラックの発生がない。
×・・・・塗膜にクラックが発生した。
実施例 比較例
1 2 1 2
評価項目
タック性 ○ ○ ○ ○
現像性 ○ ○ ○ ○
解像性 ○ ○ ○ ○
光感度 7 9 9 7
表面光沢 ○ ○ ○ ○
難燃性 ○ ○ × ×
基板そり ○ ○ × △
屈曲性 ○ ○ × ×
密着性 ○ ○ ○ ○
鉛筆硬度 6H 6H 7H 6H
耐溶剤性 ○ ○ ○ ○
耐酸性 ○ ○ × ×
耐熱性 ○ ○ ○ ○
耐金メッキ性 ○ ○ ○ ○
耐PCT性 ○ ○ × ○
耐熱衝撃性 ○ ○ × ○
合成例1に記載のアルカリ水可溶性樹脂溶液(A−1)の溶剤をプロピレングリコールモノメチルエーテルに変えただけの樹脂54.44g、架橋剤としてDPCA−60(商品名:日本化薬(株)製)3.54g、光重合開始剤としてイルガキュアー907(チバスペシャリチィーケミカルズ製)を4.72g及びカヤキュアーDETX−S(日本化薬(株)製)を0.47g、硬化剤としてNC−3000(日本化薬(株)製)を14.83g、熱硬化触媒としてメラミンを1.05g及び濃度調整溶媒としてメチルエチルケトンを20.95g加え、ビーズミルにて混練し均一に分散させレジスト樹脂組成物を得る。
次いでロールコート法により、支持フィルムとなるポリエチレンテレフタレートフィルムに均一に塗布し、温度70℃の熱風乾燥炉を通過させ、厚さ30μmの樹脂層を形成し、この樹脂層上に保護フィルムとなるポリエチレンフィルムを貼り付け、ドライフィルムを得る。得られたドライフィルムをポリイミドプリント基板(銅回路厚:12μm、ポリイミドフィルム厚:25μm)に、温度80℃の加熱ロールを用いて、保護フィルムを剥離しながら樹脂層を基板全面に貼り付け、紫外線露光装置((株)オーク製作所、型式HMW−680GW)を用い回路パターンの描画されたマスクを通して紫外線を照射する。1%炭酸ナトリウム水溶液でスプレー現像を行い、紫外線未照射部の樹脂を除去し水洗乾燥して、プリント基板を150℃の熱風乾燥器で60分加熱硬化反応させ硬化膜を得る。
Claims (7)
- 更に、式(1)で表されるエポキシ樹脂(a)と不飽和モノカルボン酸(b)との反応生成物である樹脂(C’)を含有する請求項1記載のアルカリ水溶液可溶性感光性樹脂組成物。
- 更に、光重合開始剤及び/又は反応性架橋剤を含有する請求項1又は2に記載のアルカリ水溶液可溶性感光性樹脂組成物。
- ソルダーレジストとして使用する請求項1〜3のいずれか一項に記載のアルカリ水溶液可溶性感光性樹脂組成物。
- 請求項1〜4のいずれか一項に記載のアルカリ水溶液可溶性感光性樹脂組成物の硬化物。
- 請求項5に記載の硬化物の層を有する基材。
- 請求項6の基材を有する物品。
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JP2005222629A JP4514049B2 (ja) | 2005-08-01 | 2005-08-01 | 感光性樹脂組成物並びにその硬化物 |
US11/988,903 US20090042126A1 (en) | 2005-08-01 | 2006-07-20 | Photosensitive resin composition and cured article thereof |
CN2006800279668A CN101233452B (zh) | 2005-08-01 | 2006-07-20 | 光敏性树脂组合物及其固化制品 |
PCT/JP2006/314360 WO2007015375A1 (ja) | 2005-08-01 | 2006-07-20 | 感光性樹脂組成物並びにその硬化物 |
KR1020087001331A KR101307882B1 (ko) | 2005-08-01 | 2006-07-20 | 감광성 수지 조성물 및 그의 경화물 |
TW095127836A TWI429671B (zh) | 2005-08-01 | 2006-07-28 | A photosensitive resin composition and a cured product thereof |
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Cited By (9)
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JP2008292677A (ja) * | 2007-05-23 | 2008-12-04 | Mitsubishi Chemicals Corp | 反応性樹脂組成物、カラーフィルター及び画像表示装置 |
JP2009031665A (ja) * | 2007-07-30 | 2009-02-12 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びそれを用いた感光性エレメント |
JP2010266745A (ja) * | 2009-05-15 | 2010-11-25 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
JP2011099919A (ja) * | 2009-11-04 | 2011-05-19 | Mitsubishi Chemicals Corp | 着色樹脂組成物、カラーフィルタ、液晶表示装置及び有機elディスプレイ |
CN102508408A (zh) * | 2011-10-27 | 2012-06-20 | 无锡英普林纳米科技有限公司 | 一种双固化型纳米压印传递层材料 |
US8962712B2 (en) | 2009-12-14 | 2015-02-24 | Taiyo Holdings Co., Ltd. | Photosensitive resin composition, dry film thereof, and printed wiring board using them |
JP2016511314A (ja) * | 2013-06-17 | 2016-04-14 | エルジー・ケム・リミテッド | 光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダレジスト |
KR20160110438A (ko) | 2014-04-01 | 2016-09-21 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 수지 조성물, 영구 피막 형성용 경화성 수지 조성물, 드라이 필름 및 프린트 배선판 |
JP2017090494A (ja) * | 2015-11-02 | 2017-05-25 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10282666A (ja) * | 1997-04-01 | 1998-10-23 | Mitsui Chem Inc | 感光性樹脂組成物 |
JPH11140144A (ja) * | 1997-11-04 | 1999-05-25 | Nippon Kayaku Co Ltd | 樹脂組成物及びその硬化物 |
JP2004155916A (ja) * | 2002-11-07 | 2004-06-03 | Nippon Kayaku Co Ltd | 感光性樹脂組成物及びその硬化物 |
WO2006109890A1 (ja) * | 2005-04-13 | 2006-10-19 | Tamura Kaken Corporation | 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板 |
JP2009294665A (ja) * | 2009-08-03 | 2009-12-17 | Mitsubishi Chemicals Corp | カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、及び液晶表示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3448089A (en) * | 1966-03-14 | 1969-06-03 | Du Pont | Photopolymerizable polymers containing free acid or acid anhydride groups reacted with glycidyl acrylate or glycidyl methacrylate |
JPS63258975A (ja) * | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
US5858618A (en) * | 1996-12-02 | 1999-01-12 | Nan Ya Plastics Corporation | Photopolymerizable resinous composition |
JPWO2002077058A1 (ja) * | 2001-03-23 | 2004-07-15 | 太陽インキ製造株式会社 | 活性エネルギー線硬化性樹脂、これを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物 |
KR100617287B1 (ko) * | 2001-07-17 | 2006-08-30 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 캡슐화용 에폭시 수지 조성물 및 반도체 장치 |
-
2005
- 2005-08-01 JP JP2005222629A patent/JP4514049B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-20 KR KR1020087001331A patent/KR101307882B1/ko active IP Right Grant
- 2006-07-20 US US11/988,903 patent/US20090042126A1/en not_active Abandoned
- 2006-07-20 CN CN2006800279668A patent/CN101233452B/zh active Active
- 2006-07-20 WO PCT/JP2006/314360 patent/WO2007015375A1/ja active Application Filing
- 2006-07-28 TW TW095127836A patent/TWI429671B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10282666A (ja) * | 1997-04-01 | 1998-10-23 | Mitsui Chem Inc | 感光性樹脂組成物 |
JPH11140144A (ja) * | 1997-11-04 | 1999-05-25 | Nippon Kayaku Co Ltd | 樹脂組成物及びその硬化物 |
JP2004155916A (ja) * | 2002-11-07 | 2004-06-03 | Nippon Kayaku Co Ltd | 感光性樹脂組成物及びその硬化物 |
WO2006109890A1 (ja) * | 2005-04-13 | 2006-10-19 | Tamura Kaken Corporation | 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板 |
JP2009294665A (ja) * | 2009-08-03 | 2009-12-17 | Mitsubishi Chemicals Corp | カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、及び液晶表示装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008292677A (ja) * | 2007-05-23 | 2008-12-04 | Mitsubishi Chemicals Corp | 反応性樹脂組成物、カラーフィルター及び画像表示装置 |
JP2009031665A (ja) * | 2007-07-30 | 2009-02-12 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びそれを用いた感光性エレメント |
JP2010266745A (ja) * | 2009-05-15 | 2010-11-25 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
JP2011099919A (ja) * | 2009-11-04 | 2011-05-19 | Mitsubishi Chemicals Corp | 着色樹脂組成物、カラーフィルタ、液晶表示装置及び有機elディスプレイ |
US8962712B2 (en) | 2009-12-14 | 2015-02-24 | Taiyo Holdings Co., Ltd. | Photosensitive resin composition, dry film thereof, and printed wiring board using them |
CN102508408A (zh) * | 2011-10-27 | 2012-06-20 | 无锡英普林纳米科技有限公司 | 一种双固化型纳米压印传递层材料 |
CN102508408B (zh) * | 2011-10-27 | 2014-09-10 | 无锡英普林纳米科技有限公司 | 一种双固化型纳米压印传递层材料 |
JP2016511314A (ja) * | 2013-06-17 | 2016-04-14 | エルジー・ケム・リミテッド | 光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダレジスト |
KR20160110438A (ko) | 2014-04-01 | 2016-09-21 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 수지 조성물, 영구 피막 형성용 경화성 수지 조성물, 드라이 필름 및 프린트 배선판 |
JP2017090494A (ja) * | 2015-11-02 | 2017-05-25 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法 |
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JP4514049B2 (ja) | 2010-07-28 |
WO2007015375A1 (ja) | 2007-02-08 |
KR20080030614A (ko) | 2008-04-04 |
TWI429671B (zh) | 2014-03-11 |
US20090042126A1 (en) | 2009-02-12 |
KR101307882B1 (ko) | 2013-09-13 |
CN101233452B (zh) | 2012-06-27 |
TW200710118A (en) | 2007-03-16 |
CN101233452A (zh) | 2008-07-30 |
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