JP2007027535A - 光半導体装置 - Google Patents

光半導体装置 Download PDF

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Publication number
JP2007027535A
JP2007027535A JP2005209687A JP2005209687A JP2007027535A JP 2007027535 A JP2007027535 A JP 2007027535A JP 2005209687 A JP2005209687 A JP 2005209687A JP 2005209687 A JP2005209687 A JP 2005209687A JP 2007027535 A JP2007027535 A JP 2007027535A
Authority
JP
Japan
Prior art keywords
semiconductor device
optical semiconductor
recess
mounting substrate
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005209687A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007027535A5 (enExample
Inventor
Hiroyuki Takayama
弘幸 高山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2005209687A priority Critical patent/JP2007027535A/ja
Priority to US11/458,135 priority patent/US8592851B2/en
Publication of JP2007027535A publication Critical patent/JP2007027535A/ja
Publication of JP2007027535A5 publication Critical patent/JP2007027535A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/14—Dipping a core
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2005209687A 2005-07-20 2005-07-20 光半導体装置 Pending JP2007027535A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005209687A JP2007027535A (ja) 2005-07-20 2005-07-20 光半導体装置
US11/458,135 US8592851B2 (en) 2005-07-20 2006-07-18 Optical semiconductor device and circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005209687A JP2007027535A (ja) 2005-07-20 2005-07-20 光半導体装置

Publications (2)

Publication Number Publication Date
JP2007027535A true JP2007027535A (ja) 2007-02-01
JP2007027535A5 JP2007027535A5 (enExample) 2008-08-28

Family

ID=37787879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005209687A Pending JP2007027535A (ja) 2005-07-20 2005-07-20 光半導体装置

Country Status (2)

Country Link
US (1) US8592851B2 (enExample)
JP (1) JP2007027535A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258530A (ja) * 2007-04-09 2008-10-23 Rohm Co Ltd 半導体発光装置
WO2008150042A1 (en) * 2007-06-05 2008-12-11 Seoul Semiconductor Co., Ltd. Led package
JP2010171073A (ja) * 2009-01-20 2010-08-05 Showa Denko Kk 発光装置、電気装置および表示装置
JP2013012712A (ja) * 2011-06-29 2013-01-17 Lg Innotek Co Ltd 発光素子パッケージ及びこれを具備したライトユニット
KR20130006809A (ko) * 2011-06-23 2013-01-18 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20130006807A (ko) * 2011-06-23 2013-01-18 엘지이노텍 주식회사 발광 소자 패키지
KR20160097729A (ko) * 2015-02-10 2016-08-18 엘지이노텍 주식회사 발광 소자 패키지
JP2016225527A (ja) * 2015-06-02 2016-12-28 株式会社リコー レーザ発光装置、エンジン点火プラグシステム
JP2017022420A (ja) * 2010-06-01 2017-01-26 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
US11705272B2 (en) 2018-09-27 2023-07-18 Taiyo Yuden Co., Ltd. Coil component and electronic device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795293B2 (ja) * 2007-03-30 2011-10-19 ローム株式会社 半導体発光装置
KR100901618B1 (ko) 2007-04-19 2009-06-08 엘지이노텍 주식회사 발광 다이오드 패키지 및 제조방법
KR101365621B1 (ko) * 2007-09-04 2014-02-24 서울반도체 주식회사 열 방출 슬러그들을 갖는 발광 다이오드 패키지
CN101901863A (zh) * 2010-05-04 2010-12-01 高安市汉唐高晶光电有限公司 大功率低光衰高抗静电发光二极管及其制备方法
DE102013110355A1 (de) 2013-09-19 2015-03-19 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines Leiterrahmenverbunds

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08186199A (ja) * 1994-12-28 1996-07-16 Matsushita Electron Corp 樹脂封止型半導体装置
JPH11260987A (ja) * 1998-02-11 1999-09-24 Lg Semicon Co Ltd ヒートスプレッドを有するリードフレーム及び同リードフレームを用いた半導体パッケージ
JP2001237353A (ja) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd 電子部品の放熱構造および電子部品の製造方法
JP2002176203A (ja) * 2000-09-29 2002-06-21 Omron Corp 発光デバイス及び発光デバイスアレイ
JP2002252373A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 表面実装型発光素子およびそれを用いた発光装置
JP2004228387A (ja) * 2003-01-23 2004-08-12 Koha Co Ltd 発光装置

Family Cites Families (10)

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JP2602380B2 (ja) * 1991-10-23 1997-04-23 富士通株式会社 半導体装置及びその製造方法
US6051848A (en) * 1998-03-02 2000-04-18 Motorola, Inc. Optical device packages containing an optical transmitter die
US6158882A (en) * 1998-06-30 2000-12-12 Emteq, Inc. LED semiconductor lighting system
TW447096B (en) * 2000-04-01 2001-07-21 Siliconware Precision Industries Co Ltd Semiconductor packaging with exposed die
JP2002208734A (ja) * 2001-01-10 2002-07-26 Sanken Electric Co Ltd 樹脂封止形半導体発光装置
JP2002314148A (ja) 2001-04-13 2002-10-25 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
JP3100687U (ja) 2003-09-25 2004-05-27 三得電子股▲分▼有限公司 高輝度発光ダイオード
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
JP2005317661A (ja) * 2004-04-27 2005-11-10 Sharp Corp 半導体発光装置およびその製造方法
US20060124953A1 (en) * 2004-12-14 2006-06-15 Negley Gerald H Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08186199A (ja) * 1994-12-28 1996-07-16 Matsushita Electron Corp 樹脂封止型半導体装置
JPH11260987A (ja) * 1998-02-11 1999-09-24 Lg Semicon Co Ltd ヒートスプレッドを有するリードフレーム及び同リードフレームを用いた半導体パッケージ
JP2001237353A (ja) * 2000-02-21 2001-08-31 Fujitsu Denso Ltd 電子部品の放熱構造および電子部品の製造方法
JP2002176203A (ja) * 2000-09-29 2002-06-21 Omron Corp 発光デバイス及び発光デバイスアレイ
JP2002252373A (ja) * 2001-02-26 2002-09-06 Nichia Chem Ind Ltd 表面実装型発光素子およびそれを用いた発光装置
JP2004228387A (ja) * 2003-01-23 2004-08-12 Koha Co Ltd 発光装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258530A (ja) * 2007-04-09 2008-10-23 Rohm Co Ltd 半導体発光装置
WO2008150042A1 (en) * 2007-06-05 2008-12-11 Seoul Semiconductor Co., Ltd. Led package
US7939848B2 (en) 2007-06-05 2011-05-10 Seoul Semiconductor Co., Ltd. LED package
US8288793B2 (en) 2007-06-05 2012-10-16 Seoul Semiconductor Co., Ltd. LED package having a lead frame
JP2010171073A (ja) * 2009-01-20 2010-08-05 Showa Denko Kk 発光装置、電気装置および表示装置
US10283491B2 (en) 2010-06-01 2019-05-07 Lg Innotek Co., Ltd Light emitting device package
US10541235B2 (en) 2010-06-01 2020-01-21 Lg Innotek Co., Ltd. Light emitting device package
US9991241B2 (en) 2010-06-01 2018-06-05 Lg Innotek Co., Ltd. Light emitting device package
JP2017022420A (ja) * 2010-06-01 2017-01-26 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
KR20130006809A (ko) * 2011-06-23 2013-01-18 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20130006807A (ko) * 2011-06-23 2013-01-18 엘지이노텍 주식회사 발광 소자 패키지
KR101886068B1 (ko) * 2011-06-23 2018-09-06 엘지이노텍 주식회사 발광 소자 패키지
KR101886073B1 (ko) * 2011-06-23 2018-09-06 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP2013012712A (ja) * 2011-06-29 2013-01-17 Lg Innotek Co Ltd 発光素子パッケージ及びこれを具備したライトユニット
US9728525B2 (en) 2011-06-29 2017-08-08 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
US10147857B2 (en) 2011-06-29 2018-12-04 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
US9515058B2 (en) 2011-06-29 2016-12-06 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
US10559734B2 (en) 2011-06-29 2020-02-11 Lg Innotek Co., Ltd. Light emitting device package and light unit including the same
KR20160097729A (ko) * 2015-02-10 2016-08-18 엘지이노텍 주식회사 발광 소자 패키지
KR102316036B1 (ko) 2015-02-10 2021-10-22 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
JP2016225527A (ja) * 2015-06-02 2016-12-28 株式会社リコー レーザ発光装置、エンジン点火プラグシステム
US11705272B2 (en) 2018-09-27 2023-07-18 Taiyo Yuden Co., Ltd. Coil component and electronic device

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US20070176190A1 (en) 2007-08-02
US8592851B2 (en) 2013-11-26

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