JP2007027299A5 - - Google Patents
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- Publication number
- JP2007027299A5 JP2007027299A5 JP2005205264A JP2005205264A JP2007027299A5 JP 2007027299 A5 JP2007027299 A5 JP 2007027299A5 JP 2005205264 A JP2005205264 A JP 2005205264A JP 2005205264 A JP2005205264 A JP 2005205264A JP 2007027299 A5 JP2007027299 A5 JP 2007027299A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film resistor
- weight
- substrate
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims description 149
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 150000002500 ions Chemical class 0.000 claims description 22
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 229910052804 chromium Inorganic materials 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000000206 photolithography Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 36
- 229910045601 alloy Inorganic materials 0.000 description 25
- 239000000956 alloy Substances 0.000 description 25
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 25
- 238000011156 evaluation Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000007792 addition Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 7
- 150000004706 metal oxides Chemical class 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000011068 load Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000001681 protective Effects 0.000 description 3
- 229910002059 quaternary alloy Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 230000002195 synergetic Effects 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005205264A JP4760177B2 (ja) | 2005-07-14 | 2005-07-14 | 薄膜チップ形電子部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005205264A JP4760177B2 (ja) | 2005-07-14 | 2005-07-14 | 薄膜チップ形電子部品およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007027299A JP2007027299A (ja) | 2007-02-01 |
| JP2007027299A5 true JP2007027299A5 (zh) | 2008-08-14 |
| JP4760177B2 JP4760177B2 (ja) | 2011-08-31 |
Family
ID=37787703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005205264A Active JP4760177B2 (ja) | 2005-07-14 | 2005-07-14 | 薄膜チップ形電子部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4760177B2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017174911A (ja) * | 2016-03-22 | 2017-09-28 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
| CN116981919A (zh) * | 2021-03-31 | 2023-10-31 | 松下知识产权经营株式会社 | 温度传感器 |
| CN116083851B (zh) * | 2023-04-10 | 2023-06-02 | 松诺盟科技有限公司 | 一种防止氢脆的纳米复合薄膜及其制备方法与应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4298505A (en) * | 1979-11-05 | 1981-11-03 | Corning Glass Works | Resistor composition and method of manufacture thereof |
| JPS59152602A (ja) * | 1983-02-19 | 1984-08-31 | ロ−ム株式会社 | 薄膜抵抗 |
| JPS6395601A (ja) * | 1986-10-13 | 1988-04-26 | 松下電器産業株式会社 | 抵抗薄膜 |
| JP2542504B2 (ja) * | 1986-12-11 | 1996-10-09 | ティーディーケイ株式会社 | 金属薄膜抵抗体 |
| JPH02268401A (ja) * | 1989-04-10 | 1990-11-02 | Hitachi Ltd | 薄膜抵抗装置、その製造方法、並びにそれを搭載した混成集積回路及びｉｃカード |
| JP2002367804A (ja) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | 抵抗器 |
| JP4622522B2 (ja) * | 2005-01-07 | 2011-02-02 | 住友金属鉱山株式会社 | 金属抵抗体材料、抵抗薄膜、スパッタリングターゲット、薄膜抵抗器およびその製造方法 |
| JP4622946B2 (ja) * | 2006-06-29 | 2011-02-02 | 住友金属鉱山株式会社 | 抵抗薄膜材料、抵抗薄膜形成用スパッタリングターゲット、抵抗薄膜、薄膜抵抗器およびその製造方法。 |
-
2005
- 2005-07-14 JP JP2005205264A patent/JP4760177B2/ja active Active
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