JP2007013104A - 半導体素子の製造方法 - Google Patents
半導体素子の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 238000005530 etching Methods 0.000 claims abstract description 142
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910021342 tungsten silicide Inorganic materials 0.000 claims abstract description 61
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 54
- 229920005591 polysilicon Polymers 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 29
- 230000003647 oxidation Effects 0.000 claims abstract description 23
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 17
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000000059 patterning Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000012528 membrane Substances 0.000 description 9
- 150000004767 nitrides Chemical class 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 238000002955 isolation Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28061—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
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- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Non-Volatile Memory (AREA)
Abstract
【解決手段】半導体基板21上にゲート絶縁膜23を形成するステップと、ゲート絶縁膜23上にポリシリコン膜24、シリサイド膜25及びハードマスク形成用膜の順に積層するステップと、ハードマスク26を形成するステップと、ハードマスク26をエッチングバリアとしてシリサイド膜25をエッチングし、側面にアンダーカット状凹部25Aを形成するステップと、ハードマスク26をエッチングバリアとして、ポリシリコン膜24をエッチングして、ゲートラインを形成するステップと、ライト酸化により、ポリシリコン膜24及びシリサイド膜25の側面を酸化するステップとを含む。
【選択図】図3F
Description
22 素子分離膜
23 ゲート絶縁膜
24 ポリシリコン膜
25 タングステンシリサイド膜
25A アンダーカット状凹部
26 ハードマスク
28 ライト酸化膜
Claims (17)
- 半導体基板上にゲート絶縁膜を形成するステップと、
該ゲート絶縁膜上にポリシリコン膜、シリサイド膜及びハードマスク形成用膜の順に積層するステップと、
該ハードマスク形成用膜を選択的にパターニングすることによりハードマスクを形成するステップと、
該ハードマスクをエッチングバリアとして、前記シリサイド膜をエッチングするとともに、該シリサイド膜の露出した側面にアンダーカット状凹部を形成するステップと、
前記ハードマスクをエッチングバリアとして、前記ポリシリコン膜をエッチングすることにより、ゲートラインを形成するステップと、
ライト酸化により、前記ポリシリコン膜及び前記シリサイド膜の露出した側面を酸化するステップと
を含むことを特徴とする半導体素子の製造方法。 - 前記シリサイド膜をエッチングするステップは、
前記ポリシリコン膜が露出するまでエッチングするメインエッチングステップと、
該メインエッチングの後、前記アンダーカット状凹部を形成するためのオーバーエッチングステップと
を含むことを特徴とする請求項1に記載の半導体素子の製造方法。 - 前記オーバーエッチングステップは、
オーバーエッチング目標値のうち、50%をエッチングする第1オーバーエッチングステップと、
残りの50%をエッチングする第2オーバーエッチングステップと
を含むことを特徴とする請求項2に記載の半導体素子の製造方法。 - 前記第2オーバーエッチングステップにおけるエッチングを、
等方性エッチングにより行うことを特徴とする請求項3に記載の半導体素子の製造方法。 - 半導体基板上にゲート絶縁膜を形成するステップと、
該ゲート絶縁膜上にポリシリコン膜、タングステンシリサイド膜及びハードマスク形成用膜の順に積層するステップと、
該ハードマスク形成用膜を選択的にパターニングすることにより、ハードマスクを形成するステップと、
該ハードマスクをエッチングバリアとして、前記タングステンシリサイド膜をエッチングするとともに、該タングステンシリサイド膜の露出した側面にアンダーカット状凹部を形成するステップと、
前記ハードマスクをエッチングバリアとして、前記ポリシリコン膜をエッチングすることにより、ゲートラインを形成するステップと、
ライト酸化により、前記ポリシリコン膜及び前記タングステンシリサイド膜の露出した側面を酸化するステップと
を含むことを特徴とする半導体素子の製造方法。 - 前記タングステンシリサイド膜をエッチングするステップは、
前記ポリシリコン膜が露出するまでエッチングするメインエッチングステップと、
前記アンダーカット状凹部を形成するためのオーバーエッチングステップと
を含むことを特徴とする請求項5に記載の半導体素子の製造方法。 - 前記オーバーエッチングステップは、
オーバーエッチング目標値のうちの50%をエッチングする第1オーバーエッチングステップと、
残りの50%をエッチングする第2オーバーエッチングステップと
を含むことを特徴とする請求項6に記載の半導体素子の製造方法。 - 前記第2オーバーエッチングステップにおけるエッチングを、
等方性エッチングにより行うことを特徴とする請求項7に記載の半導体素子の製造方法。 - 前記メインエッチングステップでは、NF3/Ar/Cl2/N2/O2の混合ガス、前記第1オーバーエッチングステップでは、NF3/Cl2/N2の混合ガス、前記第2オーバーエッチングステップでは、NF3/O2の混合ガスを用いることを特徴とする請求項7に記載の半導体素子の製造方法。
- 前記第1オーバーエッチングステップにおいて、
前記メインエッチング時に比べ、前記NF3の流量をより少ない流量とし、前記N2の流量をより多い流量とすることを特徴とする請求項9に記載の半導体素子の製造方法。 - 前記NF3の流量が、前記メインエッチング時には30sccm〜40sccm、前記第1オーバーエッチング時には5sccm〜10sccm、前記第2オーバーエッチング時には30sccm〜40sccmの範囲であることを特徴とする請求項9に記載の半導体素子の製造方法。
- 前記第1オーバーエッチングステップにおいて、
前記NF3の流量:5sccm〜10sccm、前記N2の流量:90sccm〜100sccm、前記Cl2の流量:90sccm〜100sccm、ソースパワー:650W〜750W、バイアスパワー:100W〜120W及び圧力:10−3Torr〜10−2Torr(0.13〜1.3Pa)の条件でエッチングすることを特徴とする請求項9に記載の半導体素子の製造方法。 - 前記第2オーバーエッチングステップにおいて、
前記NF3の流量:30sccm〜40sccm、前記O2の流量:10sccm〜15sccm、ソースパワー:650W〜750W及び圧力:10−3〜10−2Torr(0.13〜1.3Pa)の条件でエッチングすることを特徴とする請求項9に記載の半導体素子の製造方法。 - 前記第2オーバーエッチングステップにおいて、
エッチング目標値:50Å未満の条件でエッチングすることを特徴とする請求項13に記載の半導体素子の製造方法。 - 前記メインエッチングステップにおいて、
前記NF3の流量:30sccm〜40sccm、前記Cl2の流量:90sccm〜100sccm、前記N2の流量:40sccm〜50sccm、前記O2の流量:10sccm〜15sccm、ソースパワー:800W〜900W、バイアスパワー:600W〜700W及び圧力:10−3Torr〜10−2Torr(0.13〜1.3Pa)の条件でエッチングすることを特徴とする請求項9に記載の半導体素子の製造方法。 - 前記ライト酸化において、
エッチング目標値:50Å未満の条件でエッチングすることを特徴とする請求項5に記載の半導体素子の製造方法。 - 前記ハードマスク及び前記ポリシリコン膜は、エッチングにより露出した側面の断面が前記半導体基板面に対してほぼ垂直状であり、前記タングステンシリサイド膜の線幅より大きいことを特徴とする請求項5に記載の半導体素子の製造方法。
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KR10-2005-0058741 | 2005-06-30 | ||
KR1020050058741A KR20070003021A (ko) | 2005-06-30 | 2005-06-30 | 반도체소자의 제조 방법 |
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JP2007013104A true JP2007013104A (ja) | 2007-01-18 |
JP5174328B2 JP5174328B2 (ja) | 2013-04-03 |
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JP (1) | JP5174328B2 (ja) |
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CN (1) | CN100440441C (ja) |
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JP2017208548A (ja) * | 2016-05-20 | 2017-11-24 | エスピーティーエス テクノロジーズ リミティド | ワークピースをプラズマエッチングする方法 |
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KR101429211B1 (ko) | 2008-01-30 | 2014-08-14 | 삼성전자주식회사 | 금속 실리사이드를 포함하는 트랜지스터 및 그 제조 방법,이를 이용한 반도체 소자 제조 방법. |
CN101740717B (zh) * | 2008-11-14 | 2014-09-03 | 复旦大学 | 一种CuxO基电阻型存储器及其制备方法 |
KR101983672B1 (ko) | 2012-11-07 | 2019-05-30 | 삼성전자 주식회사 | 반도체 장치의 제조 방법 |
Citations (7)
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JPH0621018A (ja) * | 1992-06-29 | 1994-01-28 | Sony Corp | ドライエッチング方法 |
JPH1041508A (ja) * | 1996-07-17 | 1998-02-13 | Sony Corp | 半導体装置およびその製造方法 |
JPH10135194A (ja) * | 1996-10-01 | 1998-05-22 | Applied Materials Inc | ハードマスクを用いてトランジスタゲートをエッチングする方法 |
JPH10135459A (ja) * | 1996-10-24 | 1998-05-22 | Samsung Electron Co Ltd | ポリサイドゲート電極及びその製造方法 |
JPH1145991A (ja) * | 1997-07-28 | 1999-02-16 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2000196087A (ja) * | 1998-12-29 | 2000-07-14 | Hyundai Electronics Ind Co Ltd | 半導体素子のゲ―ト電極形成方法 |
JP2002319569A (ja) * | 2001-04-19 | 2002-10-31 | Tokyo Electron Ltd | ドライエッチング方法 |
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KR950011983B1 (ko) * | 1992-11-23 | 1995-10-13 | 삼성전자주식회사 | 반도체 장치의 제조방법 |
KR100291512B1 (ko) | 1998-11-26 | 2001-11-05 | 박종섭 | 반도체 소자의 게이트 전극 형성방법 |
EP1113500B1 (en) * | 1999-12-31 | 2008-05-07 | STMicroelectronics S.r.l. | Process for manufacturing non-volatile memory cells |
KR20020013195A (ko) * | 2000-08-11 | 2002-02-20 | 윤종용 | 반도체 장치의 게이트 패턴 형성 방법 |
US6306715B1 (en) | 2001-01-08 | 2001-10-23 | Chartered Semiconductor Manufacturing Ltd. | Method to form smaller channel with CMOS device by isotropic etching of the gate materials |
KR20030057936A (ko) * | 2001-12-29 | 2003-07-07 | 주식회사 하이닉스반도체 | 반도체 소자의 게이트 형성방법 |
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JPH0621018A (ja) * | 1992-06-29 | 1994-01-28 | Sony Corp | ドライエッチング方法 |
JPH1041508A (ja) * | 1996-07-17 | 1998-02-13 | Sony Corp | 半導体装置およびその製造方法 |
JPH10135194A (ja) * | 1996-10-01 | 1998-05-22 | Applied Materials Inc | ハードマスクを用いてトランジスタゲートをエッチングする方法 |
JPH10135459A (ja) * | 1996-10-24 | 1998-05-22 | Samsung Electron Co Ltd | ポリサイドゲート電極及びその製造方法 |
JPH1145991A (ja) * | 1997-07-28 | 1999-02-16 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2000196087A (ja) * | 1998-12-29 | 2000-07-14 | Hyundai Electronics Ind Co Ltd | 半導体素子のゲ―ト電極形成方法 |
JP2002319569A (ja) * | 2001-04-19 | 2002-10-31 | Tokyo Electron Ltd | ドライエッチング方法 |
Cited By (1)
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JP2017208548A (ja) * | 2016-05-20 | 2017-11-24 | エスピーティーエス テクノロジーズ リミティド | ワークピースをプラズマエッチングする方法 |
Also Published As
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TWI322472B (en) | 2010-03-21 |
US7605069B2 (en) | 2009-10-20 |
CN100440441C (zh) | 2008-12-03 |
KR20070003021A (ko) | 2007-01-05 |
US20070004213A1 (en) | 2007-01-04 |
JP5174328B2 (ja) | 2013-04-03 |
CN1892989A (zh) | 2007-01-10 |
TW200701373A (en) | 2007-01-01 |
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