JP2007012856A5 - - Google Patents
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- Publication number
- JP2007012856A5 JP2007012856A5 JP2005191442A JP2005191442A JP2007012856A5 JP 2007012856 A5 JP2007012856 A5 JP 2007012856A5 JP 2005191442 A JP2005191442 A JP 2005191442A JP 2005191442 A JP2005191442 A JP 2005191442A JP 2007012856 A5 JP2007012856 A5 JP 2007012856A5
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- heat
- led
- light source
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 claims 4
- 230000005855 radiation Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005191442A JP2007012856A (ja) | 2005-06-30 | 2005-06-30 | Led装置及びled装置用筐体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005191442A JP2007012856A (ja) | 2005-06-30 | 2005-06-30 | Led装置及びled装置用筐体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012856A JP2007012856A (ja) | 2007-01-18 |
JP2007012856A5 true JP2007012856A5 (ko) | 2007-10-25 |
Family
ID=37750979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005191442A Withdrawn JP2007012856A (ja) | 2005-06-30 | 2005-06-30 | Led装置及びled装置用筐体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007012856A (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4973398B2 (ja) * | 2007-09-04 | 2012-07-11 | 東芝ライテック株式会社 | 発光装置及びこれを備えた照明装置 |
EP2293656B1 (en) | 2008-05-29 | 2012-12-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board |
JP2009295449A (ja) * | 2008-06-05 | 2009-12-17 | Toshiba Lighting & Technology Corp | 照明器具 |
JP5235105B2 (ja) * | 2008-06-23 | 2013-07-10 | パナソニック株式会社 | 発光装置 |
GB2464916B (en) | 2008-10-21 | 2013-07-31 | Iti Scotland Ltd | Light Guides |
GB2468411A (en) | 2009-03-05 | 2010-09-08 | Iti Scotland Ltd | Light guide with heat sink |
WO2010100504A1 (en) * | 2009-03-05 | 2010-09-10 | Iti Scotland Limited | Light guides |
US9146368B2 (en) * | 2012-08-31 | 2015-09-29 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for dissipating heat in optical communications modules |
JP6098457B2 (ja) | 2013-09-18 | 2017-03-22 | 株式会社デンソー | 点灯装置及び点灯装置を備えた灯具 |
CN104134740B (zh) * | 2014-07-15 | 2017-01-25 | 华南理工大学 | 一种结构一体化的led封装结构 |
JP2015073131A (ja) * | 2015-01-05 | 2015-04-16 | ローム株式会社 | Led発光体およびled電球 |
CN111692573B (zh) * | 2019-09-30 | 2022-02-25 | 长城汽车股份有限公司 | 照明装置以及车辆 |
CN114690338A (zh) * | 2020-12-30 | 2022-07-01 | 华为技术有限公司 | 发送光组件、双向光组件、光模块、及光通信设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03245586A (ja) * | 1990-02-23 | 1991-11-01 | Nec Corp | 光送信回路 |
JPH07131129A (ja) * | 1993-11-05 | 1995-05-19 | Nippon Telegr & Teleph Corp <Ntt> | 両面実装形マルチチップモジュール |
JPH10177068A (ja) * | 1996-12-19 | 1998-06-30 | Mitsubishi Electric Corp | 光学式車両感知器 |
JP3068488B2 (ja) * | 1997-03-13 | 2000-07-24 | 米沢日本電気株式会社 | プリント基板 |
JPH11318695A (ja) * | 1998-05-15 | 1999-11-24 | Toshiba Home Techno Corp | 家庭用加熱機器 |
JP4023054B2 (ja) * | 1999-12-07 | 2007-12-19 | 株式会社デンソー | 電子回路ユニット |
JP2001298290A (ja) * | 2000-04-13 | 2001-10-26 | Yazaki Corp | 電子ユニットボックスの放熱構造 |
JP2003165773A (ja) * | 2001-11-29 | 2003-06-10 | Kyocera Corp | 高誘電率ガラスセラミックス及びそれを用いた配線基板 |
JP2003178602A (ja) * | 2001-12-10 | 2003-06-27 | Koito Mfg Co Ltd | 照明装置 |
JP2003258465A (ja) * | 2002-03-04 | 2003-09-12 | Denso Corp | 電子回路ユニット |
JP2005150408A (ja) * | 2003-11-17 | 2005-06-09 | Sumitomo Electric Ind Ltd | 発光素子搭載用パッケージおよび光源装置 |
-
2005
- 2005-06-30 JP JP2005191442A patent/JP2007012856A/ja not_active Withdrawn
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