JP2007012856A5 - - Google Patents

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Publication number
JP2007012856A5
JP2007012856A5 JP2005191442A JP2005191442A JP2007012856A5 JP 2007012856 A5 JP2007012856 A5 JP 2007012856A5 JP 2005191442 A JP2005191442 A JP 2005191442A JP 2005191442 A JP2005191442 A JP 2005191442A JP 2007012856 A5 JP2007012856 A5 JP 2007012856A5
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JP
Japan
Prior art keywords
heat radiating
heat
led
light source
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005191442A
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Japanese (ja)
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JP2007012856A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005191442A priority Critical patent/JP2007012856A/en
Priority claimed from JP2005191442A external-priority patent/JP2007012856A/en
Publication of JP2007012856A publication Critical patent/JP2007012856A/en
Publication of JP2007012856A5 publication Critical patent/JP2007012856A5/ja
Withdrawn legal-status Critical Current

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Claims (4)

ＬＥＤ光源と、
ＬＥＤ駆動用デバイスと、
前記ＬＥＤ光源及び前記ＬＥＤ駆動用デバイスが実装されるプリント配線板であって、上面側に形成された導体パターンと、裏面側に形成された第１放熱部及び第２放熱部と、前記導体パターンにおける前記ＬＥＤ光源の実装領域から前記第１放熱部へと熱を伝導する第１伝熱部と、前記導体パターンにおける前記ＬＥＤ駆動用デバイスの実装領域から前記第２放熱部へと熱を伝導する第２伝熱部と、を備えたプリント配線板と、
前記ＬＥＤ光源及び前記ＬＥＤ駆動用デバイスが実装された前記プリント配線板を収納する筐体であって、該筐体は基板収納部とカバーから構成され、
前記基板収納部は、金属酸化物で表面被覆された粒子状の金属フィラーを含有する樹脂 からなる内側壁面に対して、前記第１放熱部及び前記第２放熱部が接触した状態で前記プリント配線板が固定されるとともに、前記プリント配線板が固定される領域の外側壁面に放熱用リブ状突起部を備えてなり、
前記筐体において、前記第１放熱部の接触部と前記第２放熱部の接触部との間に、前記 第２放熱部から前記第１放熱部への熱伝導を抑制する手段が備えられているＬＥＤ装置。An LED light source;
An LED driving device;
A printed wiring board on which the LED light source and the LED driving device are mounted, a conductor pattern formed on the upper surface side, a first heat radiation portion and a second heat radiation portion formed on the back surface side, and the conductor pattern Conducting heat from the LED light source mounting region to the first heat radiating unit in the first heat transfer unit, and conducting the heat from the LED driving device mounting region in the conductor pattern to the second heat radiating unit A printed wiring board comprising a second heat transfer section;
A housing for housing the printed wiring board on which the LED light source and the LED driving device are mounted, the housing comprising a substrate housing portion and a cover ;
The substrate storage unit, said printed circuit in a state in which the inner wall surface made of a resin containing a surface coated particulate filler metals with metal oxides, wherein the first heat radiating unit and the second heat radiating part are in contact A plate is fixed, and a rib-like protrusion for heat dissipation is provided on an outer wall surface of a region where the printed wiring board is fixed,
In the housing, means for suppressing heat conduction from the second heat radiating portion to the first heat radiating portion is provided between the contact portion of the first heat radiating portion and the contact portion of the second heat radiating portion. LED devices are. 前記導体パターンにおいて、前記ＬＥＤ光源が実装される領域と、前記ＬＥＤ駆動用デバイスの中の発熱体が実装される領域とが離間して形成されている請求項１に記載のＬＥＤ装置。2. The LED device according to claim 1 , wherein in the conductor pattern, a region where the LED light source is mounted and a region where a heating element in the LED driving device is mounted are formed apart from each other. 前記プリント配線板の表面に第３放熱部が形成されており、
前記第１放熱部及び前記第２放熱部に加えて、該第３放熱部が接触した状態で前記プリント配線板が前記筐体に固定されている、請求項２に記載のＬＥＤ装置。A third heat radiating portion is formed on the surface of the printed wiring board,
The LED device according to claim 2 , wherein the printed wiring board is fixed to the housing in a state where the third heat radiating portion is in contact with the first heat radiating portion and the second heat radiating portion. 前記カバーは、透光性の樹脂からなり、前記ＬＥＤ光源の光が該カバーを通って外部にThe cover is made of a translucent resin, and light from the LED light source passes through the cover to the outside. 照射する請求項３に記載のＬＥＤ装置。The LED device according to claim 3 which irradiates.
JP2005191442A 2005-06-30 2005-06-30 Led apparatus and housing therefor Withdrawn JP2007012856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191442A JP2007012856A (en) 2005-06-30 2005-06-30 Led apparatus and housing therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191442A JP2007012856A (en) 2005-06-30 2005-06-30 Led apparatus and housing therefor

Publications (2)

Publication Number Publication Date
JP2007012856A JP2007012856A (en) 2007-01-18
JP2007012856A5 true JP2007012856A5 (en) 2007-10-25

Family

ID=37750979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005191442A Withdrawn JP2007012856A (en) 2005-06-30 2005-06-30 Led apparatus and housing therefor

Country Status (1)

Country Link
JP (1) JP2007012856A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4973398B2 (en) * 2007-09-04 2012-07-11 東芝ライテック株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE HAVING THE SAME
CA2726173C (en) 2008-05-29 2016-02-23 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board
JP2009295449A (en) * 2008-06-05 2009-12-17 Toshiba Lighting & Technology Corp Luminaire
JP5235105B2 (en) * 2008-06-23 2013-07-10 パナソニック株式会社 Light emitting device
GB2464916B (en) 2008-10-21 2013-07-31 Iti Scotland Ltd Light Guides
CN102341734B (en) * 2009-03-05 2017-04-19 Iti苏格兰有限公司 Light guides
WO2010100505A1 (en) 2009-03-05 2010-09-10 Iti Scotland Limited Light guides
US9146368B2 (en) * 2012-08-31 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods and systems for dissipating heat in optical communications modules
JP6098457B2 (en) 2013-09-18 2017-03-22 株式会社デンソー Lighting device and lamp provided with the lighting device
CN104134740B (en) * 2014-07-15 2017-01-25 华南理工大学 Structurally integrated LED (Light Emitting Diode) packaging structure
JP2015073131A (en) * 2015-01-05 2015-04-16 ローム株式会社 Led light emitter and led bulb
CN111692573B (en) * 2019-09-30 2022-02-25 长城汽车股份有限公司 Lighting device and vehicle
CN114690338A (en) * 2020-12-30 2022-07-01 华为技术有限公司 Transmitting optical module, bidirectional optical module, and optical communication device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245586A (en) * 1990-02-23 1991-11-01 Nec Corp Optical transmission circuit
JPH07131129A (en) * 1993-11-05 1995-05-19 Nippon Telegr & Teleph Corp <Ntt> Double-side-mounted multichip module
JPH10177068A (en) * 1996-12-19 1998-06-30 Mitsubishi Electric Corp Optical vehicle sensor
JP3068488B2 (en) * 1997-03-13 2000-07-24 米沢日本電気株式会社 Printed board
JPH11318695A (en) * 1998-05-15 1999-11-24 Toshiba Home Techno Corp Household heater
JP4023054B2 (en) * 1999-12-07 2007-12-19 株式会社デンソー Electronic circuit unit
JP2001298290A (en) * 2000-04-13 2001-10-26 Yazaki Corp Heat radiation structure of electronic unit box
JP2003165773A (en) * 2001-11-29 2003-06-10 Kyocera Corp High dielectric constant glass ceramic and wiring board using the same
JP2003178602A (en) * 2001-12-10 2003-06-27 Koito Mfg Co Ltd Lighting system
JP2003258465A (en) * 2002-03-04 2003-09-12 Denso Corp Electronic circuit unit
JP2005150408A (en) * 2003-11-17 2005-06-09 Sumitomo Electric Ind Ltd Light source apparatus and package for mounting light emitting element

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