JP2008091817A5 - - Google Patents

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JP2008091817A5
JP2008091817A5 JP2006273796A JP2006273796A JP2008091817A5 JP 2008091817 A5 JP2008091817 A5 JP 2008091817A5 JP 2006273796 A JP2006273796 A JP 2006273796A JP 2006273796 A JP2006273796 A JP 2006273796A JP 2008091817 A5 JP2008091817 A5 JP 2008091817A5
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Prior art keywords
electronic device
electronic component
case
electronic
heat
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JP2006273796A
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Japanese (ja)
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JP2008091817A (en
JP4781961B2 (en
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Priority to JP2006273796A priority Critical patent/JP4781961B2/en
Priority claimed from JP2006273796A external-priority patent/JP4781961B2/en
Publication of JP2008091817A publication Critical patent/JP2008091817A/en
Publication of JP2008091817A5 publication Critical patent/JP2008091817A5/ja
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Claims (14)

発熱性のある電子部品が少なくとも１つは面実装されている回路基板と、
前記回路基板を収容する金属製のケースと、
前記電子部品の電極部と前記ケースとを熱的に接続するように配設される放熱部材とを備えることを特徴とする電子装置。 A circuit board on which at least one heat-generating electronic component is surface-mounted,
A metal case for housing the circuit board;
An electronic device comprising: a heat dissipating member disposed so as to thermally connect the electrode portion of the electronic component and the case. 前記放熱部材は、前記電子部品の電極部と前記ケースとに接触するように配設されることを特徴とする請求項１に記載の電子装置。   The electronic device according to claim 1, wherein the heat radiating member is disposed so as to be in contact with an electrode portion of the electronic component and the case. 前記放熱部材は、多面体になるように成形され、前記電子部品の電極部から発生する熱を、少なくとも１つの面から他の１つ以上の面を介して前記ケースに伝導するように配設されることを特徴とする請求項１又は２に記載の電子装置。 The heat dissipating member is formed to be a polyhedron, and is disposed so as to conduct heat generated from the electrode portion of the electronic component to the case from at least one surface through one or more other surfaces. The electronic device according to claim 1, wherein the electronic device is an electronic device. 前記放熱部材は、前記電子部品の電極部から発生する熱を、少なくとも１つの面から他の２つ以上の面を介して前記ケースに伝導するように配設されることを特徴とする請求項３に記載の電子装置。   The heat dissipating member is disposed so as to conduct heat generated from the electrode portion of the electronic component to the case from at least one surface through the other two or more surfaces. 3. The electronic device according to 3. 前記放熱部材は、上面の高さが前記電子部品の上端と同じ又はそれより下になるように成形され、前記電子部品の電極部から発生する熱を、側面を介して前記ケースに伝導するように配設され、
前記電子部品は、内部から発生する熱を、上端を介して前記ケースに伝導するように配設されることを特徴とする請求項３又は４に記載の電子装置。 The heat dissipating member is shaped such that the height of the upper surface is the same as or lower than the upper end of the electronic component, and conducts heat generated from the electrode part of the electronic component to the case via the side surface. Arranged in
The electronic device according to claim 3 , wherein the electronic component is disposed so as to conduct heat generated from the inside to the case through an upper end. 前記ケースは、前記電子部品の上端に対向する面の一部分が前記電子部品の上端に接触するように、又は、前記電子部品の上端に対向する面の一部分が他の部分より前記電子部品の上端に接近するように成形されることを特徴とする請求項５に記載の電子装置。   In the case, a part of the surface facing the upper end of the electronic component is in contact with the upper end of the electronic component, or a part of the surface facing the upper end of the electronic component is higher than the other end of the electronic component. The electronic device according to claim 5, wherein the electronic device is shaped so as to approach the head. 前記放熱部材は、上面の高さが前記電子部品の上端と同じ又はそれより上になるように成形され、前記電子部品の電極部から発生する熱を、上面を介して前記ケースに伝導するように配設されることを特徴とする請求項３又は４に記載の電子装置。 The heat dissipating member is formed so that the height of the upper surface is the same as or higher than the upper end of the electronic component, and conducts heat generated from the electrode part of the electronic component to the case through the upper surface. The electronic device according to claim 3, wherein the electronic device is disposed on the electronic device. 前記ケースは、前記放熱部材の上面に対向する面の一部分が前記放熱部材の上面に接触するように、又は、前記放熱部材の上面に対向する面の一部分が他の部分より前記放熱部材の上面に接近するように成形されることを特徴とする請求項７に記載の電子装置。   In the case, a part of the surface facing the upper surface of the heat radiating member is in contact with the upper surface of the heat radiating member, or a part of the surface facing the upper surface of the heat radiating member is higher than the upper surface of the heat radiating member. The electronic device according to claim 7, wherein the electronic device is shaped so as to approach the head. 前記電子装置は、さらに、
前記回路基板と前記ケースとを電気的に絶縁するように配設される絶縁部材を備え、
前記放熱部材は、前記電子部品の電極部から発生する熱を、前記絶縁部材を介して前記ケースに伝導するように配設されることを特徴とする請求項１から８までのいずれかに記載の電子装置。 The electronic device further includes:
An insulating member disposed to electrically insulate the circuit board and the case;
The heat radiation member, according to any of the heat generated from the electrode portions of the electronic component from Claim 1 through the insulating member, characterized in that it is arranged to conduct the case to 8 Electronic devices. 前記電子装置は、さらに、
前記回路基板と前記ケースとを電気的に絶縁するように配設される絶縁部材を備え、
前記絶縁部材は、前記放熱部材が前記ケースに接触するように前記放熱部材を貫通させる開口部を有することを特徴とする請求項１から８までのいずれかに記載の電子装置。 The electronic device further includes:
An insulating member disposed to electrically insulate the circuit board and the case;
Said insulating member is an electronic device according to claim 1, wherein the heat radiating member and having an opening through which the said heat radiating member so as to be in contact with the case to 8. 前記回路基板には、発熱性のある電子部品が２つ以上は面実装されており、
前記放熱部材は、そのうち少なくとも２つの電子部品の電極部と前記ケースとを熱的に接続するように配設されることを特徴とする請求項１から１０までのいずれかに記載の電子装置。 Two or more heat generating electronic components are surface-mounted on the circuit board,
The heat radiating member, an electronic device according to any one of the them at least two electrodes of the electronic component part and the casing from claim 1, characterized in that it is arranged to thermally connected to 10. 前記電子装置は、さらに、
前記電子部品の電極部以外の少なくとも一部分と前記ケースとを熱的に接続するように配設される緩衝部材を備えることを特徴とする請求項１から１１までのいずれかに記載の電子装置。 The electronic device further includes:
The electronic device according to any one of the electronic component at least a portion and the case of other than the electrode portions of claims 1, characterized in that it comprises a buffer member disposed so as to be connected thermally to 11. 前記放熱部材は、シリコン樹脂又はアクリル樹脂で形成されることを特徴とする請求項１から１２までのいずれかに記載の電子装置。 The heat radiating member, an electronic device according to claim 1, characterized in that it is formed of silicon resin or acrylic resin to 12. ランプを有する照明器具本体と、
前記電子部品として、前記ランプを点灯するための電子部品を前記回路基板に面実装する請求項１から１３までのいずれかに記載の電子装置とを備えることを特徴とする照明器具。 A lighting fixture body having a lamp ;
Wherein as the electronic component, a luminaire, characterized in that it comprises an electronic device according to any one of the electronic components for lighting the lamp from claim 1 surface-mounted on the circuit board to 13.
JP2006273796A 2006-10-05 2006-10-05 Electronic device and lighting apparatus Active JP4781961B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (en) 2006-10-05 2006-10-05 Electronic device and lighting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (en) 2006-10-05 2006-10-05 Electronic device and lighting apparatus

Publications (3)

Publication Number Publication Date
JP2008091817A JP2008091817A (en) 2008-04-17
JP2008091817A5 true JP2008091817A5 (en) 2009-11-12
JP4781961B2 JP4781961B2 (en) 2011-09-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006273796A Active JP4781961B2 (en) 2006-10-05 2006-10-05 Electronic device and lighting apparatus

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5343542B2 (en) * 2008-12-08 2013-11-13 三菱電機株式会社 Lighting device and lighting fixture provided with the lighting device
KR101229656B1 (en) * 2011-08-24 2013-02-04 김근배 Radiate structure of switching mode power supply using the same
KR20130099313A (en) * 2012-02-29 2013-09-06 엘지이노텍 주식회사 Lighting device
JP6200693B2 (en) * 2013-05-24 2017-09-20 日立オートモティブシステムズ株式会社 Electronic control unit
JP2013254742A (en) * 2013-07-30 2013-12-19 Mitsubishi Electric Corp Lighting device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567974B2 (en) * 1990-06-30 1996-12-25 株式会社テック Discharge lamp lighting device
JPH1065385A (en) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp Substrate case structure
JPH10224065A (en) * 1997-02-05 1998-08-21 Japan Servo Co Ltd Heat radiating structure of electronic circuit
JPH10308484A (en) * 1997-05-08 1998-11-17 Casio Comput Co Ltd Heat radiation structure of electronic apparatus
JPH11213737A (en) * 1998-01-22 1999-08-06 Toshiba Tec Corp Discharge lamp equipment
JP4200876B2 (en) * 2003-10-28 2008-12-24 株式会社明電舎 Electronic equipment cooling structure

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