JP2006517351A5 - - Google Patents

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Publication number
JP2006517351A5
JP2006517351A5 JP2006503362A JP2006503362A JP2006517351A5 JP 2006517351 A5 JP2006517351 A5 JP 2006517351A5 JP 2006503362 A JP2006503362 A JP 2006503362A JP 2006503362 A JP2006503362 A JP 2006503362A JP 2006517351 A5 JP2006517351 A5 JP 2006517351A5
Authority
JP
Japan
Prior art keywords
vacuum
wafer
vacuum chuck
semiconductor wafer
holding region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006503362A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006517351A (ja
Filing date
Publication date
Priority claimed from US10/359,965 external-priority patent/US20040154647A1/en
Application filed filed Critical
Publication of JP2006517351A publication Critical patent/JP2006517351A/ja
Publication of JP2006517351A5 publication Critical patent/JP2006517351A5/ja
Pending legal-status Critical Current

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JP2006503362A 2003-02-07 2004-02-06 高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置 Pending JP2006517351A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/359,965 US20040154647A1 (en) 2003-02-07 2003-02-07 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
PCT/US2004/003395 WO2004073028A2 (en) 2003-02-07 2004-02-06 Method and apparatus for holding a substrate during high pressure processing

Publications (2)

Publication Number Publication Date
JP2006517351A JP2006517351A (ja) 2006-07-20
JP2006517351A5 true JP2006517351A5 (https=) 2007-03-29

Family

ID=32823898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006503362A Pending JP2006517351A (ja) 2003-02-07 2004-02-06 高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置

Country Status (5)

Country Link
US (1) US20040154647A1 (https=)
EP (1) EP1590827A2 (https=)
JP (1) JP2006517351A (https=)
TW (1) TW200415742A (https=)
WO (1) WO2004073028A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
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CN102760666A (zh) * 2012-07-05 2012-10-31 西安永电电气有限责任公司 用于igbt的键合真空吸附工装
JP2015109360A (ja) * 2013-12-05 2015-06-11 東京エレクトロン株式会社 基板保持機構及び剥離システム
CN106625330B (zh) * 2016-12-02 2018-05-01 佛山市顺德区银美精工五金科技有限公司 一种双层结构真空吸台
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

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