JP2006517351A - 高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置 - Google Patents

高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置 Download PDF

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Publication number
JP2006517351A
JP2006517351A JP2006503362A JP2006503362A JP2006517351A JP 2006517351 A JP2006517351 A JP 2006517351A JP 2006503362 A JP2006503362 A JP 2006503362A JP 2006503362 A JP2006503362 A JP 2006503362A JP 2006517351 A JP2006517351 A JP 2006517351A
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JP
Japan
Prior art keywords
vacuum
wafer
semiconductor wafer
vacuum chuck
holding region
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006503362A
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English (en)
Japanese (ja)
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JP2006517351A5 (https=
Inventor
シェイダイ，アレクセイ
ヒルマン，ジョー
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JP2006517351A publication Critical patent/JP2006517351A/ja
Publication of JP2006517351A5 publication Critical patent/JP2006517351A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2006503362A 2003-02-07 2004-02-06 高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置 Pending JP2006517351A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/359,965 US20040154647A1 (en) 2003-02-07 2003-02-07 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
PCT/US2004/003395 WO2004073028A2 (en) 2003-02-07 2004-02-06 Method and apparatus for holding a substrate during high pressure processing

Publications (2)

Publication Number Publication Date
JP2006517351A true JP2006517351A (ja) 2006-07-20
JP2006517351A5 JP2006517351A5 (https=) 2007-03-29

Family

ID=32823898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006503362A Pending JP2006517351A (ja) 2003-02-07 2004-02-06 高圧処理の間に半導体基板を強固に保持するためにコーティングを用いる方法および装置

Country Status (5)

Country Link
US (1) US20040154647A1 (https=)
EP (1) EP1590827A2 (https=)
JP (1) JP2006517351A (https=)
TW (1) TW200415742A (https=)
WO (1) WO2004073028A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109360A (ja) * 2013-12-05 2015-06-11 東京エレクトロン株式会社 基板保持機構及び剥離システム
JP2016508676A (ja) * 2013-02-28 2016-03-22 ワトロー エレクトリック マニュファクチュアリング カンパニー 低熱膨張係数の上部を備えたワーク受台構造

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
CN102760666A (zh) * 2012-07-05 2012-10-31 西安永电电气有限责任公司 用于igbt的键合真空吸附工装
CN106625330B (zh) * 2016-12-02 2018-05-01 佛山市顺德区银美精工五金科技有限公司 一种双层结构真空吸台
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283511A (ja) * 1992-03-31 1993-10-29 Nippon Telegr & Teleph Corp <Ntt> 真空吸着装置
US5374829A (en) * 1990-05-07 1994-12-20 Canon Kabushiki Kaisha Vacuum chuck
JPH11243135A (ja) * 1998-02-26 1999-09-07 Kyocera Corp 真空吸着盤
JPH11260896A (ja) * 1998-03-13 1999-09-24 Okamoto Machine Tool Works Ltd ウエハのチャック機構
JP2000332087A (ja) * 1999-05-25 2000-11-30 Sony Corp 基板吸着装置

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2128426B1 (https=) * 1971-03-02 1980-03-07 Cnen
US3890176A (en) * 1972-08-18 1975-06-17 Gen Electric Method for removing photoresist from substrate
US4341592A (en) * 1975-08-04 1982-07-27 Texas Instruments Incorporated Method for removing photoresist layer from substrate by ozone treatment
US4029517A (en) * 1976-03-01 1977-06-14 Autosonics Inc. Vapor degreasing system having a divider wall between upper and lower vapor zone portions
US4091643A (en) * 1976-05-14 1978-05-30 Ama Universal S.P.A. Circuit for the recovery of solvent vapor evolved in the course of a cleaning cycle in dry-cleaning machines or plants, and for the de-pressurizing of such machines
US4346578A (en) * 1976-12-30 1982-08-31 Harrison Nelson K Extrusion press and method
US4219333A (en) * 1978-07-03 1980-08-26 Harris Robert D Carbonated cleaning solution
FR2536433A1 (fr) * 1982-11-19 1984-05-25 Privat Michel Procede et installation de nettoyage et decontamination particulaire de vetements, notamment de vetements contamines par des particules radioactives
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
US4718049A (en) * 1986-01-23 1988-01-05 Western Atlas International, Inc. Pre-loaded vibrator assembly with mechanical lock
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
JPS63210148A (ja) * 1987-02-26 1988-08-31 Nikko Rika Kk 真空チヤツク用プラスチツクス焼結体
DE3725565A1 (de) * 1987-08-01 1989-02-16 Peter Weil Verfahren und anlage zum entlacken von gegenstaenden mit einem tauchbehaelter mit loesungsmittel
US5105556A (en) * 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
US4838476A (en) * 1987-11-12 1989-06-13 Fluocon Technologies Inc. Vapour phase treatment process and apparatus
US4933404A (en) * 1987-11-27 1990-06-12 Battelle Memorial Institute Processes for microemulsion polymerization employing novel microemulsion systems
JP2663483B2 (ja) * 1988-02-29 1997-10-15 勝 西川 レジストパターン形成方法
US5185296A (en) * 1988-07-26 1993-02-09 Matsushita Electric Industrial Co., Ltd. Method for forming a dielectric thin film or its pattern of high accuracy on a substrate
DE3837298C1 (https=) * 1988-11-03 1990-03-29 Fresenius Ag, 6380 Bad Homburg, De
US5013366A (en) * 1988-12-07 1991-05-07 Hughes Aircraft Company Cleaning process using phase shifting of dense phase gases
US5051135A (en) * 1989-01-30 1991-09-24 Kabushiki Kaisha Tiyoda Seisakusho Cleaning method using a solvent while preventing discharge of solvent vapors to the environment
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
US5288333A (en) * 1989-05-06 1994-02-22 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method and apparatus therefore
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US4923828A (en) * 1989-07-07 1990-05-08 Eastman Kodak Company Gaseous cleaning method for silicon devices
US4983223A (en) * 1989-10-24 1991-01-08 Chenpatents Apparatus and method for reducing solvent vapor losses
US5213619A (en) * 1989-11-30 1993-05-25 Jackson David P Processes for cleaning, sterilizing, and implanting materials using high energy dense fluids
US5370741A (en) * 1990-05-15 1994-12-06 Semitool, Inc. Dynamic semiconductor wafer processing using homogeneous chemical vapors
US5306350A (en) * 1990-12-21 1994-04-26 Union Carbide Chemicals & Plastics Technology Corporation Methods for cleaning apparatus using compressed fluids
EP0496605B1 (en) * 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Surface treating solutions for semiconductors
US5185058A (en) * 1991-01-29 1993-02-09 Micron Technology, Inc. Process for etching semiconductor devices
US5201960A (en) * 1991-02-04 1993-04-13 Applied Photonics Research, Inc. Method for removing photoresist and other adherent materials from substrates
US5730874A (en) * 1991-06-12 1998-03-24 Idaho Research Foundation, Inc. Extraction of metals using supercritical fluid and chelate forming legand
US5225173A (en) * 1991-06-12 1993-07-06 Idaho Research Foundation, Inc. Methods and devices for the separation of radioactive rare earth metal isotopes from their alkaline earth metal precursors
US5320742A (en) * 1991-08-15 1994-06-14 Mobil Oil Corporation Gasoline upgrading process
US5431843A (en) * 1991-09-04 1995-07-11 The Clorox Company Cleaning through perhydrolysis conducted in dense fluid medium
GB2259525B (en) * 1991-09-11 1995-06-28 Ciba Geigy Ag Process for dyeing cellulosic textile material with disperse dyes
KR930019861A (ko) * 1991-12-12 1993-10-19 완다 케이. 덴슨-로우 조밀상 기체를 이용한 코팅 방법
EP1172383B1 (en) * 1992-03-27 2008-04-16 University Of North Carolina At Chapel Hill Method of making fluoropolymers
US5313965A (en) * 1992-06-01 1994-05-24 Hughes Aircraft Company Continuous operation supercritical fluid treatment process and system
JPH0613361A (ja) * 1992-06-26 1994-01-21 Tokyo Electron Ltd 処理装置
US5401322A (en) * 1992-06-30 1995-03-28 Southwest Research Institute Apparatus and method for cleaning articles utilizing supercritical and near supercritical fluids
US5267455A (en) * 1992-07-13 1993-12-07 The Clorox Company Liquid/supercritical carbon dioxide dry cleaning system
US5316591A (en) * 1992-08-10 1994-05-31 Hughes Aircraft Company Cleaning by cavitation in liquefied gas
US5355901A (en) * 1992-10-27 1994-10-18 Autoclave Engineers, Ltd. Apparatus for supercritical cleaning
US5294261A (en) * 1992-11-02 1994-03-15 Air Products And Chemicals, Inc. Surface cleaning using an argon or nitrogen aerosol
US5328722A (en) * 1992-11-06 1994-07-12 Applied Materials, Inc. Metal chemical vapor deposition process using a shadow ring
US5514220A (en) * 1992-12-09 1996-05-07 Wetmore; Paula M. Pressure pulse cleaning
US5403665A (en) * 1993-06-18 1995-04-04 Regents Of The University Of California Method of applying a monolayer lubricant to micromachines
US5312882A (en) * 1993-07-30 1994-05-17 The University Of North Carolina At Chapel Hill Heterogeneous polymerization in carbon dioxide
US5377705A (en) * 1993-09-16 1995-01-03 Autoclave Engineers, Inc. Precision cleaning system
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
US5509431A (en) * 1993-12-14 1996-04-23 Snap-Tite, Inc. Precision cleaning vessel
US5641887A (en) * 1994-04-01 1997-06-24 University Of Pittsburgh Extraction of metals in carbon dioxide and chelating agents therefor
US5872257A (en) * 1994-04-01 1999-02-16 University Of Pittsburgh Further extractions of metals in carbon dioxide and chelating agents therefor
EP0681317B1 (en) * 1994-04-08 2001-10-17 Texas Instruments Incorporated Method for cleaning semiconductor wafers using liquefied gases
JP3320549B2 (ja) * 1994-04-26 2002-09-03 岩手東芝エレクトロニクス株式会社 被膜除去方法および被膜除去剤
KR0137841B1 (ko) * 1994-06-07 1998-04-27 문정환 식각잔류물 제거방법
US5482564A (en) * 1994-06-21 1996-01-09 Texas Instruments Incorporated Method of unsticking components of micro-mechanical devices
US5637151A (en) * 1994-06-27 1997-06-10 Siemens Components, Inc. Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
US5522938A (en) * 1994-08-08 1996-06-04 Texas Instruments Incorporated Particle removal in supercritical liquids using single frequency acoustic waves
US5501761A (en) * 1994-10-18 1996-03-26 At&T Corp. Method for stripping conformal coatings from circuit boards
US5505219A (en) * 1994-11-23 1996-04-09 Litton Systems, Inc. Supercritical fluid recirculating system for a precision inertial instrument parts cleaner
US5629918A (en) * 1995-01-20 1997-05-13 The Regents Of The University Of California Electromagnetically actuated micromachined flap
US5681398A (en) * 1995-03-17 1997-10-28 Purex Co., Ltd. Silicone wafer cleaning method
JPH08330266A (ja) * 1995-05-31 1996-12-13 Texas Instr Inc <Ti> 半導体装置等の表面を浄化し、処理する方法
US5783082A (en) * 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
US5726211A (en) * 1996-03-21 1998-03-10 International Business Machines Corporation Process for making a foamed elastometric polymer
US6264752B1 (en) * 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US5868856A (en) * 1996-07-25 1999-02-09 Texas Instruments Incorporated Method for removing inorganic contamination by chemical derivitization and extraction
US5868862A (en) * 1996-08-01 1999-02-09 Texas Instruments Incorporated Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media
US5881577A (en) * 1996-09-09 1999-03-16 Air Liquide America Corporation Pressure-swing absorption based cleaning methods and systems
US5908510A (en) * 1996-10-16 1999-06-01 International Business Machines Corporation Residue removal by supercritical fluids
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
US5888050A (en) * 1996-10-30 1999-03-30 Supercritical Fluid Technologies, Inc. Precision high pressure control assembly
JPH10144757A (ja) * 1996-11-08 1998-05-29 Dainippon Screen Mfg Co Ltd 基板処理システム
JP3437734B2 (ja) * 1997-02-26 2003-08-18 富士通株式会社 製造装置
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
US6284360B1 (en) * 1997-09-30 2001-09-04 3M Innovative Properties Company Sealant composition, article including same, and method of using same
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6423642B1 (en) * 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US6242165B1 (en) * 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same
US6548411B2 (en) * 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6250216B1 (en) * 1999-03-19 2001-06-26 The Minster Machine Company Press deflection controller and method of controlling press deflection
US7044143B2 (en) * 1999-05-14 2006-05-16 Micell Technologies, Inc. Detergent injection systems and methods for carbon dioxide microelectronic substrate processing systems
US6228563B1 (en) * 1999-09-17 2001-05-08 Gasonics International Corporation Method and apparatus for removing post-etch residues and other adherent matrices
US7250374B2 (en) * 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374829A (en) * 1990-05-07 1994-12-20 Canon Kabushiki Kaisha Vacuum chuck
JPH05283511A (ja) * 1992-03-31 1993-10-29 Nippon Telegr & Teleph Corp <Ntt> 真空吸着装置
JPH11243135A (ja) * 1998-02-26 1999-09-07 Kyocera Corp 真空吸着盤
JPH11260896A (ja) * 1998-03-13 1999-09-24 Okamoto Machine Tool Works Ltd ウエハのチャック機構
JP2000332087A (ja) * 1999-05-25 2000-11-30 Sony Corp 基板吸着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016508676A (ja) * 2013-02-28 2016-03-22 ワトロー エレクトリック マニュファクチュアリング カンパニー 低熱膨張係数の上部を備えたワーク受台構造
JP2015109360A (ja) * 2013-12-05 2015-06-11 東京エレクトロン株式会社 基板保持機構及び剥離システム

Also Published As

Publication number Publication date
US20040154647A1 (en) 2004-08-12
WO2004073028A2 (en) 2004-08-26
EP1590827A2 (en) 2005-11-02
TW200415742A (en) 2004-08-16
WO2004073028A3 (en) 2005-01-20

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