TW200415742A - Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing - Google Patents

Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing Download PDF

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Publication number
TW200415742A
TW200415742A TW093102820A TW93102820A TW200415742A TW 200415742 A TW200415742 A TW 200415742A TW 093102820 A TW093102820 A TW 093102820A TW 93102820 A TW93102820 A TW 93102820A TW 200415742 A TW200415742 A TW 200415742A
Authority
TW
Taiwan
Prior art keywords
wafer
vacuum
holding area
vacuum chuck
semiconductor
Prior art date
Application number
TW093102820A
Other languages
English (en)
Chinese (zh)
Inventor
Alexei Sheydayi
Joe Hillman
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200415742A publication Critical patent/TW200415742A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW093102820A 2003-02-07 2004-02-06 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing TW200415742A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/359,965 US20040154647A1 (en) 2003-02-07 2003-02-07 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing

Publications (1)

Publication Number Publication Date
TW200415742A true TW200415742A (en) 2004-08-16

Family

ID=32823898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102820A TW200415742A (en) 2003-02-07 2004-02-06 Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing

Country Status (5)

Country Link
US (1) US20040154647A1 (https=)
EP (1) EP1590827A2 (https=)
JP (1) JP2006517351A (https=)
TW (1) TW200415742A (https=)
WO (1) WO2004073028A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760666A (zh) * 2012-07-05 2012-10-31 西安永电电气有限责任公司 用于igbt的键合真空吸附工装

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US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
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CN106625330B (zh) * 2016-12-02 2018-05-01 佛山市顺德区银美精工五金科技有限公司 一种双层结构真空吸台
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760666A (zh) * 2012-07-05 2012-10-31 西安永电电气有限责任公司 用于igbt的键合真空吸附工装

Also Published As

Publication number Publication date
US20040154647A1 (en) 2004-08-12
WO2004073028A2 (en) 2004-08-26
EP1590827A2 (en) 2005-11-02
WO2004073028A3 (en) 2005-01-20
JP2006517351A (ja) 2006-07-20

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