JP2006516068A - 発熱デバイスにおける温度均一性及びホットスポット冷却を実現する方法及び装置 - Google Patents

発熱デバイスにおける温度均一性及びホットスポット冷却を実現する方法及び装置 Download PDF

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Publication number
JP2006516068A
JP2006516068A JP2005502253A JP2005502253A JP2006516068A JP 2006516068 A JP2006516068 A JP 2006516068A JP 2005502253 A JP2005502253 A JP 2005502253A JP 2005502253 A JP2005502253 A JP 2005502253A JP 2006516068 A JP2006516068 A JP 2006516068A
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Prior art keywords
fluid
heat
heat exchanger
heat source
microns
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Pending
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JP2005502253A
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English (en)
Japanese (ja)
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JP2006516068A5 (enExample
Inventor
グッドソン、ケニス
ケニー、トーマス
ゾウ、パン
ウパダヤ、ギリッシュ
ムンチ、マーク
マックマスター、マーク
ホム、ジェームズ
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クーリギー インコーポレイテッド
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Publication of JP2006516068A publication Critical patent/JP2006516068A/ja
Publication of JP2006516068A5 publication Critical patent/JP2006516068A5/ja
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2005502253A 2002-11-01 2003-10-30 発熱デバイスにおける温度均一性及びホットスポット冷却を実現する方法及び装置 Pending JP2006516068A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42300902P 2002-11-01 2002-11-01
US44238303P 2003-01-24 2003-01-24
US45572903P 2003-03-17 2003-03-17
US46224503P 2003-04-11 2003-04-11
PCT/US2003/034874 WO2004042306A2 (en) 2002-11-01 2003-10-30 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Publications (2)

Publication Number Publication Date
JP2006516068A true JP2006516068A (ja) 2006-06-15
JP2006516068A5 JP2006516068A5 (enExample) 2006-12-21

Family

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Family Applications (1)

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JP2005502253A Pending JP2006516068A (ja) 2002-11-01 2003-10-30 発熱デバイスにおける温度均一性及びホットスポット冷却を実現する方法及び装置

Country Status (6)

Country Link
US (1) US7104312B2 (enExample)
JP (1) JP2006516068A (enExample)
AU (1) AU2003286855A1 (enExample)
DE (1) DE10393618T5 (enExample)
TW (1) TWI295726B (enExample)
WO (1) WO2004042306A2 (enExample)

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JP2006049861A (ja) * 2004-06-29 2006-02-16 Cooligy Inc マイクロチャネル熱交換器における圧力降下を低減するための互いに組み合うマニホルド
JP2006054434A (ja) * 2004-06-29 2006-02-23 Cooligy Inc 熱を発生するデバイスにおける所望のホットスポットを冷却するための柔軟な流体輸送のための方法及び装置
JP2006086503A (ja) * 2004-06-29 2006-03-30 Cooligy Inc 発熱デバイスを冷却するための効率的な垂直流体輸送のための方法及び装置
JP2008502137A (ja) * 2004-06-04 2008-01-24 クーリギー インコーポレイテッド 冷却方法及び組立体
KR20150032216A (ko) * 2013-09-17 2015-03-25 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 집적 회로 칩 냉각 디바이스
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