JP2006510807A5 - - Google Patents
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- Publication number
- JP2006510807A5 JP2006510807A5 JP2004564819A JP2004564819A JP2006510807A5 JP 2006510807 A5 JP2006510807 A5 JP 2006510807A5 JP 2004564819 A JP2004564819 A JP 2004564819A JP 2004564819 A JP2004564819 A JP 2004564819A JP 2006510807 A5 JP2006510807 A5 JP 2006510807A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- group
- carbon atoms
- providing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000002904 solvent Substances 0.000 claims 5
- 125000002015 acyclic group Chemical group 0.000 claims 4
- 125000004122 cyclic group Chemical group 0.000 claims 4
- 125000005842 heteroatom Chemical group 0.000 claims 4
- 229910052757 nitrogen Inorganic materials 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- 229910052760 oxygen Inorganic materials 0.000 claims 4
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims 4
- 150000003460 sulfonic acids Chemical class 0.000 claims 4
- 229910052717 sulfur Inorganic materials 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 2
- 150000007513 acids Chemical class 0.000 claims 2
- 229910052789 astatine Inorganic materials 0.000 claims 2
- 239000002738 chelating agent Substances 0.000 claims 2
- 238000005260 corrosion Methods 0.000 claims 2
- 230000007797 corrosion Effects 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- 238000007792 addition Methods 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 150000001879 copper Chemical class 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/320,254 US6858124B2 (en) | 2002-12-16 | 2002-12-16 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| PCT/US2003/033878 WO2004061027A1 (en) | 2002-12-16 | 2003-10-24 | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006510807A JP2006510807A (ja) | 2006-03-30 |
| JP2006510807A5 true JP2006510807A5 (enExample) | 2006-12-07 |
Family
ID=32506832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004564819A Pending JP2006510807A (ja) | 2002-12-16 | 2003-10-24 | 銅配線および／またはフィルムを研磨および／または洗浄する方法およびそのための組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6858124B2 (enExample) |
| EP (1) | EP1572820A1 (enExample) |
| JP (1) | JP2006510807A (enExample) |
| KR (1) | KR20050085663A (enExample) |
| CN (1) | CN100341122C (enExample) |
| AU (1) | AU2003284355A1 (enExample) |
| WO (1) | WO2004061027A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7129160B2 (en) * | 2002-08-29 | 2006-10-31 | Micron Technology, Inc. | Method for simultaneously removing multiple conductive materials from microelectronic substrates |
| US7078308B2 (en) | 2002-08-29 | 2006-07-18 | Micron Technology, Inc. | Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate |
| US7112121B2 (en) * | 2000-08-30 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate |
| US7134934B2 (en) * | 2000-08-30 | 2006-11-14 | Micron Technology, Inc. | Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium |
| US7220166B2 (en) * | 2000-08-30 | 2007-05-22 | Micron Technology, Inc. | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| US7153195B2 (en) | 2000-08-30 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
| US7192335B2 (en) * | 2002-08-29 | 2007-03-20 | Micron Technology, Inc. | Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| US7112122B2 (en) * | 2003-09-17 | 2006-09-26 | Micron Technology, Inc. | Methods and apparatus for removing conductive material from a microelectronic substrate |
| US7153777B2 (en) | 2004-02-20 | 2006-12-26 | Micron Technology, Inc. | Methods and apparatuses for electrochemical-mechanical polishing |
| US7294610B2 (en) * | 2004-03-03 | 2007-11-13 | 3M Innovative Properties Company | Fluorinated sulfonamide surfactants for aqueous cleaning solutions |
| US7566391B2 (en) * | 2004-09-01 | 2009-07-28 | Micron Technology, Inc. | Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media |
| US7374621B2 (en) * | 2006-02-09 | 2008-05-20 | Hitachi Global Storage Technologies Netherlands Bv | System and method for cleaning chemistry and processing during thin film magnetic head wafer fabrication |
| US8288330B2 (en) * | 2006-05-26 | 2012-10-16 | Air Products And Chemicals, Inc. | Composition and method for photoresist removal |
| JP5558067B2 (ja) * | 2008-10-15 | 2014-07-23 | 三菱マテリアル株式会社 | エーテル構造を有するペルフルオロスルホン酸及びその誘導体の製造方法、並びに含フッ素エーテルスルホン酸化合物及びその誘導体を含む界面活性剤 |
| US7977426B2 (en) * | 2008-11-13 | 2011-07-12 | E. I. Du Pont De Nemours And Company | Fluoroalkyl ether sulfonate surfactants |
| CN102686559A (zh) * | 2009-09-29 | 2012-09-19 | 三菱综合材料株式会社 | 具有醚结构的全氟磺酸及其衍生物的制备方法以及含有含氟醚磺酸化合物及其衍生物的表面活性剂 |
| SG192574A1 (en) * | 2011-03-11 | 2013-09-30 | Fujifilm Electronic Materials | Novel etching composition |
| JP6395246B2 (ja) * | 2013-01-11 | 2018-09-26 | 三菱マテリアル電子化成株式会社 | フッ素系界面活性剤及びその製造方法 |
| JP6358740B2 (ja) * | 2014-04-08 | 2018-07-18 | 山口精研工業株式会社 | 研磨用組成物 |
| CN105802747B (zh) * | 2016-04-15 | 2018-11-09 | 林淑录 | 一种太阳能光伏电池硅片制绒后清洗用的清洗剂 |
| US11193059B2 (en) | 2016-12-13 | 2021-12-07 | Current Lighting Solutions, Llc | Processes for preparing color stable red-emitting phosphor particles having small particle size |
| CA3098556A1 (en) * | 2018-04-27 | 2019-10-31 | W.M. Barr & Company, Inc. | Paint remover having reduced flammability |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0419845A3 (en) | 1989-09-05 | 1991-11-13 | General Electric Company | Method for preparing metallized polyimide composites |
| JP3353359B2 (ja) * | 1993-01-06 | 2002-12-03 | 三菱化学株式会社 | 低表面張力硫酸組成物 |
| DE4333385C2 (de) | 1993-09-30 | 1997-01-30 | Friedrich A Spruegel | Flächendesinfektions- und Reinigungsmittel |
| US5340370A (en) | 1993-11-03 | 1994-08-23 | Intel Corporation | Slurries for chemical mechanical polishing |
| US6194317B1 (en) | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| US6130161A (en) | 1997-05-30 | 2000-10-10 | International Business Machines Corporation | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity |
| JPH1192754A (ja) | 1997-09-24 | 1999-04-06 | Cci Corp | ガラス用撥水処理剤 |
| JP2001526451A (ja) | 1997-12-10 | 2001-12-18 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 電気化学系中のビス（ペルフルオロアルキルスルホニル）イミド界面活性剤塩 |
| TWI223678B (en) | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
| US6197696B1 (en) | 1998-03-26 | 2001-03-06 | Matsushita Electric Industrial Co., Ltd. | Method for forming interconnection structure |
| US6287977B1 (en) | 1998-07-31 | 2001-09-11 | Applied Materials, Inc. | Method and apparatus for forming improved metal interconnects |
| US6284656B1 (en) | 1998-08-04 | 2001-09-04 | Micron Technology, Inc. | Copper metallurgy in integrated circuits |
| US6245663B1 (en) | 1998-09-30 | 2001-06-12 | Conexant Systems, Inc. | IC interconnect structures and methods for making same |
| US6291887B1 (en) | 1999-01-04 | 2001-09-18 | Advanced Micro Devices, Inc. | Dual damascene arrangements for metal interconnection with low k dielectric constant materials and nitride middle etch stop layer |
| IL128920A0 (en) | 1999-03-10 | 2000-02-17 | Nova Measuring Instr Ltd | Method for monitoring metal cmp |
| US6290578B1 (en) | 1999-10-13 | 2001-09-18 | Speedfam-Ipec Corporation | Method for chemical mechanical polishing using synergistic geometric patterns |
| JP4355083B2 (ja) * | 2000-02-29 | 2009-10-28 | 関東化学株式会社 | フォトレジスト剥離液組成物およびそれを用いた半導体基板処理方法 |
| US6369242B2 (en) | 2000-03-17 | 2002-04-09 | Roche Vitamins Inc. | Tocopherol manufacture by tris(perfluorohydrocarbylsulphonyl) methane or metal methides thereof |
| US6358899B1 (en) | 2000-03-23 | 2002-03-19 | Ashland, Inc. | Cleaning compositions and use thereof containing ammonium hydroxide and fluorosurfactant |
| US6372700B1 (en) | 2000-03-31 | 2002-04-16 | 3M Innovative Properties Company | Fluorinated solvent compositions containing ozone |
| US6310018B1 (en) | 2000-03-31 | 2001-10-30 | 3M Innovative Properties Company | Fluorinated solvent compositions containing hydrogen fluoride |
| TW486801B (en) | 2000-04-07 | 2002-05-11 | Taiwan Semiconductor Mfg | Method of fabricating dual damascene structure |
| US6478936B1 (en) * | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
| US6291082B1 (en) | 2000-06-13 | 2001-09-18 | Advanced Micro Devices, Inc. | Method of electroless ag layer formation for cu interconnects |
| EP1197586A3 (en) * | 2000-10-13 | 2002-09-25 | Shipley Company LLC | Electrolyte |
| EP1197587B1 (en) * | 2000-10-13 | 2006-09-20 | Shipley Co. L.L.C. | Seed layer repair and electroplating bath |
| US6660153B2 (en) * | 2000-10-20 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer repair bath |
| WO2002045142A2 (en) | 2000-11-15 | 2002-06-06 | Intel Corporation | Copper alloy interconnections for integrated circuits and methods of making same |
| US6555510B2 (en) | 2001-05-10 | 2003-04-29 | 3M Innovative Properties Company | Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| KR100704690B1 (ko) * | 2001-10-31 | 2007-04-10 | 히다치 가세고교 가부시끼가이샤 | 연마액 및 연마방법 |
| ITMI20020178A1 (it) | 2002-02-01 | 2003-08-01 | Ausimont Spa | Uso di additivi fluorurati nell'etching o polishing di circuiti integrati |
-
2002
- 2002-12-16 US US10/320,254 patent/US6858124B2/en not_active Expired - Fee Related
-
2003
- 2003-10-24 EP EP03776538A patent/EP1572820A1/en not_active Withdrawn
- 2003-10-24 AU AU2003284355A patent/AU2003284355A1/en not_active Abandoned
- 2003-10-24 CN CNB2003801059290A patent/CN100341122C/zh not_active Expired - Fee Related
- 2003-10-24 WO PCT/US2003/033878 patent/WO2004061027A1/en not_active Ceased
- 2003-10-24 JP JP2004564819A patent/JP2006510807A/ja active Pending
- 2003-10-24 KR KR1020057010923A patent/KR20050085663A/ko not_active Ceased
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