JP2006324589A - Ｌｅｄ装置およびその製造方法 - Google Patents

Ｌｅｄ装置およびその製造方法 Download PDF

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Publication number
JP2006324589A
JP2006324589A JP2005148246A JP2005148246A JP2006324589A JP 2006324589 A JP2006324589 A JP 2006324589A JP 2005148246 A JP2005148246 A JP 2005148246A JP 2005148246 A JP2005148246 A JP 2005148246A JP 2006324589 A JP2006324589 A JP 2006324589A
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JP
Japan
Prior art keywords
resin
resin body
led
wiring board
led element
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Pending
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JP2005148246A
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English (en)
Japanese (ja)
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JP2006324589A5 (https=
Inventor
Hiroki Oda
洋樹 織田
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Sharp Corp
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Sharp Corp
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Priority to JP2005148246A priority Critical patent/JP2006324589A/ja
Publication of JP2006324589A publication Critical patent/JP2006324589A/ja
Publication of JP2006324589A5 publication Critical patent/JP2006324589A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
JP2005148246A 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法 Pending JP2006324589A (ja)

Priority Applications (1)

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JP2005148246A JP2006324589A (ja) 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法

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JP2005148246A JP2006324589A (ja) 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法

Publications (2)

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JP2006324589A true JP2006324589A (ja) 2006-11-30
JP2006324589A5 JP2006324589A5 (https=) 2009-08-27

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JP (1) JP2006324589A (https=)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009001606A1 (ja) * 2007-06-28 2008-12-31 Showa Denko K.K. 発光装置、表示装置、発光装置の製造方法
JP2009182307A (ja) * 2008-02-01 2009-08-13 Nichia Corp 発光装置の製造方法及び発光装置
JP2010245128A (ja) * 2009-04-01 2010-10-28 Showa Denko Kk 樹脂体形成方法、発光体製造方法、樹脂体形成装置及び発光体製造装置
JP2010272653A (ja) * 2009-05-20 2010-12-02 Showa Denko Kk 樹脂体形成装置、発光体製造装置、樹脂体形成方法、及び発光体製造方法
JP2011009680A (ja) * 2009-06-24 2011-01-13 Paragon Semiconductor Lighting Technology Co Ltd 発光効率の向上及び出射光角度の制御が可能な発光ダイオード封止構造、ベース構造及びその製造方法
JP2011014860A (ja) * 2009-07-06 2011-01-20 Paragon Semiconductor Lighting Technology Co Ltd 充填方法で凸レンズを成形することにより光射出角度を調整することができる発光ダイオードパッケージ構造及びその製作方法
JP2011049516A (ja) * 2009-08-26 2011-03-10 Paragon Semiconductor Lighting Technology Co Ltd 演色性と輝度を高める混光式ｌｅｄパッケージ構造
JP2012504341A (ja) * 2008-09-30 2012-02-16 ブリッジラックス インコーポレイテッド Ｌｅｄ蛍光体の堆積法
JP2012099544A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置の製造方法
JP2012099545A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2012256953A (ja) * 2007-02-22 2012-12-27 Sharp Corp 表面実装型発光ダイオードおよびその製造方法
WO2013038854A1 (ja) * 2011-09-14 2013-03-21 シャープ株式会社 発光装置およびその製造方法
WO2013088790A1 (ja) * 2011-12-14 2013-06-20 三菱電機株式会社 発光装置及び照明装置及び表示装置及び発光装置の製造方法
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
US8759124B2 (en) 2010-10-29 2014-06-24 Nichia Corporation Light emitting apparatus and production method thereof
WO2014125714A1 (ja) 2013-02-15 2014-08-21 シャープ株式会社 植物栽培用ｌｅｄ光源
US9024343B2 (en) 2007-12-28 2015-05-05 Nichia Corporation Light emitting device
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9504207B2 (en) 2012-12-28 2016-11-29 Sharp Kabushiki Kaisha Light emitting device
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
JP2019071352A (ja) * 2017-10-10 2019-05-09 シチズン電子株式会社 照明装置とその製造方法
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058445A (ja) * 1991-06-29 1993-01-19 Kyocera Corp 画像装置
JPH07231120A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 発光装置とその製造方法およびｌｅｄヘッドの製造方法
JPH09148633A (ja) * 1995-11-28 1997-06-06 Matsushita Electron Corp 発光ダイオード整列光源
JP2005502205A (ja) * 2001-08-31 2005-01-20 フェアチャイルド セミコンダクター コーポレイション 表面実装可能な光結合素子パッケージ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058445A (ja) * 1991-06-29 1993-01-19 Kyocera Corp 画像装置
JPH07231120A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 発光装置とその製造方法およびｌｅｄヘッドの製造方法
JPH09148633A (ja) * 1995-11-28 1997-06-06 Matsushita Electron Corp 発光ダイオード整列光源
JP2005502205A (ja) * 2001-08-31 2005-01-20 フェアチャイルド セミコンダクター コーポレイション 表面実装可能な光結合素子パッケージ

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
JP2012256953A (ja) * 2007-02-22 2012-12-27 Sharp Corp 表面実装型発光ダイオードおよびその製造方法
JP2009010184A (ja) * 2007-06-28 2009-01-15 Showa Denko Kk 発光装置、表示装置、発光装置の製造方法
US8208093B2 (en) 2007-06-28 2012-06-26 Showa Denko K.K. Light-emitting device, display device and method of manufacturing light-emitting device
WO2009001606A1 (ja) * 2007-06-28 2008-12-31 Showa Denko K.K. 発光装置、表示装置、発光装置の製造方法
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US9806234B2 (en) 2007-12-28 2017-10-31 Nichia Corporation Light emitting device
US10559721B2 (en) 2007-12-28 2020-02-11 Nichia Corporation Light emitting device
US9024343B2 (en) 2007-12-28 2015-05-05 Nichia Corporation Light emitting device
JP2009182307A (ja) * 2008-02-01 2009-08-13 Nichia Corp 発光装置の製造方法及び発光装置
JP2012504341A (ja) * 2008-09-30 2012-02-16 ブリッジラックス インコーポレイテッド Ｌｅｄ蛍光体の堆積法
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
JP2010245128A (ja) * 2009-04-01 2010-10-28 Showa Denko Kk 樹脂体形成方法、発光体製造方法、樹脂体形成装置及び発光体製造装置
JP2010272653A (ja) * 2009-05-20 2010-12-02 Showa Denko Kk 樹脂体形成装置、発光体製造装置、樹脂体形成方法、及び発光体製造方法
JP2011009680A (ja) * 2009-06-24 2011-01-13 Paragon Semiconductor Lighting Technology Co Ltd 発光効率の向上及び出射光角度の制御が可能な発光ダイオード封止構造、ベース構造及びその製造方法
JP2011014860A (ja) * 2009-07-06 2011-01-20 Paragon Semiconductor Lighting Technology Co Ltd 充填方法で凸レンズを成形することにより光射出角度を調整することができる発光ダイオードパッケージ構造及びその製作方法
JP2011049516A (ja) * 2009-08-26 2011-03-10 Paragon Semiconductor Lighting Technology Co Ltd 演色性と輝度を高める混光式ｌｅｄパッケージ構造
JP2012099545A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置及びその製造方法
US8759124B2 (en) 2010-10-29 2014-06-24 Nichia Corporation Light emitting apparatus and production method thereof
US11876153B2 (en) 2010-10-29 2024-01-16 Nichia Corporation Light emitting apparatus and production method thereof
US9076948B2 (en) 2010-10-29 2015-07-07 Nichia Corporation Light emitting apparatus and production method thereof
US9276181B2 (en) 2010-10-29 2016-03-01 Nichia Corporation Light emitting apparatus and production method thereof
JP2012099544A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置の製造方法
US11626543B2 (en) 2010-10-29 2023-04-11 Nichia Corporation Light emitting apparatus and production method thereof
US10741729B2 (en) 2010-10-29 2020-08-11 Nichia Corporation Light emitting apparatus and production method thereof
EP2448028B1 (en) * 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
CN103797595B (zh) * 2011-09-14 2016-09-07 夏普株式会社 发光装置及其制造方法
CN103797595A (zh) * 2011-09-14 2014-05-14 夏普株式会社 发光装置及其制造方法
JP2013062438A (ja) * 2011-09-14 2013-04-04 Sharp Corp 植物栽培用の発光装置およびその製造方法
WO2013038854A1 (ja) * 2011-09-14 2013-03-21 シャープ株式会社 発光装置およびその製造方法
WO2013088790A1 (ja) * 2011-12-14 2013-06-20 三菱電機株式会社 発光装置及び照明装置及び表示装置及び発光装置の製造方法
JPWO2013088790A1 (ja) * 2011-12-14 2015-04-27 三菱電機株式会社 発光装置及び照明装置及び表示装置及び発光装置の製造方法
US9504207B2 (en) 2012-12-28 2016-11-29 Sharp Kabushiki Kaisha Light emitting device
WO2014125714A1 (ja) 2013-02-15 2014-08-21 シャープ株式会社 植物栽培用ｌｅｄ光源
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP2019071352A (ja) * 2017-10-10 2019-05-09 シチズン電子株式会社 照明装置とその製造方法

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