JP2006300994A - Resist recovering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resist recovering apparatus in which (1) resist recovering efficiency is enhanced, so that the lifetime of an alkali solution is extended and cleaning work is made simple and easy, (2) it is made unnecessary to add a defoaming agent, so that the occurrence of a defective circuit board is prevented, (3) clogging is prevented, so that mesh density can be made high, and (4) the apparatus is made smaller in size. <P>SOLUTION: The resist recovering apparatus 11 is used in a process of producing a circuit board to separate and recover a photosensitive resist A from a mixture D of the resist A and an alkali solution B, and comprises a liquid pre-removal section 13, a resist concentration section 14, a resist recovery section 15 and a scum recovery section 30. In the liquid pre-removal section 13, the alkali solution B is separated and recovered from the mixture D. In the resist concentration section 14, the resist A is concentrated and the alkali solution B is separated and recovered. In the resist recovery section 15, the resist A is collected and recovered and the the alkali solution B is separated and recovered. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resist collection apparatus. That is, the present invention relates to a resist recovery apparatus that is attached to a developing machine or a peeling machine and separates and collects an alkaline solution such as a developer or a peeling liquid and a photosensitive resist in a circuit board manufacturing process. is there.

《Technical background》
As electronic devices become more sophisticated, more functional, smaller and lighter, printed circuit boards and other circuit boards are becoming more accurate, finer, thinner, and more diverse, resulting in higher circuit density. , The miniaturization is remarkable.
And in such a circuit board manufacturing process, after applying or pasting a photosensitive resist in the form of a film on the outer surface of the substrate material, which is a copper-clad laminate, → after applying a negative film of the circuit and exposing → The resist other than the circuit forming part is dissolved and removed by the phenomenon, → The copper foil other than the circuit forming part is dissolved and removed by etching, and then the resist of the circuit forming part is removed by stripping → A circuit is formed of copper foil on the outer surface of the substrate material, and thus a circuit board is manufactured.

<Conventional technology>
FIG. 4 is a front sectional view for explaining this type of conventional example. As shown in the figure, in the development process and the film peeling process described above, the developing machine 1 and the peeling machine 2 are used, and the resist A other than the circuit formation part and the circuit formation part left after being cured. The resist A is sprayed with an alkaline solution B such as a developing solution or a stripping solution, and dissolved and removed from the outer surface of the substrate material C.
→ And the alkaline solution B used in the developing machine 1 and the peeling machine 2 in this way and the small fragment-like resist A removed after being used as the photosensitive film → the mixed mixture D and It will flow down.
→ Therefore, such a mixture D is supplied from the developing machine 1 or the peeling machine 2 to the attached resist collecting device 3 to separate the alkaline solution B and the resist A. The alkaline solution B is circulated and supplied to the developing machine 1 and the peeling machine 2 and reused, and the resist A is discarded.

As this type of resist recovery apparatus 3, a filter 4 type or mesh drum type shown in FIG. 4 has been typically used.
That is, in this type of conventional resist recovery apparatus 2, the mixture D is removed from the liquid tank 6 below the chamber 5 of the developing machine 1 and the peeling machine 2, through the pump 7 and the pipe 8, through the filter 4 and the mesh. It is supplied to the drum and then filtered and separated by passing through the filter 4 and the mesh drum. → Then, the recovered alkaline solution B such as developer or stripper is supplied to the spray nozzle 9 of the developer 1 or stripper 2 via the pipe 8 and sprayed, reused, and the filter 4 or mesh Resist A that did not pass through the drum was collected, recovered, and discarded.
In the drawing, reference numeral 10 denotes a roller conveyor that conveys the substrate material C in the developing machine 1 and the peeling machine 2.

《Information on prior art documents》
As such a conventional example, for example, the one shown in the prior art column of the following Patent Document 1 can be cited.
JP 2004-325502 A

By the way, the following problems have been pointed out with respect to such a conventional resist collecting apparatus 3.
<First problem>
First, it has been pointed out that the separation and recovery of the resist A and the alkaline solution B are uncertain, the recovery efficiency of the resist A is poor, and the alkaline solution B is consumed very much.
In other words, circuit boards are becoming more accurate, finer, and extremely thin, and the density and miniaturization of circuits formed are remarkable. Therefore, the resist A removed from such a circuit forming part and other parts than the circuit forming part is remarkably miniaturized.
→ Thus, with the conventional filter 4 type or mesh drum type resist collecting device 3, it is not easy to filter, separate, collect and collect the resist A from the mixture D recently. It tends to be difficult.

Therefore, the resist A is likely to be mixed in a large amount in the alkaline solution B such as the developer and the stripping solution recovered through the resist recovery device 3. → Therefore, when such an alkaline solution B is circulated and supplied to the developing machine 1 or the peeling machine 2 and reused repeatedly, the functions of dissolving and removing the resist A from the substrate material C, which are the original functions, are removed. It will gradually decline.
→ As a result, the alkaline solution B such as the developing solution of the developing machine 1 or the peeling liquid of the peeling machine 2 has a short life life, and the frequency of replenishing and replacing the fresh liquid becomes high. It was getting bigger. For example, it was necessary to exchange about once a week.
In addition, when the alkaline solution B mixed with the resist A is circulated and repeatedly used in the developing machine 1 and the peeling machine 2, the resist A becomes white turbid, creamy, glued, and the liquid tank. 6 precipitates on and adheres to the inner wall, causing clogging of the pipe 8 and others. → Therefore, the cleaning and removal work is being carried out, but it is very troublesome and takes time and effort.

<< Second problem >>
Secondly, an antifoaming agent has been added to the alkaline solution B such as a developing solution or a stripping solution, but this defoaming agent has an adverse effect on the circuit formation of the substrate material C, and the circuit board is defective. The problem of being the cause was pointed out.
That is, in the developing machine or the peeling machine, an alkaline solution B such as a developer or a peeling liquid is sprayed from the spray nozzle 9 to the substrate material C. → Therefore, in the vicinity of the substrate material C, bubbles of the alkaline solution B are generated as a result of spraying. → When this bubbles flows into the filter 4 and the mesh drum of the resist recovery device 3 together with the mixture D, → As a result, the resist A floats on the liquid surface, and the separation and recovery of the resist A become uncertain, and the recovery efficiency of the resist A decreases.
Therefore, as a countermeasure, conventionally, an antifoaming agent, for example, an emulsion type ether type oily defoaming agent has been added to the alkaline solution B in advance.
→ However, the antifoaming agent added in this way has an adverse effect on the processing of the substrate material C, and development defects, etching defects and peeling defects are likely to occur. → A defective product is generated on the manufactured circuit board. It was.

《Third problem》
Thirdly, it has been pointed out that the filter 4 and the mesh drum of the resist collecting apparatus 3 are likely to be clogged, and the filter 4 and the mesh drum are frequently exchanged and maintained frequently, resulting in high costs.
That is, as a countermeasure for the first problem, that is, a countermeasure for ensuring the filtration, separation and recovery of the resist A which is becoming finer and improving the recovery efficiency of the resist A, However, it is necessary to employ a filter 4 or a mesh drum that is denser. → However, as a result, the resist A was collected and accumulated in the filter 4 and the mesh drum, and clogged easily.
Incidentally, in the conventional resist collecting apparatus 3, the mesh is limited to about 20 meshes per inch (25.4 mm), which is not sufficient for collecting the fine resist A, and clogging is also caused. It occurred frequently.

《Fourth problem》
Fourthly, it has been pointed out that the resist collection device 3 is enlarged, which takes up installation space and increases the cost.
That is, in the conventional resist collecting apparatus 3, the mixture D supplied from the developing machine 1 or the peeling machine 2 is filtered and separated at once with a filter 4 or a mesh drum, and then the resist A is collected. Alkaline solution B was recovered.
That is, since a large amount of the supplied mixture D was filtered and separated at once in a single process, the resist collecting apparatus 3 was inevitably increased in size.

<< About the present invention >>
In view of such circumstances, the resist recovery apparatus of the present invention has been made in order to solve the problems of the conventional example.
And, according to the present invention, firstly, the resist recovery efficiency is improved, secondly, the addition of an antifoaming agent is not required, thirdly, clogging is prevented, and fourthly, the apparatus is downsized. An object of the present invention is to propose a resist recovery apparatus.

<About Claim>
The technical means of the present invention for solving such a problem is as follows. First, claim 1 is as follows.
The resist recovery apparatus according to claim 1 is used in the circuit board manufacturing process, and recovers the resist from the mixture of the supplied sprayed alkaline solution and the removed photosensitive resist. And it has a liquid tank, a pre-liquid removal part, a resist concentration part, and a resist collection | recovery part.
The pre-liquid removal unit separates the alkaline solution from the mixture and collects it in the liquid tank. The resist concentration unit concentrates the resist with respect to the mixture supplied from the pre-liquid removal unit, and separates and recovers the alkaline solution into the liquid tank. The resist collecting unit collects and collects the resist from the mixture supplied from the resist concentrating unit, and separates and collects the alkaline solution into the liquid tank.
Claim 2 is as follows. According to a second aspect of the present invention, the pre-liquid removal unit includes a liquid removal net. The supplied mixture first flows on the dewatering net, so that a considerable amount of the alkaline solution is separated and dropped and recovered into the liquid tank.
The resist concentrating unit includes a substantially inverted conical collection net standing in the liquid tank. Then, the mixture supplied from the drainage net of the pre-drainage section is sucked and flowed downward in the collection net, so that a considerable amount of the alkaline solution is removed from the collection net. The resist flows out into the liquid tank and is sucked and flowed downward to be sucked and collected into the liquid tank, and the resist is successively concentrated toward the lower part of the collection net.
The resist collection unit includes a filtration net. Then, the mixture containing the resist supplied and concentrated from the lower part of the collection net of the resist concentration unit is collected and collected by the filtration net, and the alkaline solution is It is collected in the liquid tank.

Claim 3 is as follows. According to a third aspect of the present invention, there is provided the resist collecting apparatus according to the second aspect, wherein the resist collecting apparatus is attached to a developing machine in a circuit board manufacturing process, and the alkaline solution comprises a developer.
Claim 4 is as follows. According to a fourth aspect of the present invention, there is provided the resist collecting apparatus according to the second aspect, wherein the resist solution is attached to a peeling machine in a circuit board manufacturing process, and the alkaline solution is made of a peeling solution.
Claim 5 is as follows. According to a fifth aspect of the present invention, there is provided the resist recovery apparatus according to the third or fourth aspect, further comprising a foam recovery unit including a foam recovery box, a liquefaction nozzle, and a defoaming net.
The foam recovery box is disposed on the resist concentrating portion with a space therebetween, and the lower surface is opened, and sucks the bubbles of the alkaline solution above the mixture. The liquefaction nozzle sprays the foam supplied from the foam recovery box onto the defoaming net. The defoaming net is characterized in that the jetted bubbles are liquefied, returned to the alkaline solution, and collected in the liquid tank.

Claim 6 is as follows. According to a sixth aspect of the present invention, there is provided the resist collecting apparatus according to the third or fourth aspect, wherein the pre-liquid removal unit is disposed at a vertical interval below the liquid removal net disposed at a downward inclination. It comprises a structure comprising a perforated plate provided and each protrusion standing on the perforated plate.
Then, the alkaline solution dropped under the drainage net is bound and floated by the perforated plate and the protrusion, so that the drainage net is shaken from below, and from above the perforated plate to the liquid tank. It is dropped and collected.
Claim 7 is as follows. According to a seventh aspect of the present invention, there is provided the resist collecting apparatus according to the third or fourth aspect, wherein a porous cover is provided around the collection net of the resist concentrating portion with a space therebetween. The alkaline solution in the liquid tank flows into the porous cover and is sucked and flowed downward along the outer surface of the collection net, and is sucked and collected into the liquid tank. It is characterized by.
Claim 8 is as follows. The resist collecting apparatus according to an eighth aspect is characterized in that, in the fifth or seventh aspect, the pump for sucking the mixture, the alkaline solution, or the bubbles is of an intermittent drive type.

《Action etc.》
Since the resist recovery apparatus of the present invention comprises such means, it is as follows.
(1) In a circuit board manufacturing process, an alkaline solution such as a developer or a peeling solution sprayed and used in a developing machine or a peeling machine, and a small piece of photosensitive resist removed as a photosensitive film from a substrate material This mixture is supplied to an attached resist collecting apparatus.
(2) First, the mixture flows on the liquid removal net of the pre-liquid removal unit, so that a considerable amount of the alkaline solution is separated and dropped and collected in the liquid tank.
At that time, the alkaline solution that has fallen under the drainage net bounces and floats on the perforated plate with protrusions and shakes the drainage net from below, so the drainage net is constantly refreshed and remains in the mixture. Clogging due to the resist is prevented.

(3) Next, the mixture is supplied to the collection net of the resist concentrating portion, and is sucked and flowed downward in the collection net having a substantially inverted conical shape. Therefore, a considerable amount of alkaline solution flows out of the collection net and is sucked and flowed downward and sucked and collected into the liquid tank. The resist is sequentially collected and concentrated toward the bottom of the collection net. go.
(4) A porous cover is provided on the outside of the collection net, and the alkaline solution in the liquid tank is sucked and flowed downward along the outer surface of the collection net through the porous cover. Along with the alkaline solution flowing out of the net, it is sucked and collected into the liquid tank.
In this way, since a flow in the same direction and pressure is formed inside and outside the collection net, clogging of the collection net due to the resist in the mixture is prevented.
(5) The mixture containing the concentrated resist is then supplied from the lower part of the collection net to the resist collection unit, where the resist is collected and collected by the filtration net, and the alkaline solution is supplied to the liquid tank. And recovered.
(6) In addition, if the intermittent drive type is adopted for the pump for sucking the mixture and the alkaline solution, the collection net and the filtration net are more reliably prevented from being clogged with the resist in the mixture. .

(7) By the way, the mixture supplied to the resist recovery apparatus is accompanied by a large amount of bubbles of the alkaline solution as it is jetted by the developing machine or the peeling machine.
Therefore, a bubble recovery unit is disposed in the resist recovery apparatus. The foam is sucked into the foam collection box, sprayed from the liquefaction nozzle to the defoaming net, liquefied and returned to the alkaline solution, and collected in the liquid tank. In addition, about the pump which suck | inhales a bubble, if an intermittent drive type is employ | adopted, liquefaction of a bubble will be promoted.
In this way, bubbles, that is, bubbles that cause the resist to float on the liquid surface of the mixture and make the separation and recovery of the resist uncertain, are eliminated. This is achieved without the use of antifoam agents that adversely affect the processing of the substrate material.
(8) In this resist recovery apparatus, the resist and the alkaline solution are reliably separated and recovered in this manner.
(9) In addition, since a considerable amount of alkaline solution is separated and collected in advance in the pre-liquid removal unit, the amount of the mixture supplied to the resist concentration unit is reduced by that amount. Since the alkaline solution is separated and collected, the amount of the mixture supplied to the resist collecting unit is reduced accordingly. Accordingly, the resist concentrating unit and the resist collecting unit are downsized, and the resist collecting apparatus is also downsized.
(10) Now, the resist recovery apparatus of the present invention exhibits the following effects.

<< First effect >>
First, the resist recovery efficiency is improved, the life of the alkaline solution is increased, and the cleaning operation is simplified and facilitated.
That is, in the resist collection apparatus of the present invention, the mixture is first separated and collected in the pre-liquid removal unit from the lower side where there is little resist, and then the alkaline solution such as developer and stripping solution is collected, and then in the resist concentration unit. Then, the resist is concentrated, and further, the alkali solution is separated and collected. Finally, the resist collecting unit collects and collects the concentrated resist, and the alkali solution is separated and collected.
In this way, the resist and the alkaline solution can be separated and recovered smoothly and reliably. Even recent miniaturized resists are reliably separated and recovered. In addition, from the viewpoint of eliminating bubbles and preventing clogging, the certainty of such separation and recovery is promoted.
Therefore, it is avoided that a large amount of resist is mixed into the recovered alkaline solution as in the above-described conventional resist recovery apparatus of the filter type or mesh drum type. The collected alkaline solution can be reused and recycled by supplying it to a developing machine and a peeling machine many times.
Therefore, compared with this type of conventional example, the recovery efficiency of the resist is greatly improved, the consumption of the alkaline solution is reduced to about 1/3, the life life of the alkaline solution is increased, and the replenishment frequency and replacement frequency are reduced. The cost burden is reduced. For example, it will be possible to exchange only once every two to three weeks.
In addition, the resist mixed in the alkaline solution that is circulated is reduced in whiteness, cream, paste, and deposit in the developing machine and stripping machine, and it is troublesome and time-consuming. The number of such cleaning removal operations is also greatly reduced.

<< Second effect >>
Secondly, the addition of an antifoaming agent is not necessary, and the occurrence of defects in the manufactured circuit board is prevented.
That is, the resist recovery apparatus of the present invention employs a system that eliminates bubbles of the alkaline solution by the bubble recovery unit. This kind of conventional example is not a system in which an antifoaming agent is added to an alkaline solution such as a developing solution or a stripping solution in advance, so that development failure, etching failure, peeling failure, etc. due to the defoaming agent are generated. There is no fear of this, and there is no adverse effect on the processing of the substrate material by the antifoaming agent. Therefore, the generation of defective products due to the antifoaming agent is avoided for the circuit board to be manufactured.

《Third effect》
Thirdly, clogging is prevented and the mesh density can be made denser. That is, in the resist recovery apparatus of the present invention, refreshing by shaking of the liquid removal net in the pre-liquid removal part, formation of the same direction and pressure flow inside and outside the collection net in the resist concentration part, and adoption of an intermittent drive type pump For example, clogging of the drainage net, the collection net, and the filtration net is prevented.
Therefore, compared to the above-described conventional resist collection apparatus, the replacement frequency of the net or the like is greatly reduced, the frequency of maintenance is low, and the cost is excellent.
Further, with the recent miniaturization of circuits, the tendency of miniaturization of resists is remarkable. However, since clogging is prevented in this way, a net having a mesh of about 200 mesh can be employed. As for drainage nets, collection nets, filtration nets, etc., it is possible to adopt those having a mesh number of about 200 mesh per inch (25.4 mm), which are excellent in dealing with fine resists. Therefore, the resist recovery efficiency is improved from this aspect as compared with the above-described conventional resist recovery apparatus of which the limit is about 20 mesh.

<< 4th effect >>
Fourth, the device is downsized. That is, in the resist recovery apparatus of the present invention, an alkaline solution such as a developer and a stripping solution is separated and recovered in order in the order of the pre-liquid removal unit, the resist concentration unit, and the resist recovery unit.
Therefore, the apparatus is reduced in size as compared with the above-described conventional resist recovery apparatus of this type, which has a system in which the resist and the alkaline solution are filtered, separated and recovered at a time, and thus the apparatus has been increased in size. Therefore, it does not take up installation space, and the price is also reduced to about half.
As described above, the effects exerted by the present invention are remarkably large, such as all the problems existing in this type of conventional example are solved.

《About drawing》
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a resist recovery apparatus according to the present invention will be described in detail based on the best mode for carrying out the invention shown in the drawings.
1, 2, and 3 are provided for explaining the embodiment of the present invention. 1 is a front cross-sectional explanatory view, FIG. 2 is a side cross-sectional explanatory view of the main part, and FIG. 3 is an overall side cross-sectional explanatory view.
FIG. 5 is a schematic plan view of a substrate (substrate material).

<< About circuit board E >>
This resist recovery apparatus 11 is used in the manufacturing process of the circuit board E. First, an outline of the circuit board E will be described with reference to FIG.
The circuit board E is used for electrical connection in AV equipment, personal computers, mobile phones, digital cameras, and other various electronic devices, and the circuit F pattern for connecting parts is formed on the outer surface of the insulating layer, It is formed inside.
The circuit board E is divided into a single-sided board and a double-sided board, as well as a multi-layer board (including recent build-up type), and various other types. A rigid rigid board and a film-like flexible board. It can also be divided into
As part of such a circuit board E, a module board (semiconductor integrated package board) in which semiconductor parts such as ICs, LSI elements, passive parts, driving parts, capacitors, etc. are integrated with the circuit F, A glass substrate in which a semiconductor component and a circuit F are embedded in a glass base, that is, a glass substrate for a plasma display PDP, a glass substrate for a liquid crystal LCD, CSP, PBGA, and the like have also appeared. Of course, in the present specification, the circuit board E widely includes such a circuit board in addition to the conventional printed wiring board.
Circuit board E has become more accurate, finer, and thinner, more flexible, multi-layered and more diverse as electronic devices become more sophisticated, more functional, and smaller and lighter. The circuit F formed on the front surface (one or both of the front surface and the back surface), and further, the circuit F formed inside is remarkably increased in density and miniaturization.
A circuit board E, for example, a printed wiring board, has a vertical and horizontal cut size of about 500 mm × 500 mm, for example. The thickness of the insulating layer (core material) is extremely thin from the conventional 1.6 mm to about 1.0 mm to 60 μm, and recently from about 50 μm to about 10 μm. The thickness of the circuit F portion (copper foil portion) is also extremely thinned from 75 μm to 35 μm, and recently, around 16 μm to 10 μm. Even in the case of a multilayer substrate, the overall thickness is being reduced to about 1.0 mm to 0.4 mm. The circuit F width and the space between the circuits F are also about 30 μm to 15 μm.
The circuit board E is roughly like this.

<< One Example of Manufacturing Method of Circuit Board E >>
Next, a method for manufacturing the circuit board E in which the resist recovery apparatus 11 is used will be described with reference to FIGS. First, the manufacturing method of the first example will be described. In this manufacturing method, the circuit board E, for example, a printed wiring board, is manufactured by following the following steps.
First, a copper-clad laminate board with a copper foil attached to the outer surface of an insulating layer (core material) made of glass cloth, ceramics, film-like polyimide, or other resin. A plate material C is prepared.
And about the board | substrate material C prepared in this way, after the surface roughening process (soft etching) which roughens the paste | laminated copper foil surface is performed, it cut | disconnects to each leaf of a short work size. The surface roughening treatment is conventionally performed by mechanical polishing, but recently, it is often performed by jetting a treatment liquid.
In many cases, drilling for through holes is performed using a laser or the like. The through holes are formed of fine through-holes between both outer surfaces of the substrate material C (circuit board E), and one or more hundreds of extremely small diameters are formed with a diameter of 0.5 mm to 0.00 mm. The number is about 2 mm or less. The through-holes are used for conductive connection between the circuits F (copper foil) on both outer surfaces and between the circuits F (copper foil) on the multilayer substrate, and for mounting semiconductor components mounted on the circuit F.
Recently, instead of through-holes that require drilling, bumps that are contact points in the form of small protrusions and substantially frustoconical shapes have been formed. Has been developed. The bumps are manufactured following the development process, the etching process, and the delamination process according to the circuit F.

After that, the photosensitive resist A is applied or pasted on the outer surface of the copper foil of the substrate material C in the form of a film. The dry film of resist A is often pressed. Then, a negative film of the circuit F, that is, a circuit F photograph previously designed for the circuit F, is applied and exposed, so that the resist A on the outer surface leaves a circuit F forming part (protective film part) that has been exposed and cured, Other unnecessary portions are dissolved and removed by spraying the developing solution as the processing solution, that is, the alkaline solution B.
Then, such a copper foil of the substrate material C leaves a circuit F forming part (protective film part) coated with the resist A cured, and an unnecessary part exposed by dissolving and removing the resist A by development is processed. It is dissolved and removed by spraying a liquid etchant (cupric chloride, ferric chloride, or other corrosive liquid). Then, the remaining resist A in the circuit F forming portion is stripped by spraying a stripping solution, that is, an alkaline solution B as a processing solution, and the remaining circuit F forming portion is removed from the substrate material C by the copper foil. A circuit F having a predetermined conductor pattern is formed on the surface, and a circuit board E is manufactured.
In the development process, the etching process, and the film removal process described above, washing is performed by spraying a washing solution, a neutralizing agent solution, and other washing solutions for the post-treatment or for the post-treatment after the film-removal step. A process is attached. In the cleaning process, the processing liquid such as the developing solution, the etching solution, and the stripping solution adhering to the outer surface of the substrate material C (including the inside of the through hole) is cleaned and removed. Furthermore, a drying process is attached after the cleaning process. That is, the outer surface of the substrate material C cleaned in the cleaning process (including the inside of the through hole) is adhered with water and other cleaning liquids and their moisture. After the fact, it is immediately dried in the drying process.
The manufacturing method of the first example includes such a wet process method. The manufacturing method of the first example is as described above.

<< Other Examples of Manufacturing Method of Circuit Board E >>
Next, a manufacturing method of the second example will be described. As a method for manufacturing a circuit board E, for example, a printed wiring board, the wet process method of the first example described above is typical, but the semi-additive method of the second example is also being used frequently.
In the semi-additive method, first, electroless copper plating is performed on the outer surface of the substrate material C on which through holes have been formed in advance. → Then, a photosensitive resist A is applied or pasted on the electroless copper plating, and then a circuit F photograph as a circuit F film is applied and exposed. The resist A remains exposed and hardened, and the other part, that is, the circuit F forming part is dissolved and removed by spraying the developing solution, ie, the alkaline solution B, as the processing liquid.
Thereafter, electrolytic copper plating is applied to the circuit F forming portion, that is, the plating pattern portion where the resist A is dissolved and removed by development, that is, the portion where the electroless copper plating is exposed, and the circuit F is formed. . → The remaining hardened resist A other than the part where the circuit F is formed is removed by spraying a stripping solution as a processing solution, that is, an alkaline solution B, and the exposed electroless copper plating is an etching solution as a processing solution. It is quick etched by spraying and melted away. → In addition, a cleaning process using a cleaning liquid and a drying process are provided for the post-treatment of each process in accordance with the above-described place.
In the semi-additive method of the second example, the circuit F is thus formed by electrolytic copper plating, and thus the circuit board E is manufactured. The manufacturing method of the second example is as described above.
By the way, the manufacturing method of printed circuit boards and other circuit boards E has been increasingly diversified recently, and various other methods have been developed and used in addition to the first and second examples described above. Of course, the present invention is also applied to the manufacturing methods of such various circuit boards E.
The manufacturing method of the circuit board E is as described above.

<< Outline of Resist Collection Device 11 >>
Hereinafter, the resist recovery apparatus 11 of the present invention will be described with reference to FIGS.
As a premise, as described above, during the manufacturing process of the circuit board E, in the development process and the film peeling process, an alkaline solution B such as a developer or a peeling liquid is jetted onto the substrate material C to be transported, The photosensitive resist A is removed from the outer surface of the plate material C.
That is, as shown in FIG. 1, in the chamber 5 of the developing machine 1 and the peeling machine 2, each of the substrate materials C that are horizontally transported by a conveyor such as a roller conveyor 10 is arranged to face each other vertically. From the spray nozzle 9, an alkaline chemical solution containing, for example, about 3% caustic soda, that is, an alkaline solution B made of a developing solution or a stripping solution is sprayed.
Thus, the photosensitive resist A on the outer surface of the substrate material C is removed. That is, in the developing machine 1, the resist A other than the circuit F forming portion is dissolved and removed, and in the peeling machine 2, the resist A in the circuit F forming portion is removed.

The resist recovery apparatus 11 is attached to and used in the developing machine 1 and the peeling machine 2, respectively, as an accompanying process of the developing process and the film peeling process in the manufacturing process of the circuit board E.
In the case of the developing step, a mixture D of the developing solution, which is the alkali solution B after spray use, and the removed resist A is supplied from the developing machine 1 to the attached resist collecting device 11. In the case of the film removal process, a mixture D of the stripper, which is the alkaline solution B after spray use, and the removed resist A is supplied from the stripper 2 to the attached resist collection device 11.
The resist recovery device 11 separates and recovers the resist A from the mixture D of the alkaline solution B and the photosensitive resist A supplied in this way. And it has the liquid tank 12, the pre-liquid removal part 13, the resist concentration part 14, the resist collection | recovery part 15, the bubble collection | recovery part 30, etc.
The resist recovery apparatus 11 is roughly as described above. The details will be described below.

<< About pre-liquid removal part 13 >>
First, the pre-liquid removal part 13 is demonstrated with reference to FIG. The pre-liquid removal unit 13 of the resist recovery apparatus 11 includes a liquid removal net 16. The supplied mixture D first flows on the liquid removal net 16, so that a considerable amount of the alkaline solution B is separated. , Dropped and collected into the liquid tank 12.
That is, the pre-liquid removal unit 13 is provided with a large number of liquid removal nets 16 disposed at a downward inclination, a porous plate 17 disposed below the liquid removal net 16 with a vertical interval, and a plurality of porous liquid plates 17. And a protrusion 18 provided.
Then, the alkaline solution B that has flowed down and dropped under the drainage net 16 is reversed, bound, and floated by the perforated plate 17 and the projections 18, so that the drainage net 16 is shaken from below and the liquid tank is placed from above the perforated plate 17. It falls to 12 and is collected.

Such a pre-liquid removal part 13 is further explained in full detail. First, as shown in FIG. 1, the mixture D drops on a slightly inclined partition floor 19 in the chamber 5 of the developing machine 1 or the peeling machine 2 and then flows along the inclined line. Then, it is poured from the discharge port 20 through the supply pipe 21 to the resist collection device 11 through the receiving port 22.
The mixture D thus supplied to the resist recovery device 11 is first placed on the liquid removal net 16 of the pre-liquid removal unit 13 disposed on the liquid surface of the liquid tank 12 with a vertical interval. Flowing.
As shown in FIG. 2, the liquid removal net 16 has a large number of fine net holes densely formed and has a substantially long plate net shape, and the diameter of the net holes also passes through the refined resist A. The mesh size is set to an impossible mesh size. For example, the mesh size is set to about several tens of μm to several μm and about 200 mesh. Such a drainage net 16 is disposed with a slight downward inclination in the longitudinal direction.
The mixture D flows on the drainage net 16 along the inclination from the upstream side under the receiving port 22 to the downstream side. Accordingly, a considerable portion of the alkaline solution B mixed in the mixture D is filtered and separated through the net hole of the liquid removal net 16 and directed toward the lower liquid tank 12 through the lower porous plate 17. Fall down.

Next, the perforated plate 17 of the pre-liquid removal unit 13 is arranged in parallel with the vertical space below the liquid removal net 16, and a large number of recovery holes are formed.
As the perforated plate 17, for example, a punching plate is used. The perforated plate 17 has a large number of small recovery holes (the hole diameter is much larger than the net hole of the liquid removal net 16), and has a size corresponding to the upper liquid removal net 16. It has a long plate shape and is arranged and fixed at an appropriate inclination angle.
A large number of protrusions 18 functioning as liquid cut bars are erected and fixed on the perforated plate 17. The protrusions 18 are arranged with a mutual interval in the front-rear direction (up-downstream direction), and the height dimension is set to, for example, about half of the vertical interval between the liquid removal net 16 and the perforated plate 17.
Therefore, the alkaline solution B separated and dropped from the mixture D by the dewatering net 16 as described above falls toward the lower liquid tank 12 through the recovery hole of the lower porous plate 17, but it is considerably This part is reversed and rebounded at the surface part other than the recovery hole of the perforated plate 17 in the middle.
The alkaline solution B flows on the perforated plate 17 while bouncing and sinking. In addition, the bounce and up / down movement of the alkaline solution B is greatly promoted by the flow stop function of the protrusions 18 erected on the plate 17.
Accordingly, the upper drainage net 16 is swung up and down by such bounce and sinking motion, so that the resist A in the mixture D flowing on the drainage net 16 is deposited and adhered on the drainage net 16. That is blocked. That is, clogging of the drainage net 16 is prevented.
The pre-liquid removal part 11 is like this.

<< Registration section 14 >>
Next, the resist concentration unit 14 will be described with reference to FIGS. The resist concentrating unit 14 of the resist collecting apparatus 11 concentrates the resist A on the mixture D supplied from the pre-liquid removal unit 13 and separates and recovers the alkaline solution B into the liquid tank 12.
That is, the resist concentration unit 14 includes a substantially inverted conical collection net 23 erected in the liquid tank 12, and the mixture D supplied from the liquid removal net 16 of the pre-liquid removal unit 13 is Then, the inside of the collection net 23 is sucked and flowed downward.
Accordingly, the mixture D flows out of the collection net 23, and a considerable amount of the alkaline solution B is sucked and flowed downward, and is sucked and collected into the liquid tank 12, so that the resist A is collected in the collection net. Concentrated sequentially toward the lower part of 23.
In addition, a porous cover 24 is provided around the collection net 23 of the resist concentrating unit 14 at intervals. Therefore, the alkaline solution B in the liquid tank 12 flows into the porous cover 24 and is sucked and flowed downward along the outer surface of the collection net 23, and is sucked and collected into the liquid tank 12.

Such a resist concentrating part 14 will be further described in detail. A collection net 23 and a porous cover 24 are provided concentrically at the center of the liquid tank 12.
That is, the collection net 23 has a funnel shape and a substantially inverted conical shape whose upper surface is opened and becomes smaller in the lower portion, and a large number of fine net holes are densely formed. The diameter of the net hole is set to a mesh size through which the resist A that has been refined cannot pass, and is set to about several tens of μm to several μm and about 200 mesh, for example.
For example, a cylindrical porous cover 24 is erected on the outside of the collection net 23 with a left-right interval, and the porous cover 24 has a large number of small holes (having a diameter of the collection net 23. It is much larger than the net hole of the).
The upper part of the collection net 23 protrudes above the liquid surface of the liquid tank 12 and is arranged one step lower than the downstream side of the deliquidation net 16 of the pre-liquid removal unit 13. It reaches the lower box portion 25 that is communicated with the bottom of the tank 12 and is suspended. The upper part of the porous cover 24 protrudes on the liquid surface of the liquid tank 12 together with the collection net 23, and the lower part is fixed to the bottom surface of the liquid tank 12.

Therefore, the mixture D from the downstream of the liquid removal net 16 of the pre-liquid removal unit 13 is supplied onto the collection net 23 and then flows down inside the collection net 23.
The mixture D naturally flows down inside the collection net 23 and is sucked and flowed down by the pump 27 of the pipe 26 connected to the lower end of the collection net 23. The resist A in the mixture D is also sucked and flowed downward without floating on the liquid surface.
Then, the mixture D is reduced in diameter toward the lower side, and thus the inside of the collection net 23 is sucked and flowed down in this way, so that a considerable amount of the alkaline solution B that has been mixed is gradually removed from the collection net 23. It flows out to.
Accordingly, the mixture D is gradually concentrated toward the lower part of the collection net 23 where the diameter becomes smaller toward the lower side. Then, the mixture D is supplied to the resist collection unit 15 via a pipe 26 and a pump 27 connected to the lower end of the collection net 23.

On the other hand, it is as follows outside the collection net 23. That is, the alkaline solution B in the liquid tank 12 flows in through the hole of the porous cover 24, reaches the outer surface of the collection net 23, and is sucked by the pump 28 of the pipe 26 connected to the lower box portion 25. The Accordingly, together with the alkaline solution B that has flowed out of the collection net 23 as described above, the space between the porous cover 24 and the collection net 23 is sucked and flowed downward.
Such an alkaline solution B is circulated and supplied to the liquid tank 12 via the pipe 26 and the pump 28.
By the way, when the mixture D supplied to the resist recovery unit 15 via the pump 27 and the alkaline solution B supplied to the liquid tank 12 via the pump 28 are compared, the former is a thick resist A, a relatively large resist A. It can be expressed that the resist A in a broken piece is mixed, whereas the latter is mixed with only a very thin resist A or a microscopically small resist A.
The pumps 27 and 28 interposed in the pipe 26 are of an intermittent drive type, and are of a type in which suction driving and stopping are clearly and sequentially repeated.

<Register Recovery Unit 15>
Next, the resist collection unit 15 will be described with reference to FIG. The resist recovery unit 15 of the resist recovery apparatus 11 collects the resist A from the mixture D supplied from the resist concentration unit 14 and separates and recovers the alkaline solution B into the liquid tank 12.
That is, the resist collection unit 15 has a tank shape and is provided with a filtration net 29, and is a mixture containing the resist A that is supplied from the lower part of the collection net 23 of the resist concentration unit 14 through the pipe 26 and the pump 27 and concentrated. As for D, most of the resist A is collected and collected by the filtration net 29.
Then, the alkali solution B after being filtered by the filter net 29, that is, the alkali solution B obtained by removing most of the resist A from the mixture D, is supplied to the liquid tank 12 via the pipe 26. Supplied.
The resist collection unit 15 is as described above.

<< About the liquid tank 12 >>
Next, the liquid tank 12 will be described. As shown in FIG. 1 and the like, the lower part of the recovery chamber H of the resist recovery device 11 is a liquid tank 12, and the resist recovery device 11 and the recovery chamber H are disposed adjacent to the developing machine 1 and the peeling machine 2. Has been.
As shown in FIGS. 2 and 3, the alkaline solution B is dropped, collected, and stored in the liquid tank 12 from the upper pre-liquid removal unit 13. Further, the alkaline solution B from the lower box portion 25 is supplied, recovered, and stored via the pipe 26 and the pump 28. Further, the alkaline solution B is also supplied, recovered, and stored from the resist recovery unit 15 via the pipe 26 and the pump 27. Further, the alkaline solution B is dropped, recovered and stored from the defoaming net 31 of the bubble recovery unit 30.
At the same time, as shown in FIG. 1, the stored alkaline solution B is circulated and supplied to the developing machine 1 and the peeling machine 2 through the pipe 26 and the pump 32 for reuse. After being sprayed, it becomes a mixture D together with the resist A, and is supplied to the pre-liquid removal unit 13 of the resist recovery apparatus 11.
The liquid tank 12 is as described above.

<< About the foam collection | recovery part 30 >>
Next, the bubble collection | recovery part 30 is demonstrated with reference to FIG. 2, FIG. The resist collection device 11 is further provided with a foam collection unit 30 including a foam collection box 33, a liquefaction nozzle 34, and a defoaming net 31.
The foam collection box 33 is disposed on the resist concentrating unit 14 with a space therebetween, the lower surface is opened, and the foam G of the alkaline solution B above the mixture D is sucked.
The liquefying nozzle 34 injects the foam G supplied from the foam recovery box 33 onto the defoaming net 31. The defoaming net 31 liquefies the injected foam G, returns it to the alkaline solution B, and collects it in the liquid tank 12.

Such a bubble collection | recovery part 30 is further explained in full detail. A foam recovery box 33 of the foam recovery unit 30 is disposed at the center upper part of the recovery chamber H of the resist recovery apparatus 11, that is, on the center part of the liquid tank 12.
The foam recovery box 33 is formed in, for example, a cylindrical box shape with the lower surface opened, and the opened lower surface is opposed to the upper surface opening of the lower collection net 23 with a vertical interval.
In addition, a foam recovery wall 35 is formed around the outside of the recovery box 33. The bubble collection wall 35 has, for example, a cylindrical shape, and is suspended from the ceiling of the collection chamber 29 to the inside of the liquid tank 12. The foam collection wall 35 faces the liquid removal net 16 of the pre-liquid removal unit 13 from the side, and has a large opening 36. Is formed.

Therefore, the foam G on the upper side of the mixture D supplied from the liquid removal net 16 of the pre-liquid removal unit 13 passes through the opening 36 and the foam recovery box 33, and is a pump of the pipe 26 connected to the top end of the foam recovery box 33. The air is sucked at 37 and supplied to the liquefying nozzle 34.
Then, the bubbles G are jetted from the liquefying nozzle 34 to the defoaming net 31. The defoaming net 31 has a large number of densely formed net holes and is disposed on the liquid surface of the liquid tank 12 with a vertical interval.
Therefore, the foam G sprayed to the defoaming net 31 is crushed and destroyed by pressure and unevenness of the net hole, and is liquefied to become the original alkaline solution B, which is dropped, recovered and stored in the liquid tank 12. . The alkaline solution B collected in this way is also reused together with the alkaline solution B stored as described above.
The foam recovery unit 30 is as described above.

<About the action>
The resist recovery apparatus 11 of the present invention is configured as described above. Therefore, it becomes as follows.
(1) In the manufacturing process of the circuit board E, the mixture D of the alkali solution B after spray use and the photosensitive film removed from the substrate material C, that is, the resist A is supplied to the resist recovery device 11 (see FIG. 1). reference).
That is, the developer sprayed and used in the developing machine 1 in the developing process or the stripping liquid sprayed and used in the peeling machine 2 in the peeling process, that is, the alkali solution B and the minute fragments removed from the outer surface of the substrate material C The mixture D in which the photosensitive resist A is mixed is supplied from the developing device 1 or the peeling device 2 to the resist collecting device 11 attached thereto.

(2) In the supplied mixture D, the upper part is covered with the bubbles G, and the resist A having a lower specific gravity floats more in the upper part and is in the lower part in the lower part. → Therefore, the mixture D first flows on the liquid removal net 16 of the pre-liquid removal part 13 inclined downward of the resist recovery apparatus 11, → A considerable amount of the alkaline solution B is formed from the lower part of the mixture D, It is filtered, separated, dropped and recovered into the liquid tank 12 (see FIG. 2).
At this time, the pre-liquid removal unit 13 has a structure including a porous plate 17 with protrusions 18 under the liquid removal net 16, so that the alkaline solution B that has flowed down and dropped under the liquid removal net 16 Bounces, bounces, undulates, floats and sinks due to reversal by the projection and the lower flow by the protrusion 18, and then swings the liquid removal net 16 up and down and from the top of the porous plate 17 to the liquid tank 12. Dropped and recovered.
As described above, since the liquid removal net 16 is constantly shaken from below and refreshed, it is prevented that clogging occurs in the resist A in the mixture D flowing over it.

(3) Now, in this resist recovery apparatus 11, the mixture D from which a considerable amount of the alkaline solution B has been separated in the pre-liquid removal unit 16 is then supplied from the pre-liquid removal unit 13 to the resist concentration unit 14. Thus, the resist A is concentrated, and the alkaline solution B is separated and collected in the liquid tank 12 (see FIGS. 2 and 3).
That is, the mixture D supplied from the liquid removal net 16 of the pre-liquid removal unit 13 to the resist concentration unit 14 is a substantially inverted conical collection net of the resist concentration unit 14 erected in the liquid tank 12. The inside of 23 is sucked and flowed downward.
→ Therefore, a considerable amount of the alkaline solution B from the mixture D is filtered and separated by the collection net 23, flows out of the collection net 23, and is sucked and flowed downward → the piping. The liquid is sucked and collected into the liquid tank 12 via the pump 26 and the pump 28. → Therefore, the resist A in the mixture D is sequentially drawn, collected and concentrated toward the inner surface of the collection net 23 and then to the lower portion.

(4) Further, a cylindrical porous cover 24 is provided on the outer side of the substantially inverted conical collection net 23 of the resist concentrating portion 14.
-> Then, after the alkaline solution B in the liquid tank 12 flows into the porous cover 24, it is sucked and flowed downward along the outer surface of the collection net 23, and thus, the inside of the collection net 23 as described above. Together with the alkaline solution B that has flowed out and flowed out of the tank, it is sucked and collected into the liquid tank 12 through the pipe 26 and the pump 28 (see FIGS. 2 and 3). (In addition, in the alkaline solution B recovered through the pipe 26 and the pump 28 in this way, air after the slightly mixed foam G is crushed and destroyed also coexists.)
In this way, a flow of the same direction and the same pressure is formed inside and outside the collection net 23 of the resist concentration unit 14. In other words, inside the collection net 23, a flow is formed in which the mixture D containing the concentrated resist A is sucked and flowed downward, and outside, the alkaline solution B is sucked and flowed downward. A flow is formed. → Therefore, the collection net 23 is prevented from being clogged with the resist A in the mixture D.

(5) Now, the mixture D containing the concentrated resist A is supplied from the lower part of the collection net 23 of the resist concentrating unit 14 to the resist collecting unit 15 via the pipe 26 and the pump 27. (In the mixture D supplied through the pipe 26 and the pump 27 in this way, air after the bubbles G that have been slightly mixed are crushed and destroyed also coexists.)
→ And, the mixture D supplied to the resist recovery unit 15 is filtered, collected and recovered by the filter net 29 in the majority of the resist A, and the alkaline solution B is supplied to the liquid tank via the pipe 26. To 12 (see FIG. 3).

(6) It should be noted that the prevention of clogging is more reliably realized by adopting an intermittent drive type for the pumps 27 and 28 for sucking the mixture D and the alkaline solution B (see FIG. 3).
That is, by adopting intermittent drive type pumps 27 and 28, the mixture D is intermittently sucked toward the resist recovery unit 15, and the alkaline solution B is intermittently directed toward the liquid tank 12. By suction, the collection net 23 of the resist concentration unit 14 and the filtration net 29 of the resist collection unit 15 are subjected to suction waves and suction impacts, and thus clogged with the resist A in the mixture D. Is more reliably prevented.

(7) By the way, in the developing machine 1 or the peeling machine 2, the alkaline solution B sprayed and used as a developing solution or a peeling solution is made of an alkaline chemical solution containing caustic soda and is heated. Therefore, since a large amount of bubbles, that is, bubbles G are generated with the injection, the mixture D supplied from the developing device 1 or the peeling device 2 to the resist recovery device 11 also includes a large amount of bubbles G of the alkaline solution B. (See FIG. 1).
→ Therefore, the foam recovery unit 30 is disposed in the resist recovery device 11 (see FIGS. 2 and 3). → And the bubble G of the alkaline solution B is a bubble and is located above the mixture D. → After being sucked in the foam collection box 33 of the foam collection unit 30 on the resist concentrating unit 14, 26 is supplied to the liquefying nozzle 34 via the pump 37 and the pump 37, and then injected from the liquefying nozzle 34 to the defoaming net 31 and sprayed. → As a result, the foam G is crushed and destroyed on the defoaming net 31 to be liquefied, returned to the alkaline solution B, and then dropped into the liquid tank 12 and collected.
In addition, about the pump 37 which attracts | sucks the bubble G, squashing and liquefaction of the bubble G are promoted also by employ | adopting an intermittent drive type. Further, the bubbles G mixed in the mixture D and flowing into the resist concentrating portion 14 are crushed and destroyed when passing through the collection net 23 and returned to the alkaline solution B, and become air as the alkaline solution. It coexists in B and mixture D.
→ By such a process, the bubbles G that float the resist A on the liquid surface of the mixture D, and the bubbles G that make the separation and recovery of the resist A uncertain, are eliminated and eliminated. → And this is realized without using an antifoaming agent that may adversely affect the processing of the substrate material C.

(8) Now, the resist recovery apparatus 11 employs such a pre-liquid removal unit 13, the resist concentration unit 14, the bubble recovery unit 30, and the like.
→ Therefore, the resist A and the alkaline solution B are reliably separated and recovered, thereby improving the recovery efficiency of the resist A and extending the life life of the alkaline solution B. In the peeling machine 2, it becomes possible to repeatedly circulate and reuse (see FIG. 1).

(9) Since a considerable amount of the alkaline solution B is separated and recovered from the mixture D in advance in the pre-liquid removal unit 13, the subsequent amount is carried to the resist concentration unit 14 and supplied. The amount of mixture D to be reduced is reduced.
→ In addition to this, the resist concentrating unit 14 also separates and recovers a considerable amount of the alkaline solution B from the mixture D. → Further, it is necessary to carry and supply the resist collecting unit 15 by that amount. The amount of body D is reduced.
→ Therefore, the resist concentrating unit 14 and the resist collecting unit 15 can be downsized, and the resist collecting apparatus 11 is also downsized as a whole.

The resist recovery apparatus according to the present invention is a front cross-sectional explanatory diagram for explaining the best mode for carrying out the invention. It is a side cross-sectional explanatory drawing of the principal part for description of the best mode for carrying out the invention. FIG. 2 is an explanatory side sectional view of the whole for explaining the best mode for carrying out the invention. It is a front cross-sectional explanatory drawing for description of this kind of conventional example. It is plane explanatory drawing which modeled the board | substrate (board | substrate material).

Explanation of symbols

1 Developing Machine 2 Peeling Machine 3 Resist Collection Device (Conventional Example)
4 Filter 5 Chamber 6 Liquid tank (conventional example)
7 Pump (conventional example)
8 Piping (conventional example)
9 Spray nozzle 10 Roller conveyor 11 Resist collection device (present invention)
12 Liquid tank (present invention)
DESCRIPTION OF SYMBOLS 13 Pre liquid removal part 14 Resist concentration part 15 Resist collection | recovery part 16 Liquid removal net 17 Porous plate 18 Protrusion 19 Partition floor 20 Outlet 21 Supply pipe 22 Inlet 23 Collection net 24 Porous cover 25 Lower box part 26 Piping (this invention) )
27 Pump (present invention)
28 Pump (present invention)
29 Filtration net 30 Foam recovery part 31 Defoaming net 32 Pump (present invention)
33 Foam recovery box 34 Liquefaction nozzle 35 Foam recovery wall 36 Opening 37 Pump (present invention)
A Resist B Alkaline Solution C Substrate Material D Mixture E Circuit Board F Circuit G Foam H Recovery Chamber

Claims (8)

A resist recovery apparatus for recovering a resist from a mixture of a jetted alkaline solution and a removed photosensitive resist used in a circuit board manufacturing process, comprising a liquid tank and a pre-liquid removal unit , A resist concentrating part, a resist collecting part,
The pre-liquid removal part separates the alkaline solution from the mixture and collects it in the liquid tank.
The resist concentration unit concentrates the resist with respect to the mixture supplied from the pre-liquid removal unit and separates and recovers the alkaline solution into the liquid tank.
The resist recovery unit collects and recovers the resist from the mixture supplied from the resist concentration unit, and separates and recovers the alkaline solution into the liquid tank. apparatus. 2. The resist recovery apparatus according to claim 1, wherein the pre-liquid removal unit includes a liquid removal net, and the supplied mixture first flows over the liquid removal net, whereby a considerable amount of the alkaline solution is obtained. Is separated, dropped and collected into the liquid tank,
The resist concentrating unit includes a substantially inverted conical collection net standing in the liquid tank, and the mixture supplied from the liquid removal net of the pre-liquid removal unit is the collection unit. By sucking and flowing downward in the net, a considerable amount of the alkaline solution flows out of the collection net and sucks and flows downward to be sucked and collected into the liquid tank. The resist is sequentially concentrated toward the lower part of the collection net,
The resist collection unit includes a filtration net, and the mixture containing the resist supplied and concentrated from the lower portion of the collection net of the resist concentration unit is collected by the filtration net. , And the alkali solution is recovered into the liquid tank.   3. The resist recovery apparatus according to claim 2, wherein the resist recovery apparatus is attached to a developing machine in a circuit board manufacturing process, and the alkaline solution is made of a developer.   3. The resist recovery apparatus according to claim 2, wherein the resist recovery apparatus is attached to a peeling machine in a circuit board manufacturing process, and the alkaline solution is made of a peeling liquid. In the resist recovery apparatus according to claim 3 or 4, further, a foam recovery unit including a foam recovery box, a liquefaction nozzle, and a defoaming net is provided,
The foam recovery box is disposed on the resist concentrating part with a gap, the lower surface is opened, and sucks the foam of the alkaline solution at the top of the mixture,
The liquefaction nozzle sprays the foam supplied from the foam recovery box onto the defoaming net,
The defoaming net liquefies the jetted bubbles, returns them to the alkaline solution, and collects them in the liquid tank. 5. The resist recovery apparatus according to claim 3, wherein the pre-liquid removal portion is disposed at a vertical interval below the liquid removal net disposed at a downward inclination and below the liquid removal net. It comprises a structure comprising a perforated plate, and each protrusion standing on the perforated plate,
The alkaline solution dropped under the drainage net is bound and floated by the perforated plate and the protrusions, so that the drainage net is shaken from below and dropped from the perforated plate to the liquid tank. A resist collecting apparatus characterized by being collected. In the resist recovery apparatus according to claim 3 or 4, a porous cover is provided around the collection net of the resist concentrating portion with a gap therebetween,
The alkaline solution in the liquid tank flows into the porous cover, and is sucked and flowed downward along the outer surface of the collection net, and is sucked and collected into the liquid tank. A featured resist recovery device.   8. The resist recovery apparatus according to claim 5, wherein the pump for sucking the mixture, the alkaline solution, or the bubbles is of an intermittent drive type.

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