TWI313793B - Resist recycling device - Google Patents

Description

1313793 * IX. Description of the Invention: [Technical Field] The present invention relates to a device for recovering a resist. In other words, in the manufacturing process of a circuit board, a resist which is attached to a developing machine or a peeling machine, and an alkaline solution such as a developing liquid or a peeling liquid and a photosensitive resist are separated and recovered from the mixture. Recycling device. [Prior Art] "Technical Background" ® The high-precision, compact, and diversified circuit boards such as printed wiring boards are promoted by the high-performance, high-performance, compact, and lightweight electronic devices. The formed circuit is remarkably high in density and fine. Moreover, in the manufacturing process of such a circuit board, after the photosensitive laminate is coated or pasted into a film shape after the copper-clad laminate is also the outer surface of the substrate, the negative film of the radiation circuit is exposed. And the circuit forming portion is dissolved and removed by developing the resist, and the copper foil other than the circuit forming portion is dissolved and removed by etching, and then the circuit is formed into a portion of the resist agent' The film is removed, and a circuit is formed in a copper box on the outer surface of the base material, thereby manufacturing a circuit substrate. "Prior Art" Fig. 4 is a front cross-sectional explanatory view showing the description of such a prior art. Also, as shown in the figure, the above-described developing process or stripping process is to use the developing device 1 or the peeling machine 2' to make the resist A other than the circuit forming portion, or to perform hardening of the remaining circuit forming portion of the resist. A. The alkaline solution B' such as a developing solution or a peeling solution is sprayed and removed from the outer surface of the base material c, and is removed by 1313793 w. Further, the alkaline solution B used in the developing machine 1 or the peeling machine 2 and the small sheet-like resist A removed as a photosensitive film are mixed and mixed to form a downward flow. . Therefore, such a mixture D is supplied from the developing machine 1 or the peeling machine 2 to the attached resist recovery device 3, and the alkaline solution B and the resist A' developing solution or the peeling liquid are separated. The alkaline solution B is circulated and supplied to the developing machine 1 or the peeling machine 2, and the resist A is discarded. Further, as the recovery device 3 of such a resist, the filter type 4 or the mesh cylinder type shown in Fig. 4 is typically used. That is, the recovery device 2 of the prior art uranium-repellent agent supplies the mixture D, 'from the lower tank 6 of the chamber 5 of the developing machine 1 or the stripping machine 2 to the pump 7 or the pipe 8 The filter 4 or the mesh cylinder is thus filtered and separated by passing through the filter 4 or the mesh cylinder. Further, the alkaline solution B such as the recovered developing solution or the peeling liquid is supplied to the jet nozzle 9 of the developing machine 1 or the peeling machine 2 through the pipe 8 to be ejected and reused, and does not pass through the filter 4 or the mesh. ® Cylinder Resin A is captured, recycled, and discarded. In the figure, reference numeral 1 denotes a roller conveyor belt for conveying the base material c in the developing machine 1 or the peeling machine 2. "Prior Art Document Information" As such a prior example, for example, the previous example shown in the prior art of Patent Document 1 can be exemplified. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004_3 25 502 SUMMARY OF THE INVENTION [DISCLOSURE OF THE INVENTION] 1313793 ^ [Problem to be Solved by the Invention] However, the recovery device 3 of the resist of the prior art has the following The problem was accused. "First Problem" The first and the problem to be referred to are that "the separation and recovery of the resist A and the alkaline solution B are not reliable." The recovery efficiency of the resist A is not good, and the consumption of the alkaline solution B is severe. In other words, the circuit board is improved in precision, and it is extremely compact and extremely thin. The # formation circuit is significantly higher in density and finer. Therefore, the resist removed from such a circuit forming portion or a circuit forming portion is also remarkably fine. Therefore, the previous filter type 4 or mesh cylinder type resist recovery device 3 filters, separates, traps, and recovers resist A from the mixture D, but more recently It is not easy, and there is a tendency to be unrealized and difficult. Therefore, in the alkaline solution B such as the developing liquid or the peeling liquid recovered by the resist recovery device 3, a large amount of the resist A is easily mixed. When the alkaline solution B is circulated and supplied to the developing machine 1 or the peeling machine 2 and reused, the original function is to dissolve and remove the resist A from the base material C, and to remove and remove the function. decreasing gradually. Therefore, the life of the alkaline solution B such as the developing solution of the developing machine 1 or the peeling liquid of the peeling machine 2 is short, and the frequency of replenishment of the fresh liquid or the frequency of exchange with the fresh liquid becomes high, so that the cost burden is also increased. . For example, the degree that must be exchanged once a week. Further, when the developer 1 or the peeling machine 2 circulates and reuses the alkaline solution 1313793 liquid B' in which the resist A is mixed, the resist a is clouded, creamy, and pasted. 'It will precipitate and adhere to the inner wall of the liquid tank 6, and it will also cause the other mesh of the piping 8 to be blocked. Therefore, although it is necessary to perform cleaning or removal work, it is very troublesome and requires time or effort. "Second problem" The second problem is that the alkaline solution B' in the developing solution or the stripping solution is added to the defoaming agent from the prior art, but the defoaming agent is in the circuit of the base plate c. Forming can cause adverse effects and become a cause of defects in the circuit board. In other words, the developing machine or the peeling machine ejects the alkaline solution B such as the developing liquid or the peeling liquid from the spray nozzle 9 to the base material C. Therefore, in the vicinity of the base material C, bubbles of the alkaline solution B are generated by the ejection, but the bubbles, together with the mixture D, flow into the filter 4 or the mesh cylinder of the resist recovery device 3, This bubble causes the anti-contact agent A to float to the liquid surface, and the separation and recovery of the anti-catalyst A are not confirmed, and the recovery efficiency of the resist A is lowered. Therefore, as a countermeasure against this, the prior art has previously added an antifoaming agent such as an emulsion type diethyl ether type defoaming agent to the alkaline solution B. However, the antifoaming agent added as described above is adversely affected by the treatment of the base material sheet C, and it is likely to cause development failure, etching failure, and peeling failure, and defective products are produced on the manufactured circuit board. "3rd problem point" 3. The problem that is referred to is that the filter 4 or the mesh cylinder of the resist recovery device 3 is liable to cause mesh clogging and exchange of the filter 4 or the mesh cylinder. The frequency or maintenance frequency becomes higher and the cost increases. In other words, the corresponding method for the first problem, that is, the corresponding method for improving the filtration efficiency of the resist A by improving the filtration, separation, and recovery of the anti-1313793-etching agent A, and improving the recovery efficiency of the resist A The recovery device 3 of the agent must use a filter 4 or a mesh cylinder with a tighter mesh. However, as a result, it is easy to trap and accumulate the resist A in the filter 4 or the mesh cylinder to form a clogging. By the way, the recovery device 3 of the prior art uranium-repellent agent is used for the mesh, and the number of meshes per 1 inch (25 · 4 mm) is 2 〇 mesh degree as a limit, and the fine resist A is recovered. It is not enough, and it is easy to cause blockage. "4th Problem" φ 4th, the problem that is referred to is that the resist recovery device 3 is increased in size, taking up the installation space, and the cost is high. That is, the prior art resist recovery device 3 filters and separates the mixture D supplied from the developer 1 or the peeling machine 2 with the filter 4 or the mesh cylinder. The anti-touching agent A is trapped and the alkaline solution b is recovered. In other words, the multi-component mixture D to be supplied is filtered and separated in one treatment, so that the anti-contact agent recovery device 3 is increased in size. # "The present invention" The resist recovery apparatus of the present invention has been invented in order to solve the above problems of the prior art in view of such circumstances. Moreover, the present invention provides a recovery device for a resist, the purpose of which is to reduce the recovery efficiency of the table 1, the antimony uranium agent, the second, without the addition of an antifoaming agent, and the third, to prevent clogging of the mesh, the fourth, Miniaturize the device. [Means for Solving the Problem] "Regarding the Patent Application Range" 1313793 w The technical means of the present invention for solving such a problem is as follows. First, the first item of the patent application scope is as follows. The apparatus for recovering a resist according to the first aspect of the invention is used in a manufacturing process of a circuit board, from a mixture of the supplied alkaline solution after spraying and the photosensitive resist removed. Used to recover the resist. Further, it is characterized in that it has a liquid tank, a pre-liquid removal unit, a resist concentration unit, and a corrosion-receiving unit. The pre-liquid removal section separates the alkaline solution from the mixture and recovers it into the liquid tank. The resist concentrating portion is for concentrating the resist from the mixture supplied from the pre-liquid removal portion Φ, and separating the alkaline solution to be recovered in the liquid tank. The resist recovery unit collects and collects the resist from the mixture supplied from the resist concentration unit, and separates and collects the alkaline solution into the liquid tank. The second item of the patent application scope is as follows. The apparatus for recovering a resist according to the second aspect of the patent application is the first item of the patent application, characterized in that the pre-liquid removal unit is provided with a liquid-repellent net. Further, the supplied mixture is first passed through the liquid removal net, and a considerable amount of the alkaline solution is separated, dropped, and recovered into the liquid tank. The resist concentrating portion has a slightly conical trapezoidal net that is erected in the liquid tank. Further, the mixture supplied from the liquid removal net of the pre-liquid removal unit is sucked downward and downward in the collection net, so that a considerable amount of the alkaline solution flows out to the collection. Outside the net, it is sucked downward and downward to be sucked, recovered into the liquid tank, and the resist is sequentially concentrated toward the lower portion of the trap. The resist recovery unit is provided with a filter. Further, the mixture containing the concentrated anti-contact agent supplied from the lower portion of the trap network of the resist-10-1313793 • enrichment unit collects and recovers the resist by the filter. The alkaline solution is recovered into the tank. The third item of the scope of patent application is as follows. The apparatus for recovering a resist according to the third aspect of the patent application is as in the second aspect of the patent application, which is characterized in that the image is attached to a manufacturing process of a circuit board, and the alkaline solution is It is composed of liquid. The fourth item of the scope of application for patents is as follows. The apparatus for recovering a resist according to the fourth aspect of the patent application is the second item of the patent application, which is characterized in that: the stripping machine attached to the manufacturing process of the circuit board, and the alkaline solution is a stripping solution Composition. 'The fifth item of the patent application scope is as follows. The apparatus for recovering an anti-uranium agent according to the fifth aspect of the patent application is the third or fourth aspect of the patent application, characterized in that: further, a bubble recovery unit is provided, and a bubble recovery tank, a liquefaction nozzle, and a bubble are provided. Bubble net. Further, the bubble collecting tank is disposed at intervals in the resist concentrating portion, and is opened to open the bubble for attracting the alkaline solution in the upper portion of the mixture. The liquefaction nozzle ejects the air bubbles supplied from the bubble collecting tank to the bubble eliminating net. The bubble-eliminating network liquefies the bubble which is ejected and returns it to the alkaline solution, and recovers it into the tank. Item 6 of the scope of application for patents is as follows. The apparatus for recovering a resist according to claim 6 is the third or fourth aspect of the patent application, characterized in that the pre-liquid removal unit is provided by the liquid-repellent net provided with the inclination drop. And a structure in which a perforated plate disposed between the upper and lower intervals is held under the liquid-repellent net, and a projection of each of the protrusions erected on the perforated plate. Further, the alkaline solution dropped under the liquid-repellent net moves in the perforated plate and the protrusion, and the floating and sinking movement, so that the liquid-repellent net is shaken from below and is dropped from the perforated plate, and the liquid is recovered. groove. Item 7 of the scope of application for patents is as follows. The apparatus for recovering a resist according to claim 7 is the third or fourth aspect of the patent application, characterized in that the space is kept outside the trapping net of the resist enrichment portion and is porous. Covered around. Further, the alkaline solution in the liquid tank flows into the porous cover, and is sucked downward and downward along the outer surface of the collecting net, so that the liquid is sucked and recovered. The eighth item of the patent application scope is as follows. Patent Application No. 8 • The resist recovery device described in the patent application is in the fifth or seventh aspect of the patent application, characterized in that: the alkaline solution or the pump for attracting the mixture It is composed of intermittent drive type. <<Operation and the like>> The apparatus for recovering a resist of the present invention is constituted by such a device, so that it is formed as follows. (1) In the manufacturing process of a circuit board, an alkaline solution such as a developing solution or a peeling liquid used for spraying on a developing machine or a peeling machine, and a small fragment-like photosensitive property removed from a base material as a photosensitive film The mixture of the resists is supplied to the recovery device of the attached resist. (2) Further, the 'mixture is firstly passed through a liquid-repellent net of the pre-desorbing section' to cause a considerable amount of the test solution to be separated and dropped to be recovered into the liquid tank. At this time, the alkaline solution dropped under the liquid-repellent net is hopped, floated and moved in the -12- 1313793* plate with the protrusion, and the liquid-repellent net is shaken from below, so the liquid-repellent net is kept clean. To prevent clogging due to the resist in the mixture. (3) The second mixing system is supplied to the trapping net of the resist enrichment unit, and is sucked and descended downward in the slightly conical trapping net. Therefore, a considerable amount of the alkaline solution flows out of the trapping net, is attracted, flows downward, and is sucked and recovered into the liquid, and the resist is sequentially collected toward the lower portion of the trapping net. Concentrate. (4) On the outside of the trapping net, the porous cover is placed around, so that the alkaline solution in the liquid tank β passes through the porous cover, is attracted along the outside of the trapping net, flows down to the lower side, and thus the trapping net The alkaline solution flowing out is sucked and recovered into the liquid tank. In this way, a flow in the same direction and at the same pressure is formed inside and outside the trapping net to prevent clogging of the trapping net due to the resist in the mixture. (5) Further, the mixture containing the concentrated resist is then supplied from the lower portion of the collecting net to the uranium recovery unit, and the resist is collected and recovered by the filter, and the alkaline solution is recovered into the liquid. groove. ♦ (6) Also, for the pump for attracting the mixture and the alkaline solution, if the intermittent drive type is used, the trapping net or the filter can more reliably prevent clogging due to the resist in the mixture. (7) However, with the ejection in the developing machine or the peeling machine, the mixture of the recovery means supplied to the resist is a large amount of bubbles with an alkaline solution. Therefore, in the resist recovery device, a bubble recovery portion is provided. Further, the bubble is sucked into the bubble recovery tank and ejected from the liquefaction nozzle toward the bubble elimination net, so that it is liquefied and returned to the alkaline solution, and is recovered into the liquid tank. Also, -13- 1313793 * For the pump used to attract air bubbles, use the intermittent drive type to promote the liquefaction of the bubbles. As a result, the bubbles are eliminated, that is, the resist is floated on the liquid surface of the mixed liquid, and the resist is separated and the bubbles which are not confirmed are recovered. Moreover, this is achieved without using an antifoaming agent which adversely affects the treatment of the base sheet. (8) In the resist recovery apparatus, the resist and the alkaline solution are surely separated and recovered. (9) Further, in the pre-desorbing section, the amount of the alkaline solution is relatively separated and recovered in advance. Therefore, the amount of the mixture supplied to the resist enrichment portion can be reduced only in this portion, and further, the resist is removed. Since the agent concentration unit also separates and recovers the alkaline solution, the amount of the mixture supplied to the resist recovery unit can be reduced only in this portion. Therefore, the resist concentrating portion or the resist collecting portion is miniaturized, and the resist recovery device is also miniaturized. (10) Therefore, the apparatus for recovering a resist of the present invention exerts the following effects. [Effect of the Invention] ® "First Effect" First, the recovery efficiency of the resist is increased, and the service life of the alkaline solution is prolonged, and the cleaning operation is also simple and easy. In other words, in the apparatus for recovering a resist according to the present invention, first, in the pre-desorbed portion, the alkaline solution such as a developing solution or a stripping solution is separated from the lower side of the resist, and then In the resist concentration unit, the resist is concentrated, and the alkaline solution is further separated and recovered. Finally, the concentrated resist is collected and recovered in the resist recovery unit, and the alkaline solution is separated and recovered. 1313793 * In this way, the resist and the alkaline solution are smoothly and surely separated and recovered. The resist which has been miniaturized recently has been reliably separated and recovered. Further, such separation and recovery are also promoted in terms of eliminating air bubbles or preventing clogging. Therefore, the case where the resist recovery means of the prior art such as the filter type or the mesh cylinder type described above is mixed with a large amount of the resist in the recovered alkaline solution can be avoided. The recovered alkaline solution can be supplied to the display machine or the stripper in an unlimited number of times for reuse and recycling. # Therefore, compared with this previous example, the recovery efficiency of the resist can be greatly improved, the consumption of the alkaline solution is reduced to 1/3, the service life of the alkaline solution becomes long, and the supplementary frequency or exchange frequency decreases. And the cost burden is reduced.譬 - For example, you can exchange 1 degree between 2 and 3 weeks. Further, the resist mixed in the alkaline solution for recycling is also reduced in whiteness, creaminess, paste formation, precipitation, and adhesion in a developing machine or a peeling machine, which requires labor or time. The number of cleaning operations and removals has also been greatly reduced. ♦ "Second effect" Second, no defoaming agent is added, so that the circuit board to be manufactured is prevented from being defective. That is, in the apparatus for recovering a resist of the present invention, a system for eliminating bubbles of an alkaline solution is formed by the bubble collecting portion. In the above-described conventional example, since the system in which the antifoaming agent is not added to the alkaline solution such as the developing solution or the stripping solution in advance, there is no defect such as development failure, etching failure, peeling failure, etc., which is not caused by the antifoaming agent. It will produce a bad shadow for the treatment of the base plate by the defoamer 1313793. Therefore, it is possible to avoid the occurrence of defective products due to the defoaming agent for the circuit board to be manufactured. "Third Effect" Third, to prevent clogging, the mesh density can be made closer. That is, the apparatus for recovering the resist of the present invention is kept clean by the shaking of the liquid-repellent net in the pre-desorbing section, or flows in the same direction and at the same pressure inside and outside the trapping net in the resist enrichment section. It is formed by using a batch-driven pump or the like to prevent clogging of the liquid-repellent net, the trapping net, and the filter. Φ Therefore, compared with the above-described conventional resist recovery device, the exchange frequency of the mesh or the like can be greatly reduced, and the maintenance frequency is also reduced, which is extremely advantageous at the cost level. Further, recently, with the miniaturization of the circuit, the anti-uranium agent has been remarkably finely smeared, but the clogging is prevented, so that a net of 200 mesh eyes can be used. For the liquid-repellent net, the trapping net, the filter net, etc., the number of meshes per 1 inch (25 · 4 mm) which is extremely superior to the fine resist can be 200 mesh. Therefore, the recovery efficiency of the resist can be improved from this level as compared with the above-described first-stage resist recovery apparatus which is limited to the extent of 20 mesh. "Fourth effect" Fourth, the device is miniaturized. In other words, in the apparatus for recovering a resist according to the present invention, the developing solution or the stripping liquid is separated and recovered in the order of the pre-desorbing unit, the resist enriching unit, and the resist collecting unit. Alkaline solution. Therefore, since the anti-hungry agent and the alkaline solution are formed by filtering, separating, and recovering at one time, the device is smaller than the above-mentioned conventional anti-1313793 etchant recovery device which is large in size. . Therefore, it does not occupy the installation space, and the price is also half the degree, etc., and is extremely superior in terms of cost. In this way, the problems existing in the prior art and the like can be all solved, and the effects exerted by the present invention are more significantly increased. [Embodiment] [Best Mode for Carrying Out the Invention] <<Related Modes>> Hereinafter, the apparatus for recovering a resist of the present invention will be described in detail based on the best mode of the invention shown in the drawings. Fig. 1, Fig. 2, and Fig. 3 are explanatory views showing an embodiment of the present invention. Further, Fig. 1 is a front cross-sectional explanatory view, and Fig. 2 is a side view of an important portion _ cross-sectional explanatory view, and Fig. 3 is a side cross-sectional explanatory view of the whole. - Fig. 5 is a schematic plan view of a substrate (base plate). <<Circuit Substrate E>> This resist recovery device 11 is used in the manufacturing process of the circuit board E. Therefore, first, referring to Fig. 5, the outline state Φ of the circuit board E will be described. The circuit board E is an AV device, a personal computer, a mobile phone, a digital camera, and various other electronic devices. It is used for electrical connection, and is formed on the outer surface or inside of the insulating layer in order to connect the circuit F pattern between the parts. Further, the circuit board E is divided into a single-sided substrate and a double-sided substrate, and has a multilayer substrate (including a substrate of a recent build-up method), and various other substrates may be divided into a rigid rigid substrate and a film-like substrate. Flexible substrate. In addition, as one of the circuits of the circuit board E, a module substrate in which a semiconductor such as a 1C, an L-IS element, a 1313793 driven component, a driving component, and a capacitor is integrated is integrated (a semiconductor-integrated package glass substrate together) CSP, PBGA, etc. are also used for a glass substrate or a liquid crystal LCD for a PDP having a circuit F and a semiconductor component. Of course, the present specification E is in addition to the printed wiring substrate of the prior art. In addition, the circuit board E is high-precision, compact, and multi-layered, and is versatile, etc., on the outer surface (one of the The circuit F formed by the both sides is remarkably high-density and finer in the internal path F. • The circuit board E is, for example, a printed wiring board, and the cut size to be manufactured is, for example, about 500 mm X 5 0 mm. The thickness of the fine edge layer (heart profile), from the previous technology of 1. 6mm to the extent, is now from 50μηι to 1 Ομηι, is extremely thinned to 0 (copper box part) thickness, prior art 7 5 μ m~3 5 μ m, ~1 〇μιη, is also extremely thinned. The case of multi-layer substrate is 1 _0mm~0.4mm, and is also extremely thin. Circuit] space, prior art system 30 μ In the case of m to 1 5 μm, there is a tendency to become finer. The circuit board E is formed in such a state of the outline. "One example of the method of manufacturing the circuit board E" Next, the recycling device 1 using the resist 1 "Parts, and circuit F: substrate", or in the glass substrate, that is, the electric glass substrate, the so-called circuit base also includes these wide-ranging, high-function, and extremely thin, surface or back side When the electric i is formed, the vertical and horizontal I of one piece are formed. The thickness is absolutely l-0mm ~ 60μιη :. Circuit F part and now the current thickness of 16 μm, the total thickness F amplitude or circuit F main system about 10 μ m

The manufacturing method of the circuit board E-18-1313793 is demonstrated with reference to FIG. 5, FIG. 1, etc. First, the manufacturing method of the first example is stated. In the manufacturing method, the circuit board is manufactured by wiring the printed circuit board according to the following steps. First, the copper foil is laminated on the surface of the insulating layer (heart material) made of glass cloth, ceramic, film-like polyimide or other resin, and the copper foil is laminated by hot pressing or the like to prepare a copper laminate. The plate is also the base plate C. Then, the base material C prepared in this manner is subjected to roughening treatment (soft etching) on the surface of the copper box to which the roughening is applied, and then cut into pieces of a short spring processing size. The surface roughening treatment was carried out by mechanical honing in the prior art, but it has recently been carried out by spraying of the treatment liquid. Further, in many cases, the perforation processing for the through holes is carried out using a laser or the like. The through hole is formed by a fine through hole between the outer surfaces of the base plate C (circuit board E), and a through hole having a diameter of several hundred or more is formed for one piece, and the diameter thereof is formed to a degree of 0.5 mm to 0.2 mm. The following is more. Further, the through hole is used for the conduction connection between the circuits F (copper foil) on the outer surfaces of the two outer surfaces or the circuit F (copper foil) of the multilayer substrate, or the mounting of the semiconductor component Φ mounted on the circuit F. Further, recently, a through hole which is required to be punched is formed, and a small protrusion is formed. The contact of the slightly conical trapezoid is also convex. Therefore, with respect to the multilayer substrate or the like, the technique of realizing the same function as the through hole by the protrusion is also developed. . The bulging is based on the circuit F and is manufactured according to the developing process, the etching process, and the stripping process. Then, on the outer surface of the copper foil of the base material C, the photosensitive resist A is applied or adhered to form a film. The dry film of resist a is also pressed more. Then, the negative of the circuit F is the electric -19-1313793 'F picture of the circuit F pre-designed, and by exposure, the resist A of the outer surface is exposed and the portion F of the hardened circuit F is formed ( The protective film portion), and other unnecessary portions, are removed by the treatment liquid, that is, the developing solution, that is, the spraying of the alkaline solution B. Then, the copper box of the base material C is formed by curing the anti-uranium agent A and leaving a portion (protective film portion) of the circuit F which is covered, and dissolving and removing the resist A by development to make the exposed portion unnecessary. In part, by the treatment liquid, that is, the blasting liquid (second copper chloride, second iron chloride, other etching liquid), the solution is dissolved and removed. Then, the residual circuit F forms part of the resist a, which is peeled off by the discharge of the treatment liquid, that is, the stripping solution, that is, the alkaline solution B. Therefore, a part of the copper foil is formed by the residual circuit F. The outer surface of the sheet C is used to form a circuit F of a predetermined conductor pattern, and the circuit board is manufactured. E ° Further, in the above-mentioned developing process, etching process, and stripping process, the respective post-processing, or peeling After the membrane process, the post-treatment is concentrated, and a washing process for spraying the washing liquid, the neutralizing agent liquid, and other washing liquid is attached. In the cleaning system, the processing liquid such as a developing solution, an etching solution, or a peeling liquid adhering to the outer surface of the base material C (including the through hole) is washed and removed. Further, after the washing process, a drying process is attached. In other words, in the outer surface (including the through hole or the like) of the base material C washed by the cleaning process, the washing liquid, the other washing liquid, or the like is adhered thereto, so that it is removed in order to prevent oxidation or the like. Therefore, the drying process is carried out immediately after the drying process. The manufacturing method of the first example is constituted by such a wet processing method. The manufacturing method of the first example is constructed in this way. -20 - 1313793 'Other examples of the method of manufacturing the circuit board E>> Next, the manufacturing method of the second example will be described. Circuit board E 譬 The method of manufacturing a printed wiring board, the wet processing method of the first example described above is a representative example, but the semi-additive method of the second example is also often used. The semi-additive method is first applied to the surface of the base material C on which the through holes are formed in advance, and the electroless copper is applied. Then, after the photosensitive resist A is applied or pasted into a film shape on the electroless copper plating, the circuit F film, that is, the circuit F photo is exposed. Further, the resist A is exposed while being hardened, and the other portion is the portion where the circuit F is formed, and is dissolved and removed by the ejection of the treatment liquid, i.e., the developing solution B, that is, the alkaline solution B. Then, the electric-mineral-copper forming circuit F is applied to the portion where the circuit F is formed, i.e., the portion of the plating pattern in which the resist A is dissolved and removed, i.e., the portion where the electroless copper is exposed. Further, the cured resist A other than the portion where the residual circuit F is formed is peeled off by the spraying of the treating liquid, that is, the stripping liquid, that is, the alkaline solution b, and the exposed electroless copper is used. The treatment liquid, that is, the ejection of the etching liquid, is quickly etched to be melted and removed. Further, as a process after the second stage of the respective processes, the washing process by the cleaning liquid or the drying process is attached as described above. The semi-additive method of the second example is such that the circuit F is formed by electroplating copper, and thus the circuit board E is manufactured. The manufacturing method of the second example was formed in this manner. However, the methods for manufacturing printed wiring boards and other circuit boards E have recently become more diverse, and various other methods have been developed and used in addition to the first and second examples described above. The present invention is of course also applicable to the manufacturing method of such various circuit substrates E. 1313793 The manufacturing method of the circuit board E is formed in this way. <<Review of Resin Recycling Apparatus i i>> Hereinafter, the resist recovery apparatus 1 of the present invention will be described with reference to Fig. 2 and Fig. 3, and will be described. First, as a premise, in the manufacturing process of the circuit board E, as described above, the developing process or the peeling process is to spray the alkaline solution B such as the developing liquid or the peeling liquid to the substrate C to be conveyed, from the base material C. The outer surface is used to remove the photosensitive resist A. That is, as shown in Fig. 1, in the chamber 5 of the developing machine 1 or the peeling machine 2, a conveyor belt such as a roller conveyor belt 10 is disposed opposite to the base material C to be horizontally conveyed. Each of the spray nozzles 9 is sprayed with an alkaline solution containing, for example, a caustic alkali of 3%, that is, an alkaline solution B composed of a developing solution or a stripping solution. Therefore, the photosensitive resist A on the outer surface of the base material sheet C is removed. That is, the developing machine 1 dissolves and removes the resist A other than the portion where the circuit F is formed, and the peeling machine 2 strips the resist A of the portion where the circuit F is formed. In the manufacturing process of the circuit board E for the uranium-removing agent, the manufacturing process of the circuit board E is used as a development process of the developing process or the peeling process, and is attached to the developing machine 1 or the peeling machine 2, respectively. In the case of the developing process, the developer 1 is supplied with the alkaline solution B after the ejection, that is, the mixture of the developing liquid and the removed resist A, to the attached resist. Recycling device Π. In the case of the stripping process, the stripping machine 2 is used to supply the alkaline solution B after the spraying, that is, the stripping liquid, and the mixture D of the removed resist A, to the attached resist. 22 - 1313793 'Recycling unit 1 1. The resist recovery device 1 1 separates and recovers the resist A from the mixture D of the alkaline solution B and the photosensitive resist A thus supplied. Further, the liquid tank 12, the pre-liquid removal unit 13', the resist concentration unit 14, the resist recovery unit 15, the bubble recovery unit 30, and the like are provided. The resist recovery device 1 1 constitutes such a schematic state. Hereinafter, the detailed structure will be described. <<About Pre-Liquid Part 1 3 φ First, the pre-deliquoring unit 13 will be described with reference to Fig. 2 and the like. The pre-liquid removal unit 13 of the resist recovery device 1 1 is provided with a mixture D supplied from the liquid removal net 16 and first flows through the liquid removal network 16 to make a considerable amount. The alkaline solution B was separated, dropped, and recovered into the liquid tank 12 . That is, the pre-liquid removal unit 13 is composed of a liquid-repellent net 16 provided with a downward inclination, and a perforated plate 17 which is disposed to be vertically spaced apart from the liquid-repellent net 16 and on the perforated plate 17 It is composed of a structure in which a large number of protrusions 18 are arranged. Moreover, the alkaline solution B which flows down and falls under the liquid-repellent net 16 is reversed, jumped, and floated and moved by the multi-perforated plate 17 and the protrusions 18, so that the liquid-repellent net 16 is shaken from below while being from the perforated plate 1 7 is dropped toward the liquid tank 12 and recovered. This pre-desorbing section 13 is described in more detail. First, the mixture D, as shown in Fig. 1, falls down on the slightly inclined interval bottom surface 19 in the chamber 5 of the developing machine 1 or the peeling machine 2, and then flows obliquely therethrough. Further, the discharge port 20 passes through the supply pipe 2 1, and flows into the retracting device 1 1 of the resist via the inlet port 22. Further, the mixture D, -23-1313793', which is supplied to the recovery device 1 1 of the resist, first flows through the pre-desorbing portion 13 which is disposed at the upper and lower intervals of the liquid surface of the liquid tank 12 De-liquid network 1 6 on. As shown in Fig. 2, the liquid-repellent net 16 is such that a fine mesh is closely formed in a large number, and a slightly long-plate mesh is formed at the same time, and the diameter of the mesh is set to be even a fine resist A. The size of the mesh that cannot pass, for example, is set to a number of ΙΟμιη to several μπι, and 200 mesh. Further, it is disposed such that the liquid-repellent net 16 is slightly inclined in the longitudinal direction. The mixture D flows on the liquid-repellent net 16 from the upstream side toward the downstream side of the inlet 22 toward the downstream side. Therefore, a considerable portion of the alkaline solution mixed in the mixture D is filtered and separated in the cell of the liquid-repellent net 16 and falls through the lower perforated plate 17 toward the lower liquid tank 12 - go with. - Next, the perforated plate 17 of the pre-liquid-removing portion 13 is vertically spaced apart from the liquid-repellent net 16 and arranged in parallel, and the recovery holes are formed in a large number. As the perforated plate 17, for example, a perforated plate is used, and a plurality of small recovery holes (the pore size is much larger than the mesh of the liquid-repellent net 16) are formed, and at the same time, a length which is symmetrical with the liquid-repellent net 16 of the upper crucible is formed. The plate shape is arranged and fixed at a symmetrical inclination angle. Further, a plurality of projections 18 are erected and fixed on the perforated plate 17, and function as a liquid cutting rod (1 i q u i d c u t b a r). The projections 18 are arranged to be spaced apart from each other in the front-rear direction (upstream and downstream directions), and the height dimension thereof is set to be halfway between the liquid-repellent net 16 and the perforated plate 17 . Therefore, the alkaline solution B separated and dropped from the mixture D in the liquid-repellent net 16 is dropped through the recovery hole of the lower porous plate 17 toward the liquid tank 12 of the lower -24 - 1313793. A considerable portion is on the way, and the surface portion other than the recovery hole of the perforated plate 17 is reversed and jumped back. Further, the alkaline solution B is subjected to a jump 'floating and sinking' and flowing through the perforated plate 17. Further, the jumping and floating movement of the alkaline solution B is a function of stopping the flow of the projections 18 which are erected on the perforated plate 17, and is greatly promoted. Therefore, 'the liquid-repellent net j 6 of the upper position is shaken up and down by jumping, floating and sinking movement', so that the anti-clamicide A ' flowing in the mixed bowl of the liquid-repellent net 16 is prevented from being precipitated and adhered to On the liquid removal net 16 . That is, the mesh of the liquid-repellent net φ 16 is prevented from being clogged. The pre-liquid removal unit 11 is configured as described above. <<Resist Concentration Unit 1 4>> Next, the resist enrichment unit 14 will be described with reference to Figs. 2 and 3 . • The anti-treat agent concentration unit 14 of the uranium-removing agent recovery device 1 1 concentrates the resist a on the mixture D supplied from the pre-desorbing unit 13 while separating the alkaline solution B to recover the liquid. Slot 1 2. In other words, the resist enrichment unit 14 includes a slightly inverted-conical trapezoidal net 23 that is erected in the liquid tank 12, and is supplied from the liquid-repellent net 16 of the pre-liquid removal unit 13 The mixture D' is sucked downward in the trap net 23 and flows downward. Therefore, the mixture D causes a considerable amount of the alkaline solution b to flow out to the outside of the collecting net 23, and is sucked downward and downward, and is sucked and recovered into the liquid tank 12' so that the resist A faces the collecting net 23 The lower part of the inner part is concentrated in order. Further, on the outer side of the collecting net 23 of the resist concentrating portion 14, the porous cover 24 is provided around the periphery and maintained at intervals. Therefore, the alkaline solution -25 - 1313793 'B in the liquid tank 1 2 flows into the porous cover 24 while being sucked downward and downward along the outer surface of the collecting net 23, and therefore, is directed toward the liquid tank 12 Attraction and recycling. It is stated in more detail for the resist enrichment unit 14 . In the central portion of the liquid tank 12, the collecting net 23 and the porous cover 24 are erected in a concentric shape. That is, the collecting net 23 is formed such that the upper surface thereof is opened and becomes smaller in diameter, forming a slightly inverted conical shape, and at the same time, the fine mesh is closely formed. The diameter of the mesh is set so that even if the refining resist A cannot pass through the mesh size, for example, it is set to a degree of several ΙΟμπ) to several μm, and the degree of mesh is 200. Further, the porous cover 24 having a cylindrical shape is provided on the outer side of the collecting net 23, and the porous cover 24 is provided with a plurality of small holes (the hole diameter is much larger than the mesh of the collecting net 23). ). The upper portion of the collecting net 23 protrudes from the liquid surface of the liquid tank 12, and is disposed at a lower portion than the downstream side of the liquid-repellent net 16 of the pre-liquid removing portion 13, and the lower portion of the collecting net 23 is connected to the liquid. The groove 12 is lowered and reaches the lower portion 25 of the lower portion. The upper portion of the porous cover 24 protrudes from the trapping net 23 on the liquid surface of the liquid tank 12, and the lower portion is fixed to the bottom surface of the liquid tank 12. Therefore, the mixture D downstream of the liquid removal net 16 of the pre-liquid removal unit 13 is supplied to the collection net 23, and then flows downward in the collection net 23 downward. Further, the mixture D is naturally descended inside the collecting net 23, and is sucked and descended by the pump 27 connected to the pipe 26 at the lower end of the collecting net 23. The resist enthalpy in the mixture D does not float on the liquid surface, and is attracted downward and downward toward the bottom. In addition, the mixture D is formed in the trapping net 2 3 -26· 1313793 ' of the smaller diameter, and is attracted and flows downward, so that a considerable amount of the alkaline solution B is mixed, and the body is slowly caught. The network 2 3 outflows. Therefore, the mixture D is formed so as to form a lower portion of the trapping net 2 3 which is smaller in diameter, and the residual resist A is gradually concentrated. Further, the mixture D is supplied to the resist recovery unit 15 via a pipe 26 and a pump 27 connected to the lower end of the collecting net 23. In contrast, the outer portion of the trap portion 23 is formed as follows. That is, the alkaline solution B in the liquid tank 12 flows through the hole of the porous cover 24, reaches the outer surface of the collecting net 23, and is sucked by the pump 28 connected to the pipe 26 of the lower tank portion 25. Therefore, the porous solution B flowing out of the outside of the collecting net 23 is sucked and descended downward between the porous cover 24 and the collecting net 23. Further, the alkaline solution B is passed through the pipe 26 and the pump 28, and is circulated and supplied toward the liquid tank. However, when the mixture D supplied to the resist recovery unit 15 by the pump 27 and the alkaline solution B supplied to the liquid tank 12 by the pump 28 are compared, the former is rich in the resist A and mixed. The large fragment of the resist A, in contrast, the latter is an extremely thin anti-uranium agent A, and only a small resist A is mixed therein. Further, the pumps 27 and 28 interposed in the pipe 26 are constituted by an intermittent drive type, and are driven and stopped by suction, and are configured by a clear repeating type. <<Resist Recycling Unit 15>> Next, the resist collecting unit 15 will be described with reference to Fig. 3 . The resist recovery unit 15 of the resist recovery device 1 1 collects the resist A from the mixture D supplied from the resist concentration unit 14 while the alkali -27 - 1313793 solution is used. B is separated toward the tank 12 to 'recover. In other words, the resist recovery unit 15 includes a filter 29 having a groove shape, and a mixture containing the concentrated resist A supplied from the lower portion of the collection net 23 of the resist concentration unit 14 through the pipe 26 or the pump 27. In the body D, most of the resist a is collected and recovered by the filter 29. Further, the alkaline solution B filtered by the filter 29 removes most of the resist A from the mixture D, and the obtained alkaline solution B is supplied to the liquid tank 12 via the pipe 2-6. . The resist recovery unit 15 is configured as described above. <<About the liquid tank 1 2>> Next, the liquid tank 1 2 will be described. As shown in Fig. 1 and the like, the lower portion of the recovery chamber of the anti-corrosion agent recovery device 1 is formed with a liquid bath 2, a resist recovery device 1 and a recovery chamber, which are attached to the image forming machine 1 Or the stripping machine 2 is arranged adjacent to each other. Iaim no, pre-off from the upper position and the liquid tank 12 is as shown in Figure 2.

The liquid portion 13 drops, collects, and stores the alkaline solution B. Further, the alkaline solution B from the lower tank portion 25 is supplied, recovered, and stored by the pipe 26 or the pump 28. Further, the alkaline solution B is supplied, collected, and stored from the resist recovery unit 15 through the pipe 26 or the pump 27'. Further, the alkaline solution b is also dropped, recovered, and stored from the bubble-removing net 31 of the bubble recovery unit 30. At the same time, as shown in Fig. 1, the stored test solution B is circulated and supplied to the developing machine 1 or the peeling machine 2 through the pipe 26 or the pump 32' for reuse, and is ejected from the injection nozzle 9 thereof. Thereafter, the mixture is mixed with the resist to form a mixture D, and is supplied to the pre-desorbing portion η of the anti-contact agent recovery device. -28 - 1313793 The liquid tank 12 is formed in this manner. <<About the bubble collecting unit 30>> Next, the bubble collecting unit 30 will be described with reference to Figs. 2 and 3 . The resist recovery device 1 1 is further provided with a bubble recovery unit 30, and includes a bubble recovery tank 33, a liquefaction nozzle 34, and a bubble elimination net 31. Further, the bubble recovery tank 33 is disposed at an interval between the uranium-improving agent enrichment unit 14 to provide a bubble G which is opened to attract the alkaline solution B in the upper portion of the mixture D. The liquefaction nozzle 34 ejects the bubble G supplied from the bubble collecting tank 33 toward the bubble eliminating net 31. The bubble-removing net 3 1 is used to liquefy the injected bubble G, and returns to the alkaline solution B, and is recovered toward the liquid tank 12. This bubble recovery unit 30 will be described in more detail. In the central upper portion of the recovery chamber 抗蚀 of the resist recovery device 11, that is, at the central portion of the liquid tank 12, a bubble recovery tank 33 of the bubble recovery portion 30 is disposed. The bubble collecting tank 3 3 is opened, for example, in a cylindrical box shape, and the lower surface of the bubble collecting box 3 is opened and closed to be spaced apart from the upper surface of the lower collecting net 23, and is located at the opposite position. Further, a bubble recovery wall 35 is formed on the outer circumference of the recovery tank 33. The bubble recovery wall 3 5 is formed into a cylindrical shape, and is disposed from the top of the recovery chamber 29 to the liquid tank 1 2 and is disposed on the liquid-repellent net 16 of the pre-liquid removal portion 13 from the side surface, and is formed to have a large shape. Opening 36. Therefore, the bubble G in the upper portion of the mixture d supplied from the liquid removal net 16 of the pre-liquid removal unit 13 is connected to the pipe at the top end of the bubble recovery tank 3 through the opening 36 and the bubble recovery tank 33. 2 6 of the chest 3 7 is attracted, so it is supplied to the -29 - 1313793 ' liquefaction nozzle 34. Further, the bubble G is ejected from the liquefaction nozzle 34 to the bubble elimination net 31. The bubble net 3 1 is formed so that a large number of meshes are formed in a tight majority, and the liquid level of the liquid tank 1 2 is kept spaced apart from each other. Therefore, the bubble G which is ejected to the defoaming net 31 is collapsed and liquefied by the unevenness of the shot and the mesh, and becomes the original alkaline solution B, which is dropped, recovered, and stored in the liquid tank 12. The alkaline solution B thus recovered is also reused together with the alkaline solution B stored as described above. The φ bubble collecting unit 30 is configured as described above. <<About action and the like>> The resist recovery device 1 1 of the present invention is constituted as described above. Therefore, it is formed as follows. (1) In the manufacturing process of the circuit board E, the photosensitive film removed from the alkaline solution B and the base material C after the ejection, that is, the mixture D with the resist A, is supplied to the resist recovery device. 1 1 (refer to Figure 1). That is, the developing liquid sprayed by the developing machine 1 of the developing process or the peeling liquid sprayed by the peeling machine 2 of the peeling process, that is, the alkaline solution B, and the outer surface of the base material C are used. The finely flaky photosensitive resist A removed and the mixed mixture D are supplied from the developing machine 1 or the peeling machine 2' to the attached resist recovery device 1 1 . (2) The supplied mixture D covers the upper portion of the bubble G ′ while forming a state in which the resist A having a light specific gravity floats more and more at the upper portion, and the lower portion is less. Therefore, the mixture D, firstly, passes through the de-liquidizing net 16 of the pre-desorbed portion 13 of the falling inclined portion of the recovery device 1 1 of the resist, and from the lower portion of the mixture D -30 - 1313793 • A considerable amount of the alkaline solution B is filtered, separated, and dropped, and is recovered toward the liquid tank 12 (refer to Fig. 2). At this time, the pre-desorbing section 13 is composed of a structure in which the porous plate 17 having the projections 18 is provided under the liquid-repellent net 16 , so that the alkaline solution B flows down and falls under the liquid-repellent net 6 By reversing the perforated plate 17 and stopping the flow of the lower portion by the protrusions 18, the jumps and jumps are performed, and the wave lifting and floating movements are performed, so that the liquid removal net 16 is lowered from the bottom. While shaking, it is dropped and recovered from the perforated plate 17 toward the liquid tank 12. • The liquid-repellent net 16 is kept shaken from below until it is kept clean, so that the clogging of the resist A in the mixture D flowing therethrough can be prevented. (3) In the resist recovery device 11, a mixture D of a considerable amount of the alkaline solution B is separated in the pre-desorption portion 16, and then supplied from the pre-discharge to the liquid portion 13 Since the resist concentrate portion 14 is concentrated, the anti-uranium agent A is concentrated, and the alkaline solution B is separated and recovered into the liquid tank 12 (refer to Figs. 2 and 3). In other words, the mixture D' supplied from the liquid removal unit 16 of the pre-liquid removal unit 13 to the resist concentration unit repair 14 is slightly reversed from the resist concentration unit 14 which is erected in the liquid tank 1 2 . In the conical collecting net 23, it is sucked downward toward the lower side. Therefore, from the mixture D, a considerable amount of the test solution b is filtered and separated by the collecting net 23, and flows out of the collecting net 2, and is sucked downward and downward, so that it passes through the piping. 26 or pump 28 is sucked and recovered toward the liquid tank 12. Therefore, the resist A in the mixture D is introduced, collected, and concentrated toward the inner surface of the collecting net 23 and then toward the lower portion. (4) Further, on the outer side of the slightly conical trap-shaped trap 31- 1313793 - net 2 of the resist enrichment portion 14, a cylindrical porous cover 24 is provided around. Therefore, after the alkaline solution B in the liquid tank 12 flows into the porous cover 24, it is sucked downward and downward along the outer surface of the collecting net 23, so that it flows out from the collecting net 2 3 as described above. The alkaline solution B which flows outside and downward is sucked and recovered by the pipe 26 or the pump 28 toward the liquid tank 12 (refer to FIG. 2 and FIG. 3). (In addition, in the alkaline solution B recovered via the pipe 26 or the pump 28, the air in which the slightly mixed bubbles G are destroyed by collapse is stored). # In this way, in the inside and outside of the collecting net 23 of the resist enrichment unit 14, the flow in the same direction and at the same pressure is formed. In other words, in the inside of the collection net 23, the mixture D containing the concentrated resist A is formed to be sucked downward and downward, and the alkaline solution B is formed on the outside. Attraction, the flow of the downward flow. Therefore, the trapping net 2 3 ^ (5 ) due to the resist A in the mixture D and the mixture D containing the concentrated resist A are prevented from being trapped from the resist enrichment portion 14 The lower portion of the 23 is supplied to the resist recovery portion 15 via the pipe 26 or the pump 27. (In addition, in the mixture D supplied through the pipe 26 or the pump 27, the air in which the slightly mixed bubbles G are broken by the collapse) is stored. Further, the mixture D supplied to the resist collecting portion 15 is such that most of the resist A is filtered, collected, and recovered in the filter 29, and the alkaline solution B is passed through the pipe 2, toward the liquid. The tank 12 is recovered (refer to Fig. 3). (6) Further, regarding the prevention of clogging of the mesh, the pumps 27 and 28 for attracting the mixture D or the alkaline solution B are realized by using the intermittent driving type, more -32-1313793' (refer to 3)). That is, the intermittently driven pumps 2 7 and 28 are used to intermittently attract the mixed body d toward the uranium-removing agent recovery unit 15 and the alkaline solution B is intermittently directed toward the liquid tank 1 2 . The suction filter 2 of the resist enrichment unit 14 or the filter 2 of the resist recovery unit 15 is sucked to receive suction fluctuations and suction shocks, thereby more reliably preventing the inclusion in the mixture D. The resist a is clogged. (7) However, the alkaline solution B which is used as a developing solution or a peeling liquid in the "developing machine 1 or the peeling machine 2" is composed of a φ chemical liquid which is alkaline and contains caustic soda, etc., and is added at the same time. temperature. Therefore, as the ejection, a large amount of bubbles, that is, the bubble G', is generated, so that the mixture D supplied from the developing machine 1 or the peeling machine 2 to the resist recovery device 11 also brings a large amount of bubbles G of the alkaline solution b ( Refer to Figure 1). Therefore, the bubble recovery unit 30 is disposed in the resist recovery device 1 1 (refer to Figs. 2 and 3). In addition, the bubble G of the alkaline solution b is located on the upper portion of the mixture D, and is sucked by the bubble recovery tank 33 of the bubble recovery unit 30 on the resist concentration unit 4, and then passed through the pipe 26 or the sweet pump 37. It is supplied to the liquefaction nozzle 34, and is ejected and blown from the liquefaction nozzle 34 toward the bubble-eliminating net 3 1 . Therefore, the bubble G is broken and collapsed on the bubble-removing net 31, returns to the alkaline solution B, falls in the liquid tank 12, and is recovered. Further, the pump 3 7 for sucking the bubble G can also promote the collapse and liquefaction of the bubble G by using the intermittent driving type. Further, the bubble G which has entered the mixture D and flows into the resist enrichment unit 14 is broken by the collapse when passing through the collecting net 2, and returns to the alkaline solution B, and becomes air at the same time. 1313793 • Store in alkaline solution B or mixture D. By such a process, the resist A is caused to float on the liquid surface G' of the liquid of the mixture D, so that the separation of the resist a and the recovery of the bubbles G' which are not sure are eliminated and eliminated. Further, this is achieved without using an antifoaming agent which has an adverse effect on the treatment of the base material c. (8) The uranium-removing agent recovery device i is configured by using the pre-liquid removal unit 13 , the anti-touch agent concentration unit 14 , the bubble recovery unit 30 , and the like. Therefore, 'the resist A and the alkaline solution B are surely separated and recovered, because the 'reducing the recovery efficiency of the resist A, the service life of the alkaline solution B is prolonged, and the alkaline solution B is imaged. The machine 1 or the stripping machine 2 is recyclable and can be reused (refer to Fig. 1). (9) Further, a considerable amount of the alkaline solution-liquid B is separated and recovered from the mixture D in advance in the pre-liquid removal unit 13, so that the mixture is supplied to the resist concentration unit 14 afterwards. The amount of body D is only partially reduced. In addition, in the resist enrichment unit 14, a considerable amount of the alkaline solution B is also separated and recovered from the mixture D, so that only part of it is transported to the resist for recycling. The portion 1 5 reduces the amount of the necessary mixture D. Therefore, the resist concentrating portion 14 or the resist collecting portion 15 can be miniaturized, and the uranium-repellent recovery device 1 1 can be miniaturized as a whole. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front cross-sectional explanatory view, and a description will be given of a best mode for carrying out the invention in the recycling apparatus of the resist according to the present invention. Fig. 2 is a side cross-sectional explanatory view of an important part. The description of the best mode is provided for carrying out the above invention -34 - 1313793'. Fig. 3 is a side cross-sectional explanatory view of the entire body, and is a description of the best mode for carrying out the above invention. Figure 4 is a front cross-sectional illustration showing the description of this prior example. Fig. 5 is a schematic plan view of a substrate (base plate). [Explanation of component symbols] 1..Developing machine 2.. . Stripping machine φ 3... Resist recovery device (previous example) 4.. Filter 5 .. 'room • 6... liquid tank ( Previous example) • 7...pump (previous example) 8··. piping (previous example) 9...jet nozzle 10.. roller conveyor belt β 1 1...resist recovery device (invention) I2·. Liquid tank (invention) 13. Pre-desorbing section 14··. Resin concentrating section 1 5...Anti-contact agent collecting section 16 . . . Deli-liquidizing net 17: Perforated plate 18...protrusion-35 - 1313793 ' 1 9... interval bottom surface 20.... discharge port 2 1... supply pipe 22··· receiving □ 23.. collecting net 24. porous cover 2 5... lower case 26· · Plumbing (Invention) φ 27... Pump (Invention) 2 8··. Pump (Invention) 2 9...Over the net 3 0... Bubble recovery unit. 3 1... Bubble net 32··. pump (invention) 3 3... bubble recovery tank 34.. liquefaction nozzle _ 3 5... bubble recovery wall 3 6... opening 37.. pump (present invention) A.. Resist B ... alkaline solution C ... base plate D ... hybrid E ... circuit substrate - 36 - 1313793 F ... circuit G ... bubble Η ... recovery room

Claims (1)

1313793 曰 曰 曰 王 本 941 941 479 479 479 " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " In the manufacturing process of the substrate, a resist recovery device for recovering the resist is obtained from a mixture of the supplied alkaline solution after the ejection and the removed photosensitive resist, and the feature includes: a liquid tank, a pre-liquid removal unit, a resist concentration unit, and a resist recovery unit; the pre-liquid removal unit separates the alkaline solution from the mixture and recovers the liquid solution; the resist concentration unit The mixture for supplying the pre-desorbed portion is used to concentrate the resist, and the alkaline solution is separated and recovered into the liquid tank; the resist recovery portion is directed to the resist enrichment unit The mixture is supplied for collecting and recovering the anti-uranium agent, and separating and recovering the alkaline solution into the liquid tank; The pre-liquid removal unit is provided with a liquid-repellent net, and the supplied mixture first flows through the liquid-removing net, and a considerable amount of the alkaline solution is separated, dropped, and recovered into the liquid tank; The etchant enrichment unit has a slightly inverted cone-shaped collecting net standing in the liquid tank, and the mixture supplied from the liquid removal line of the pre-liquid removal unit is used in the trapping net The inside is sucked downward and downward, so that a considerable amount of the alkaline solution flows out of the trap net, is sucked downward, is sucked downward, is sucked, and is collected into the tank, and the resist is oriented. Amendment 1313793 The lower portion of the collection net is sequentially concentrated; the resist recovery portion is provided with a filter containing the concentrated resist supplied from the lower portion of the trap net of the resist enrichment portion And the resist is collected by the filter, recovered, and the alkaline solution is recovered into the liquid tank. 2. The apparatus for recovering a resist according to the first aspect of the invention, wherein the image forming machine is attached to a manufacturing process of the circuit board, and the alkaline solution is composed of a developing liquid. Φ 3. The apparatus for recovering a resist according to the first aspect of the invention, wherein the stripping machine is attached to a manufacturing process of the circuit board, and the alkaline solution is composed of a stripping liquid. 4. The apparatus for recovering a resist according to the second or third aspect of the invention, further comprising a bubble collecting portion, comprising a bubble collecting tank, a liquefaction nozzle, and a bubble eliminating net; wherein the bubble collecting tank is attached to the resist The concentrating portion is disposed at intervals, and is opened below to attract the alkaline solution in the upper portion of the mixture The liquefaction nozzle ejects the bubble supplied from the bubble recovery tank to the bubble-eliminating net: the bubble-eliminating net liquefies the bubble which is ejected and returns to the alkaline solution, and recovers the liquid tank. 5. The apparatus for recovering uranium-repellent agent according to claim 2 or 3, wherein the pre-desorbing section is provided by the liquid-repellent net provided with the inclination drop, and the upper and lower intervals are maintained under the liquid-repellent net. a porous plate disposed, and a structure of the protrusions erected on the perforated plate to correct the 1313793; the alkaline solution dropped under the liquid removal mesh is jumped and floated on the porous plate and the protrusion Movement, so the liquid-repellent net is shaken from below, and is dropped from the perforated plate and recovered into the liquid tank. 6. The apparatus for recovering a resist according to claim 2, wherein the porous cover is spaced apart from the outside of the trapping net of the resist enrichment portion; The alkaline solution in the liquid tank flows into the porous lid, and is sucked downward and downward along the outer surface of the collecting net, so that the liquid tank is sucked and recovered. 7. The apparatus for recovering uranium-repellent agent according to item 4 of the patent application, wherein the pump for sucking the mixture, the alkaline solution, or the bubble is constituted by an intermittent driving type. 8. The apparatus for recovering a resist according to claim 6, wherein the pump for sucking the mixture, the alkaline solution, or the bubble is constituted by an intermittent driving type.