JP2006224193A - 電子装置及び電子装置の製造方法 - Google Patents
電子装置及び電子装置の製造方法 Download PDFInfo
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- JP2006224193A JP2006224193A JP2005037250A JP2005037250A JP2006224193A JP 2006224193 A JP2006224193 A JP 2006224193A JP 2005037250 A JP2005037250 A JP 2005037250A JP 2005037250 A JP2005037250 A JP 2005037250A JP 2006224193 A JP2006224193 A JP 2006224193A
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- 125000006850 spacer group Chemical group 0.000 claims abstract description 195
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- 229920006332 epoxy adhesive Polymers 0.000 description 1
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- 239000004416 thermosoftening plastic Substances 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005037250A JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005037250A JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
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| Publication Number | Publication Date |
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| JP2006224193A true JP2006224193A (ja) | 2006-08-31 |
| JP2006224193A5 JP2006224193A5 (enExample) | 2008-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2005037250A Pending JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
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| JP (1) | JP2006224193A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272420A (ja) * | 2008-05-07 | 2009-11-19 | Panasonic Corp | 電子部品パッケージおよびその接合方法 |
| KR20150013780A (ko) * | 2012-05-17 | 2015-02-05 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 웨이퍼 스택 조립 |
| KR20190050718A (ko) * | 2017-11-03 | 2019-05-13 | 주식회사 엘지화학 | 플라스틱 기판의 제조방법 및 이에 의하여 제조된 플라스틱 기판 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149155A (ja) * | 1985-09-02 | 1987-07-03 | Hitachi Ltd | 封止電子装置 |
| JP2002343950A (ja) * | 2001-05-15 | 2002-11-29 | Canon Inc | 固着方法、撮像モジュールの製造方法および撮像モジュール |
| JP2003078121A (ja) * | 2001-09-03 | 2003-03-14 | Canon Inc | 固体撮像装置 |
| JP2004063782A (ja) * | 2002-07-29 | 2004-02-26 | Fuji Photo Film Co Ltd | 固体撮像装置およびその製造方法 |
| JP2004146392A (ja) * | 2002-08-30 | 2004-05-20 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
| JP2006099096A (ja) * | 2004-09-27 | 2006-04-13 | Idc Llc | 背板のためのパターン化されたスペーサを有する装置とそれを作る方法 |
-
2005
- 2005-02-15 JP JP2005037250A patent/JP2006224193A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149155A (ja) * | 1985-09-02 | 1987-07-03 | Hitachi Ltd | 封止電子装置 |
| JP2002343950A (ja) * | 2001-05-15 | 2002-11-29 | Canon Inc | 固着方法、撮像モジュールの製造方法および撮像モジュール |
| JP2003078121A (ja) * | 2001-09-03 | 2003-03-14 | Canon Inc | 固体撮像装置 |
| JP2004063782A (ja) * | 2002-07-29 | 2004-02-26 | Fuji Photo Film Co Ltd | 固体撮像装置およびその製造方法 |
| JP2004146392A (ja) * | 2002-08-30 | 2004-05-20 | Kyocera Corp | 半導体素子収納用パッケージおよび半導体装置 |
| JP2006099096A (ja) * | 2004-09-27 | 2006-04-13 | Idc Llc | 背板のためのパターン化されたスペーサを有する装置とそれを作る方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272420A (ja) * | 2008-05-07 | 2009-11-19 | Panasonic Corp | 電子部品パッケージおよびその接合方法 |
| KR20150013780A (ko) * | 2012-05-17 | 2015-02-05 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 웨이퍼 스택 조립 |
| KR20200049894A (ko) * | 2012-05-17 | 2020-05-08 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 웨이퍼 스택 조립 |
| KR102107575B1 (ko) | 2012-05-17 | 2020-05-08 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 웨이퍼 스택 조립 |
| KR102208832B1 (ko) | 2012-05-17 | 2021-01-29 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 웨이퍼 스택 조립 |
| KR20190050718A (ko) * | 2017-11-03 | 2019-05-13 | 주식회사 엘지화학 | 플라스틱 기판의 제조방법 및 이에 의하여 제조된 플라스틱 기판 |
| KR102236737B1 (ko) | 2017-11-03 | 2021-04-06 | 주식회사 엘지화학 | 플라스틱 기판의 제조방법 및 이에 의하여 제조된 플라스틱 기판 |
| US11648710B2 (en) | 2017-11-03 | 2023-05-16 | Lg Chem, Ltd. | Method of manufacturing plastic substrate and plastic substrate manufactured thereby |
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