JP2006224193A5 - - Google Patents
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- Publication number
- JP2006224193A5 JP2006224193A5 JP2005037250A JP2005037250A JP2006224193A5 JP 2006224193 A5 JP2006224193 A5 JP 2006224193A5 JP 2005037250 A JP2005037250 A JP 2005037250A JP 2005037250 A JP2005037250 A JP 2005037250A JP 2006224193 A5 JP2006224193 A5 JP 2006224193A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005037250A JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005037250A JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006224193A JP2006224193A (ja) | 2006-08-31 |
| JP2006224193A5 true JP2006224193A5 (enExample) | 2008-03-27 |
Family
ID=36985995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005037250A Pending JP2006224193A (ja) | 2005-02-15 | 2005-02-15 | 電子装置及び電子装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006224193A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5493290B2 (ja) * | 2008-05-07 | 2014-05-14 | パナソニック株式会社 | 電子部品パッケージ |
| SG11201407221TA (en) * | 2012-05-17 | 2014-12-30 | Heptagon Micro Optics Pte Ltd | Assembly of wafer stacks |
| US11648710B2 (en) | 2017-11-03 | 2023-05-16 | Lg Chem, Ltd. | Method of manufacturing plastic substrate and plastic substrate manufactured thereby |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62149155A (ja) * | 1985-09-02 | 1987-07-03 | Hitachi Ltd | 封止電子装置 |
| JP2002343950A (ja) * | 2001-05-15 | 2002-11-29 | Canon Inc | 固着方法、撮像モジュールの製造方法および撮像モジュール |
| JP2003078121A (ja) * | 2001-09-03 | 2003-03-14 | Canon Inc | 固体撮像装置 |
| JP2004063782A (ja) * | 2002-07-29 | 2004-02-26 | Fuji Photo Film Co Ltd | 固体撮像装置およびその製造方法 |
| JP3878897B2 (ja) * | 2002-08-30 | 2007-02-07 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
| US7701631B2 (en) * | 2004-09-27 | 2010-04-20 | Qualcomm Mems Technologies, Inc. | Device having patterned spacers for backplates and method of making the same |
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2005
- 2005-02-15 JP JP2005037250A patent/JP2006224193A/ja active Pending