JP2006196894A5 - - Google Patents

Download PDF

Info

Publication number
JP2006196894A5
JP2006196894A5 JP2006001619A JP2006001619A JP2006196894A5 JP 2006196894 A5 JP2006196894 A5 JP 2006196894A5 JP 2006001619 A JP2006001619 A JP 2006001619A JP 2006001619 A JP2006001619 A JP 2006001619A JP 2006196894 A5 JP2006196894 A5 JP 2006196894A5
Authority
JP
Japan
Prior art keywords
heat sink
electrical
electrical insulator
thermal conductivity
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006001619A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006196894A (ja
Filing date
Publication date
Priority claimed from US10/905,546 external-priority patent/US7310036B2/en
Application filed filed Critical
Publication of JP2006196894A publication Critical patent/JP2006196894A/ja
Publication of JP2006196894A5 publication Critical patent/JP2006196894A5/ja
Pending legal-status Critical Current

Links

JP2006001619A 2005-01-10 2006-01-06 ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク） Pending JP2006196894A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/905,546 US7310036B2 (en) 2005-01-10 2005-01-10 Heat sink for integrated circuit devices

Publications (2)

Publication Number Publication Date
JP2006196894A JP2006196894A (ja) 2006-07-27
JP2006196894A5 true JP2006196894A5 (enExample) 2008-11-27

Family

ID=36652694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006001619A Pending JP2006196894A (ja) 2005-01-10 2006-01-06 ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク）

Country Status (4)

Country Link
US (4) US7310036B2 (enExample)
JP (1) JP2006196894A (enExample)
CN (1) CN100431141C (enExample)
TW (1) TWI391958B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097920B (zh) * 2010-11-10 2014-02-12 中电普瑞科技有限公司 一种用于大功率电力电子功率器件的吸收电路
DE102011004061A1 (de) * 2011-02-14 2012-08-16 Endress + Hauser Gmbh + Co. Kg Elektronisches Gerät und Schutzelement hierfür für den Einsatz in explosionsgefährdeten Bereichen
US8912630B2 (en) 2012-04-11 2014-12-16 International Business Machines Corporation Integrated circuit including thermal gate, related method and design structure
US20140124880A1 (en) * 2012-11-06 2014-05-08 International Business Machines Corporation Magnetoresistive random access memory
JPWO2014156071A1 (ja) * 2013-03-25 2017-02-16 旭化成エレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US9930769B2 (en) * 2014-02-14 2018-03-27 Qualcomm Incorporated Thermal metal ground for integrated circuit resistors
CN105226044B (zh) 2014-05-29 2018-12-18 联华电子股份有限公司 集成电路及形成集成电路的方法
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
CN105321890A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
US9799720B2 (en) 2014-09-12 2017-10-24 International Business Machines Corporation Inductor heat dissipation in an integrated circuit
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
FR3059465A1 (fr) * 2016-11-30 2018-06-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme microelectronique a dissipation de chaleur
US10405418B2 (en) 2016-12-21 2019-09-03 Industrial Technology Research Institute Differential signal transmitting circuit board
US10475725B2 (en) 2017-11-08 2019-11-12 Texas Instruments Incorporated Structure to enable higher current density in integrated circuit resistor
US11637068B2 (en) 2020-12-15 2023-04-25 Globalfoundries U.S. Inc. Thermally and electrically conductive interconnects

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US594590A (en) 1897-11-30 Hydraulic elevator
US584134A (en) 1897-06-08 Churn
US530497A (en) 1894-12-11 Street-sign
US702224A (en) 1901-07-11 1902-06-10 Oscar Schmidt Musical instrument.
US732109A (en) 1902-04-26 1903-06-30 Ebbin Patterson Rotary pump.
US4064477A (en) * 1975-08-25 1977-12-20 American Components Inc. Metal foil resistor
US4613844A (en) * 1985-08-26 1986-09-23 Rca Corporation High power RF thick film resistor and method for the manufacture thereof
US5038132A (en) * 1989-12-22 1991-08-06 Texas Instruments Incorporated Dual function circuit board, a resistor element therefor, and a circuit embodying the element
US5164699A (en) * 1990-12-17 1992-11-17 Hughes Aircraft Company Via resistors within-multi-layer, 3 dimensional structures substrates
DE4103160C2 (de) * 1991-02-02 1994-09-08 Roland Man Druckmasch Falzapparat mit einem verstellbare Elemente, insbesondere Falzklappen oder bogenförmige Segmente, aufweisenden Falzwerkzylinder
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
US5304977A (en) * 1991-09-12 1994-04-19 Caddock Electronics, Inc. Film-type power resistor combination with anchored exposed substrate/heatsink
US5391914A (en) * 1994-03-16 1995-02-21 The United States Of America As Represented By The Secretary Of The Navy Diamond multilayer multichip module substrate
JPH08279562A (ja) * 1994-07-20 1996-10-22 Mitsubishi Electric Corp 半導体装置、及びその製造方法
JPH0883701A (ja) 1994-09-12 1996-03-26 Teikoku Tsushin Kogyo Co Ltd 高電力型抵抗器
US5621616A (en) * 1995-09-29 1997-04-15 Lsi Logic Corporation High density CMOS integrated circuit with heat transfer structure for improved cooling
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
US5841340A (en) * 1996-05-07 1998-11-24 Rf Power Components, Inc. Solderless RF power film resistors and terminations
US5955781A (en) * 1998-01-13 1999-09-21 International Business Machines Corporation Embedded thermal conductors for semiconductor chips
US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
US6201701B1 (en) 1998-03-11 2001-03-13 Kimball International, Inc. Integrated substrate with enhanced thermal characteristics
JPH11274381A (ja) * 1998-03-26 1999-10-08 Mitsubishi Electric Corp バイポーラトランジスタ装置の放熱構造
JP3109479B2 (ja) * 1998-06-12 2000-11-13 日本電気株式会社 放熱体及び放熱体を装着したメモリモジュール
US5945905A (en) * 1998-12-21 1999-08-31 Emc Technology Llc High power resistor
DE10116531B4 (de) * 2000-04-04 2008-06-19 Koa Corp., Ina Widerstand mit niedrigem Widerstandswert
US6477054B1 (en) * 2000-08-10 2002-11-05 Tektronix, Inc. Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
TW525417B (en) * 2000-08-11 2003-03-21 Ind Tech Res Inst Composite through hole structure
US6414847B1 (en) * 2001-04-09 2002-07-02 Agilent Technologies, Inc. Integral dielectric heatspreader
US6996414B2 (en) * 2001-04-30 2006-02-07 Motorola, Inc. System and method of group calling in mobile communications
TWI245395B (en) * 2001-11-20 2005-12-11 Advanced Semiconductor Eng Multi-chip module package device
JP4086275B2 (ja) 2001-12-20 2008-05-14 株式会社翠光トップライン 水溶性断熱塗料及びそれを用いた断熱板
US6875950B2 (en) * 2002-03-22 2005-04-05 Gsi Lumonics Corporation Automated laser trimming of resistors
US6649937B2 (en) * 2002-03-26 2003-11-18 Intel Corporation Semiconductor device with components embedded in backside diamond layer
DE60327962D1 (de) * 2002-04-03 2009-07-30 Panasonic Corp Eingebautes Halbleitermodul im Millimeterwellenband
JP4184701B2 (ja) * 2002-04-19 2008-11-19 エスアイアイ・ナノテクノロジー株式会社 放射線検出器
US7067903B2 (en) * 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
US7022246B2 (en) * 2003-01-06 2006-04-04 International Business Machines Corporation Method of fabrication of MIMCAP and resistor at same level
US6861746B1 (en) * 2003-10-02 2005-03-01 Motorola, Inc. Electrical circuit apparatus and methods for assembling same
US7345364B2 (en) * 2004-02-04 2008-03-18 Agere Systems Inc. Structure and method for improved heat conduction for semiconductor devices
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices

Similar Documents

Publication Publication Date Title
JP2006196894A5 (enExample)
US8230586B2 (en) Method of cooling a resistor
EP1261028A3 (en) Cooling arrangement for an electronic apparatus
JP2013004636A5 (enExample)
EP1821586A4 (en) CONDUCTOR PLATE AND PCB PLATE MANUFACTURING METHOD
US20220293490A1 (en) Cooling system
US10043729B1 (en) Power electronics module
CN107343378A (zh) 一种液态金属与硅脂结合的散热方法
US7995351B2 (en) Printed board
JP2009513014A5 (enExample)
US7259458B2 (en) Integrated circuit with increased heat transfer
TW201236227A (en) Packaged substrate and fabrication method thereof
CN114974761A (zh) 高功率晶片电阻
CN102738134B (zh) 半导体装置
JP2006190711A5 (enExample)
JP3939317B2 (ja) 熱伝導材及びその製造方法
JP5939606B2 (ja) 超電導限流素子
JP6500210B2 (ja) 金属板抵抗器
CN102315201A (zh) 半导体结构及其制造方法、电阻结构
JP2003158196A5 (enExample)
TW200718931A (en) A temperature sensing device
JP2000031487A (ja) 半導体装置とその製造方法
WO2004004019A3 (de) Strombegrenzungseinrichtung mit verbesserter wärmeableitung
CN203747236U (zh) 一种低热应力结构的高功率半导体激光器
JP2008166642A (ja) 放熱部材付き半導体デバイス