TWI391958B - 散熱裝置、熱介面、電阻及冷卻該電阻之方法 - Google Patents

散熱裝置、熱介面、電阻及冷卻該電阻之方法 Download PDF

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Publication number
TWI391958B
TWI391958B TW095100293A TW95100293A TWI391958B TW I391958 B TWI391958 B TW I391958B TW 095100293 A TW095100293 A TW 095100293A TW 95100293 A TW95100293 A TW 95100293A TW I391958 B TWI391958 B TW I391958B
Authority
TW
Taiwan
Prior art keywords
contact
electrical
heat
heat sink
resistor
Prior art date
Application number
TW095100293A
Other languages
English (en)
Chinese (zh)
Other versions
TW200710884A (en
Inventor
古伯 道格拉斯Ｄ.
依夏 艾伯妮娜Ｅ.
虎克 泰倫斯Ｂ.
羅素 羅伯特Ｍ.
史普洛吉斯 艾慕德Ｊ.
史坦普 安東尼Ｋ.
墨菲 威廉Ｊ.
Original Assignee
萬國商業機器公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 萬國商業機器公司 filed Critical 萬國商業機器公司
Publication of TW200710884A publication Critical patent/TW200710884A/zh
Application granted granted Critical
Publication of TWI391958B publication Critical patent/TWI391958B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095100293A 2005-01-10 2006-01-04 散熱裝置、熱介面、電阻及冷卻該電阻之方法 TWI391958B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/905,546 US7310036B2 (en) 2005-01-10 2005-01-10 Heat sink for integrated circuit devices

Publications (2)

Publication Number Publication Date
TW200710884A TW200710884A (en) 2007-03-16
TWI391958B true TWI391958B (zh) 2013-04-01

Family

ID=36652694

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100293A TWI391958B (zh) 2005-01-10 2006-01-04 散熱裝置、熱介面、電阻及冷卻該電阻之方法

Country Status (4)

Country Link
US (4) US7310036B2 (enExample)
JP (1) JP2006196894A (enExample)
CN (1) CN100431141C (enExample)
TW (1) TWI391958B (enExample)

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DE102011004061A1 (de) * 2011-02-14 2012-08-16 Endress + Hauser Gmbh + Co. Kg Elektronisches Gerät und Schutzelement hierfür für den Einsatz in explosionsgefährdeten Bereichen
US8912630B2 (en) 2012-04-11 2014-12-16 International Business Machines Corporation Integrated circuit including thermal gate, related method and design structure
US20140124880A1 (en) * 2012-11-06 2014-05-08 International Business Machines Corporation Magnetoresistive random access memory
JPWO2014156071A1 (ja) * 2013-03-25 2017-02-16 旭化成エレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US9930769B2 (en) * 2014-02-14 2018-03-27 Qualcomm Incorporated Thermal metal ground for integrated circuit resistors
CN105226044B (zh) 2014-05-29 2018-12-18 联华电子股份有限公司 集成电路及形成集成电路的方法
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
CN105321890A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
US9799720B2 (en) 2014-09-12 2017-10-24 International Business Machines Corporation Inductor heat dissipation in an integrated circuit
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
FR3059465A1 (fr) * 2016-11-30 2018-06-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme microelectronique a dissipation de chaleur
US10405418B2 (en) 2016-12-21 2019-09-03 Industrial Technology Research Institute Differential signal transmitting circuit board
US10475725B2 (en) 2017-11-08 2019-11-12 Texas Instruments Incorporated Structure to enable higher current density in integrated circuit resistor
US11637068B2 (en) 2020-12-15 2023-04-25 Globalfoundries U.S. Inc. Thermally and electrically conductive interconnects

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US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
US20040196139A1 (en) * 2000-04-04 2004-10-07 Koa Corporation Low resistance value resistor

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US5038132A (en) * 1989-12-22 1991-08-06 Texas Instruments Incorporated Dual function circuit board, a resistor element therefor, and a circuit embodying the element
US5164699A (en) * 1990-12-17 1992-11-17 Hughes Aircraft Company Via resistors within-multi-layer, 3 dimensional structures substrates
US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
US20040196139A1 (en) * 2000-04-04 2004-10-07 Koa Corporation Low resistance value resistor

Also Published As

Publication number Publication date
US20120214280A1 (en) 2012-08-23
US8230586B2 (en) 2012-07-31
US20080042798A1 (en) 2008-02-21
US7994895B2 (en) 2011-08-09
JP2006196894A (ja) 2006-07-27
US8881379B2 (en) 2014-11-11
US7310036B2 (en) 2007-12-18
US20080019101A1 (en) 2008-01-24
CN1828877A (zh) 2006-09-06
US20060152333A1 (en) 2006-07-13
CN100431141C (zh) 2008-11-05
TW200710884A (en) 2007-03-16

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MM4A Annulment or lapse of patent due to non-payment of fees