CN100431141C - 用于集成电路器件的热沉 - Google Patents

用于集成电路器件的热沉 Download PDF

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Publication number
CN100431141C
CN100431141C CNB2006100058332A CN200610005833A CN100431141C CN 100431141 C CN100431141 C CN 100431141C CN B2006100058332 A CNB2006100058332 A CN B2006100058332A CN 200610005833 A CN200610005833 A CN 200610005833A CN 100431141 C CN100431141 C CN 100431141C
Authority
CN
China
Prior art keywords
heat sink
resistor
contact
heat
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100058332A
Other languages
English (en)
Chinese (zh)
Other versions
CN1828877A (zh
Inventor
埃比尼泽·E.·埃尚
道格拉斯·D.·库尔鲍
埃德蒙得·J.·斯普洛吉斯
罗伯特·M.·拉塞尔
特伦斯·B.·胡克
安东尼·K.·斯坦珀
威廉·J.·墨菲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of CN1828877A publication Critical patent/CN1828877A/zh
Application granted granted Critical
Publication of CN100431141C publication Critical patent/CN100431141C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2006100058332A 2005-01-10 2006-01-10 用于集成电路器件的热沉 Expired - Fee Related CN100431141C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/905,546 US7310036B2 (en) 2005-01-10 2005-01-10 Heat sink for integrated circuit devices
US10/905,546 2005-01-10

Publications (2)

Publication Number Publication Date
CN1828877A CN1828877A (zh) 2006-09-06
CN100431141C true CN100431141C (zh) 2008-11-05

Family

ID=36652694

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100058332A Expired - Fee Related CN100431141C (zh) 2005-01-10 2006-01-10 用于集成电路器件的热沉

Country Status (4)

Country Link
US (4) US7310036B2 (enExample)
JP (1) JP2006196894A (enExample)
CN (1) CN100431141C (enExample)
TW (1) TWI391958B (enExample)

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CN102097920B (zh) * 2010-11-10 2014-02-12 中电普瑞科技有限公司 一种用于大功率电力电子功率器件的吸收电路
DE102011004061A1 (de) * 2011-02-14 2012-08-16 Endress + Hauser Gmbh + Co. Kg Elektronisches Gerät und Schutzelement hierfür für den Einsatz in explosionsgefährdeten Bereichen
US8912630B2 (en) 2012-04-11 2014-12-16 International Business Machines Corporation Integrated circuit including thermal gate, related method and design structure
US20140124880A1 (en) * 2012-11-06 2014-05-08 International Business Machines Corporation Magnetoresistive random access memory
JPWO2014156071A1 (ja) * 2013-03-25 2017-02-16 旭化成エレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US9930769B2 (en) * 2014-02-14 2018-03-27 Qualcomm Incorporated Thermal metal ground for integrated circuit resistors
CN105226044B (zh) 2014-05-29 2018-12-18 联华电子股份有限公司 集成电路及形成集成电路的方法
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
CN105321890A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
US9799720B2 (en) 2014-09-12 2017-10-24 International Business Machines Corporation Inductor heat dissipation in an integrated circuit
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
FR3059465A1 (fr) * 2016-11-30 2018-06-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme microelectronique a dissipation de chaleur
US10405418B2 (en) 2016-12-21 2019-09-03 Industrial Technology Research Institute Differential signal transmitting circuit board
US10475725B2 (en) 2017-11-08 2019-11-12 Texas Instruments Incorporated Structure to enable higher current density in integrated circuit resistor
US11637068B2 (en) 2020-12-15 2023-04-25 Globalfoundries U.S. Inc. Thermally and electrically conductive interconnects

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JPH11274381A (ja) * 1998-03-26 1999-10-08 Mitsubishi Electric Corp バイポーラトランジスタ装置の放熱構造
US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
US20030178396A1 (en) * 2002-03-22 2003-09-25 Andrei Naumov Automated trim processing system
CN1499620A (zh) * 2002-11-07 2004-05-26 ��ʽ�������Ƹ��� 散热器和使用了该散热器的半导体元件和半导体封装体

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US5990780A (en) * 1998-02-06 1999-11-23 Caddock Electronics, Inc. Low-resistance, high-power resistor having a tight resistance tolerance despite variations in the circuit connections to the contacts
JPH11274381A (ja) * 1998-03-26 1999-10-08 Mitsubishi Electric Corp バイポーラトランジスタ装置の放熱構造
US20030178396A1 (en) * 2002-03-22 2003-09-25 Andrei Naumov Automated trim processing system
CN1499620A (zh) * 2002-11-07 2004-05-26 ��ʽ�������Ƹ��� 散热器和使用了该散热器的半导体元件和半导体封装体

Also Published As

Publication number Publication date
US20120214280A1 (en) 2012-08-23
US8230586B2 (en) 2012-07-31
US20080042798A1 (en) 2008-02-21
US7994895B2 (en) 2011-08-09
JP2006196894A (ja) 2006-07-27
US8881379B2 (en) 2014-11-11
US7310036B2 (en) 2007-12-18
US20080019101A1 (en) 2008-01-24
CN1828877A (zh) 2006-09-06
US20060152333A1 (en) 2006-07-13
TWI391958B (zh) 2013-04-01
TW200710884A (en) 2007-03-16

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Granted publication date: 20081105