JP2006196894A - ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク） - Google Patents

ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク） Download PDF

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Publication number
JP2006196894A
JP2006196894A JP2006001619A JP2006001619A JP2006196894A JP 2006196894 A JP2006196894 A JP 2006196894A JP 2006001619 A JP2006001619 A JP 2006001619A JP 2006001619 A JP2006001619 A JP 2006001619A JP 2006196894 A JP2006196894 A JP 2006196894A
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JP
Japan
Prior art keywords
heat sink
electrical
contact
thermal conductivity
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006001619A
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English (en)
Japanese (ja)
Other versions
JP2006196894A5 (enExample
Inventor
Douglas D Coolbaugh
ダグラス・ディー・クールボー
Ebenezer E Eshun
エベネザー・イー・イシュン
Terence B Hook
テレンス・ビー・フック
Robert M Rassel
ロバート・エム・ラッセル
Edmund J Sprogis
エドマンド・ジェイ・スプログル
Anthony K Stamper
アンソニー・ケイ・スタンパー
William J Murphy
ウィリアム・ジェイ・マーフィー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2006196894A publication Critical patent/JP2006196894A/ja
Publication of JP2006196894A5 publication Critical patent/JP2006196894A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006001619A 2005-01-10 2006-01-06 ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク） Pending JP2006196894A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/905,546 US7310036B2 (en) 2005-01-10 2005-01-10 Heat sink for integrated circuit devices

Publications (2)

Publication Number Publication Date
JP2006196894A true JP2006196894A (ja) 2006-07-27
JP2006196894A5 JP2006196894A5 (enExample) 2008-11-27

Family

ID=36652694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006001619A Pending JP2006196894A (ja) 2005-01-10 2006-01-06 ヒート・シンク、抵抗器、抵抗器の冷却方法（集積回路デバイス用ヒート・シンク）

Country Status (4)

Country Link
US (4) US7310036B2 (enExample)
JP (1) JP2006196894A (enExample)
CN (1) CN100431141C (enExample)
TW (1) TWI391958B (enExample)

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CN102097920B (zh) * 2010-11-10 2014-02-12 中电普瑞科技有限公司 一种用于大功率电力电子功率器件的吸收电路
DE102011004061A1 (de) * 2011-02-14 2012-08-16 Endress + Hauser Gmbh + Co. Kg Elektronisches Gerät und Schutzelement hierfür für den Einsatz in explosionsgefährdeten Bereichen
US8912630B2 (en) 2012-04-11 2014-12-16 International Business Machines Corporation Integrated circuit including thermal gate, related method and design structure
US20140124880A1 (en) * 2012-11-06 2014-05-08 International Business Machines Corporation Magnetoresistive random access memory
JPWO2014156071A1 (ja) * 2013-03-25 2017-02-16 旭化成エレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
US9930769B2 (en) * 2014-02-14 2018-03-27 Qualcomm Incorporated Thermal metal ground for integrated circuit resistors
CN105226044B (zh) 2014-05-29 2018-12-18 联华电子股份有限公司 集成电路及形成集成电路的方法
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
CN105321890A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
US9799720B2 (en) 2014-09-12 2017-10-24 International Business Machines Corporation Inductor heat dissipation in an integrated circuit
JP6398749B2 (ja) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 抵抗器及び抵抗器の製造方法
FR3059465A1 (fr) * 2016-11-30 2018-06-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme microelectronique a dissipation de chaleur
US10405418B2 (en) 2016-12-21 2019-09-03 Industrial Technology Research Institute Differential signal transmitting circuit board
US10475725B2 (en) 2017-11-08 2019-11-12 Texas Instruments Incorporated Structure to enable higher current density in integrated circuit resistor
US11637068B2 (en) 2020-12-15 2023-04-25 Globalfoundries U.S. Inc. Thermally and electrically conductive interconnects

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2002503026A (ja) * 1998-02-06 2002-01-29 カドック・エレクトロニクス・インコーポレーテッド 接点への回路接続の相違に拘らず、厳密な抵抗許容公差を有する低抵抗、高電力の抵抗器

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Also Published As

Publication number Publication date
US20120214280A1 (en) 2012-08-23
US8230586B2 (en) 2012-07-31
US20080042798A1 (en) 2008-02-21
US7994895B2 (en) 2011-08-09
US8881379B2 (en) 2014-11-11
US7310036B2 (en) 2007-12-18
US20080019101A1 (en) 2008-01-24
CN1828877A (zh) 2006-09-06
US20060152333A1 (en) 2006-07-13
CN100431141C (zh) 2008-11-05
TWI391958B (zh) 2013-04-01
TW200710884A (en) 2007-03-16

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