JP2006190589A - 半導体試験用ソケット - Google Patents
半導体試験用ソケット Download PDFInfo
- Publication number
- JP2006190589A JP2006190589A JP2005002149A JP2005002149A JP2006190589A JP 2006190589 A JP2006190589 A JP 2006190589A JP 2005002149 A JP2005002149 A JP 2005002149A JP 2005002149 A JP2005002149 A JP 2005002149A JP 2006190589 A JP2006190589 A JP 2006190589A
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- Prior art keywords
- socket
- pogo pin
- semiconductor
- insertion hole
- test
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
【解決手段】ベース部1の所定領域内に所定ピッチでポゴピン2を配置したソケット本体3と、
ソケット本体3に着脱可能に固定され、試験対象半導体素子44のパッケージ外形により該試験対象半導体素子44の各接続端子5を対応するポゴピン2位置にガイドするソケットカバー6とを有して構成する。
【選択図】 図2
Description
2 ポゴピン
3 ソケット本体
4 試験対象半導体素子
5 接続端子
6 ソケットカバー
7 ポゴピン挿入孔
8 ボール嵌合凹部
9 外筒
10 導電層
Claims (3)
- ベース部の所定領域内に所定ピッチでポゴピンを配置したソケット本体と、
ソケット本体に着脱可能に固定され、試験対象半導体素子のパッケージ外形により該試験対象半導体素子の各接続端子を対応するポゴピン位置にガイドするソケットカバーとを有する半導体試験用ソケット。 - 前記ポゴピンはベース部に開設されたポゴピン挿入孔に固定されるとともに、ポゴピン挿入孔の上端には、周壁が前記試験対象半導体素子のボール状の接続端子の曲率にほぼ一致する曲率面により形成されるボール嵌合凹部が設けられ、
かつ、前記ボール嵌合凹部の表面とポゴピン挿入孔の内周壁面にはポゴピンの外筒に短絡する導電層が形成される請求項1記載の半導体試験用ソケット。 - 前記導電層がメッキ層である請求項2記載の半導体試験用ソケット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005002149A JP4657731B2 (ja) | 2005-01-07 | 2005-01-07 | 半導体試験用ソケット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005002149A JP4657731B2 (ja) | 2005-01-07 | 2005-01-07 | 半導体試験用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006190589A true JP2006190589A (ja) | 2006-07-20 |
JP4657731B2 JP4657731B2 (ja) | 2011-03-23 |
Family
ID=36797588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005002149A Expired - Fee Related JP4657731B2 (ja) | 2005-01-07 | 2005-01-07 | 半導体試験用ソケット |
Country Status (1)
Country | Link |
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JP (1) | JP4657731B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8541889B2 (en) | 2010-12-30 | 2013-09-24 | Samsung Electronics Co., Ltd. | Probe card including frame and cover plate for testing a semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170066756A (ko) | 2015-12-04 | 2017-06-15 | 삼성전자주식회사 | 소켓 핀 및 반도체 패키지 테스트 시스템 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH037148U (ja) * | 1989-06-08 | 1991-01-23 | ||
JPH0688857A (ja) * | 1992-09-07 | 1994-03-29 | Hitachi Ltd | 半導体装置用テストボード |
JPH0897261A (ja) * | 1994-09-28 | 1996-04-12 | Nec Corp | 半導体チップバイアステスト用ソケット |
JPH11185911A (ja) * | 1997-12-22 | 1999-07-09 | Yokowo Co Ltd | Icパッケージ測定用ソケット |
JP2001083207A (ja) * | 1999-09-03 | 2001-03-30 | Internatl Business Mach Corp <Ibm> | テストソケット、チェンジキット及びテスト装置 |
JP2002008808A (ja) * | 2000-06-19 | 2002-01-11 | Enplas Corp | 電気部品用ソケット |
WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
JP2003303654A (ja) * | 2002-04-08 | 2003-10-24 | Ricoh Co Ltd | 位置決めガイド及びicソケット |
-
2005
- 2005-01-07 JP JP2005002149A patent/JP4657731B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH037148U (ja) * | 1989-06-08 | 1991-01-23 | ||
JPH0688857A (ja) * | 1992-09-07 | 1994-03-29 | Hitachi Ltd | 半導体装置用テストボード |
JPH0897261A (ja) * | 1994-09-28 | 1996-04-12 | Nec Corp | 半導体チップバイアステスト用ソケット |
JPH11185911A (ja) * | 1997-12-22 | 1999-07-09 | Yokowo Co Ltd | Icパッケージ測定用ソケット |
JP2001083207A (ja) * | 1999-09-03 | 2001-03-30 | Internatl Business Mach Corp <Ibm> | テストソケット、チェンジキット及びテスト装置 |
JP2002008808A (ja) * | 2000-06-19 | 2002-01-11 | Enplas Corp | 電気部品用ソケット |
WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
JP2005519307A (ja) * | 2002-03-05 | 2005-06-30 | リカ デンシ アメリカ, インコーポレイテッド | 電子パッケージと試験機器をインターフェースするための装置 |
JP2003303654A (ja) * | 2002-04-08 | 2003-10-24 | Ricoh Co Ltd | 位置決めガイド及びicソケット |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8541889B2 (en) | 2010-12-30 | 2013-09-24 | Samsung Electronics Co., Ltd. | Probe card including frame and cover plate for testing a semiconductor device |
Also Published As
Publication number | Publication date |
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JP4657731B2 (ja) | 2011-03-23 |
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