JP2006114732A5 - - Google Patents

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Publication number
JP2006114732A5
JP2006114732A5 JP2004301225A JP2004301225A JP2006114732A5 JP 2006114732 A5 JP2006114732 A5 JP 2006114732A5 JP 2004301225 A JP2004301225 A JP 2004301225A JP 2004301225 A JP2004301225 A JP 2004301225A JP 2006114732 A5 JP2006114732 A5 JP 2006114732A5
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JP
Japan
Prior art keywords
semiconductor
semiconductor substrate
semiconductor element
region
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004301225A
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English (en)
Japanese (ja)
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JP2006114732A (ja
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Publication date
Application filed filed Critical
Priority to JP2004301225A priority Critical patent/JP2006114732A/ja
Priority claimed from JP2004301225A external-priority patent/JP2006114732A/ja
Priority to US11/247,234 priority patent/US7547929B2/en
Publication of JP2006114732A publication Critical patent/JP2006114732A/ja
Publication of JP2006114732A5 publication Critical patent/JP2006114732A5/ja
Pending legal-status Critical Current

Links

JP2004301225A 2004-10-15 2004-10-15 半導体装置及びその製造方法、並びに半導体モジュール Pending JP2006114732A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004301225A JP2006114732A (ja) 2004-10-15 2004-10-15 半導体装置及びその製造方法、並びに半導体モジュール
US11/247,234 US7547929B2 (en) 2004-10-15 2005-10-12 Semiconductor HBT MMIC device and semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004301225A JP2006114732A (ja) 2004-10-15 2004-10-15 半導体装置及びその製造方法、並びに半導体モジュール

Publications (2)

Publication Number Publication Date
JP2006114732A JP2006114732A (ja) 2006-04-27
JP2006114732A5 true JP2006114732A5 (enExample) 2007-02-01

Family

ID=36179815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004301225A Pending JP2006114732A (ja) 2004-10-15 2004-10-15 半導体装置及びその製造方法、並びに半導体モジュール

Country Status (2)

Country Link
US (1) US7547929B2 (enExample)
JP (1) JP2006114732A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007003182B4 (de) * 2007-01-22 2019-11-28 Snaptrack Inc. Elektrisches Bauelement
US8860092B1 (en) * 2008-09-22 2014-10-14 Hrl Laboratories, Llc Metallic sub-collector for HBT and BJT transistors
US10515872B1 (en) 2008-09-22 2019-12-24 Hrl Laboratories, Llc Metallic sub-collector for HBT and BJT transistors
JP4833307B2 (ja) * 2009-02-24 2011-12-07 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体モジュール、端子板、端子板の製造方法および半導体モジュールの製造方法
DE102009059303A1 (de) * 2009-12-23 2011-06-30 United Monolithic Semiconductors GmbH, 89081 Verfahren zur Herstellung eines elektronischen Bauteils und nach diesem Verfahren hergestelltes elektronisches Bauteil
JP5601079B2 (ja) * 2010-08-09 2014-10-08 三菱電機株式会社 半導体装置、半導体回路基板および半導体回路基板の製造方法
JP2014187354A (ja) * 2013-02-21 2014-10-02 Ricoh Co Ltd デバイス、及びデバイスの作製方法
JP2021197473A (ja) * 2020-06-16 2021-12-27 株式会社村田製作所 半導体装置
CN114334918A (zh) * 2021-12-28 2022-04-12 厦门市三安集成电路有限公司 混合单片微波集成电路及其制作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505799A (en) * 1983-12-08 1985-03-19 General Signal Corporation ISFET sensor and method of manufacture
JP2621576B2 (ja) * 1990-05-16 1997-06-18 日本電気株式会社 モノリシックマイクロ波ミリ波アレイアンテナモジュール
JPH06204449A (ja) 1992-12-28 1994-07-22 Fujitsu Ltd 光検知装置およびその製造方法
US5426072A (en) * 1993-01-21 1995-06-20 Hughes Aircraft Company Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
US5841197A (en) * 1994-11-18 1998-11-24 Adamic, Jr.; Fred W. Inverted dielectric isolation process
US5696466A (en) * 1995-12-08 1997-12-09 The Whitaker Corporation Heterolithic microwave integrated impedance matching circuitry and method of manufacture
JP3347145B2 (ja) * 1996-09-26 2002-11-20 サムソン・エレクトロニクス・カンパニー・リミテッド マイクロ波ハイブリッド集積回路
JP2000277530A (ja) * 1999-03-25 2000-10-06 Hitachi Ltd 半導体装置及びその製造方法
JP4328887B2 (ja) 1999-07-05 2009-09-09 竹中エンジニアリング株式会社 移動物体検出装置
US6856004B2 (en) * 2001-07-10 2005-02-15 Anadigics, Inc. Compact layout for a semiconductor device
JP4175134B2 (ja) * 2002-05-20 2008-11-05 住友電気工業株式会社 ドライエッチング方法及び半導体装置の製造方法
JP4216634B2 (ja) * 2003-04-23 2009-01-28 株式会社日立製作所 半導体装置
US7230318B2 (en) * 2003-12-24 2007-06-12 Agency For Science, Technology And Research RF and MMIC stackable micro-modules

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