JP2006093449A - 積層構造体及び積層構造体アレイ、並びに、それらの製造方法 - Google Patents

積層構造体及び積層構造体アレイ、並びに、それらの製造方法 Download PDF

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Publication number
JP2006093449A
JP2006093449A JP2004278003A JP2004278003A JP2006093449A JP 2006093449 A JP2006093449 A JP 2006093449A JP 2004278003 A JP2004278003 A JP 2004278003A JP 2004278003 A JP2004278003 A JP 2004278003A JP 2006093449 A JP2006093449 A JP 2006093449A
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JP
Japan
Prior art keywords
internal electrode
conductive material
electrode layer
laminated structure
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2004278003A
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English (en)
Japanese (ja)
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JP2006093449A5 (enExample
Inventor
Toshiaki Kuniyasu
利明 国安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP2004278003A priority Critical patent/JP2006093449A/ja
Priority to US11/220,693 priority patent/US7054135B2/en
Publication of JP2006093449A publication Critical patent/JP2006093449A/ja
Publication of JP2006093449A5 publication Critical patent/JP2006093449A5/ja
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
JP2004278003A 2004-09-24 2004-09-24 積層構造体及び積層構造体アレイ、並びに、それらの製造方法 Abandoned JP2006093449A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004278003A JP2006093449A (ja) 2004-09-24 2004-09-24 積層構造体及び積層構造体アレイ、並びに、それらの製造方法
US11/220,693 US7054135B2 (en) 2004-09-24 2005-09-08 Multilayered structure, multilayered structure array and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004278003A JP2006093449A (ja) 2004-09-24 2004-09-24 積層構造体及び積層構造体アレイ、並びに、それらの製造方法

Publications (2)

Publication Number Publication Date
JP2006093449A true JP2006093449A (ja) 2006-04-06
JP2006093449A5 JP2006093449A5 (enExample) 2007-04-19

Family

ID=36098797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004278003A Abandoned JP2006093449A (ja) 2004-09-24 2004-09-24 積層構造体及び積層構造体アレイ、並びに、それらの製造方法

Country Status (2)

Country Link
US (1) US7054135B2 (enExample)
JP (1) JP2006093449A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281286A (ja) * 2006-04-10 2007-10-25 Fujifilm Corp 圧電素子及びその製造方法並びに液体噴出装置
JP2007329414A (ja) * 2006-06-09 2007-12-20 Nec Tokin Corp 圧電アクチュエータ
JP2008272438A (ja) * 2007-04-02 2008-11-13 Fujifilm Corp 超音波探触子及びその製造方法
JP2008311700A (ja) * 2007-06-12 2008-12-25 Fujifilm Corp 複合圧電材料、超音波探触子、超音波内視鏡、及び、超音波診断装置
JP2010519750A (ja) * 2007-02-20 2010-06-03 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング ピエゾアクチュエータおよびピエゾアクチュエータの製造方法
JP2010161273A (ja) * 2009-01-09 2010-07-22 Murata Mfg Co Ltd 圧電素子及びそれを備える流体機器
JP2012155832A (ja) * 2011-01-07 2012-08-16 Nhk Spring Co Ltd 圧電素子の製造方法、圧電素子、圧電アクチュエータ、及びヘッド・サスペンション
JP2015035545A (ja) * 2013-08-09 2015-02-19 日本セラミック株式会社 圧電セラミック素体

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4729260B2 (ja) * 2004-02-18 2011-07-20 富士フイルム株式会社 積層構造体及びその製造方法
JP2007149995A (ja) * 2005-11-28 2007-06-14 Fujifilm Corp 積層型圧電素子及びその製造方法
JP5347503B2 (ja) * 2006-08-08 2013-11-20 コニカミノルタ株式会社 超音波探触子、超音波探触子の製造方法
US20080238259A1 (en) * 2007-04-02 2008-10-02 Fujifilm Corporation Ultrasonic probe and production method thereof
DE102008049541A1 (de) * 2008-09-30 2010-04-15 Siemens Aktiengesellschaft Ultraschallwandler mit mindestens einem vollaktiven, monolithischen Piezoelement, Verfahren zum Kontaktieren des Ultraschallwandlers mittels photostrukturierter Isolationsschicht und Verwendung des Ultraschallwandlers
DE102010054589A1 (de) * 2010-12-15 2012-06-21 Epcos Ag Piezoaktuator mit Schutz vor Einflüssen der Umgebung
DE102012104830A1 (de) * 2012-06-04 2013-12-05 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
DE102012218755B4 (de) 2012-10-15 2018-07-05 Continental Automotive Gmbh Verfahren zum Herstellen eines elektronischen Bauelements als Stapel und als Stapel ausgebildetes elektronisches Bauelement
US10156490B2 (en) * 2013-06-07 2018-12-18 Schlumberger Technology Corporation Piezoelectric coatings for downhole sensing and monitoring
KR20160000753A (ko) * 2014-06-25 2016-01-05 삼성전기주식회사 박막형 커패시터 소자 및 이의 제조 방법
JP6838381B2 (ja) * 2016-12-14 2021-03-03 Tdk株式会社 積層電子部品
JP6728260B2 (ja) * 2018-03-22 2020-07-22 株式会社東芝 積層型超音波トランスデューサ及び超音波検査装置
US11883846B2 (en) * 2019-06-14 2024-01-30 GE Precision Healthcare LLC Method for manufacturing an ultrasound transducer and ultrasound probe
SE545844C2 (en) * 2022-10-17 2024-02-20 Precibeo Ab A drive element with two separate monolithic actuators for an electromechanical motor
KR20240080798A (ko) * 2022-11-30 2024-06-07 삼성전기주식회사 적층형 전자 부품

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187082A (ja) * 1989-01-13 1990-07-23 Alps Electric Co Ltd 電歪効果素子
JPH02284483A (ja) * 1989-04-26 1990-11-21 Hitachi Ltd 積層型圧電素子とその製法
JPH06291380A (ja) * 1993-03-31 1994-10-18 Olympus Optical Co Ltd 誘電体積層部品とその製造方法
JPH0923030A (ja) * 1995-07-05 1997-01-21 Oki Electric Ind Co Ltd 積層型圧電素子の製造方法
JP2001029346A (ja) * 1999-07-26 2001-02-06 Aloka Co Ltd 超音波探触子及びその製造方法
JP2004063886A (ja) * 2002-07-30 2004-02-26 Nec Tokin Corp 積層型圧電セラミック素子
JP2005072370A (ja) * 2003-08-26 2005-03-17 Ngk Insulators Ltd 積層セラミックス電子部品及び製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59115579A (ja) 1982-12-22 1984-07-04 Nec Corp 電歪効果素子およびその製造方法
US5548474A (en) * 1994-03-01 1996-08-20 Avx Corporation Electrical components such as capacitors having electrodes with an insulating edge
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
US6212062B1 (en) * 1998-09-29 2001-04-03 General Electric Company Sealed ultracapacitor
US6254715B1 (en) * 1999-03-22 2001-07-03 Tdk Corporation Process for production of electronic component having terminal electrode
DE10054812A1 (de) * 2000-11-04 2002-05-08 Philips Corp Intellectual Pty Keramikkondensator mit CZT-Dielektrikum

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187082A (ja) * 1989-01-13 1990-07-23 Alps Electric Co Ltd 電歪効果素子
JPH02284483A (ja) * 1989-04-26 1990-11-21 Hitachi Ltd 積層型圧電素子とその製法
JPH06291380A (ja) * 1993-03-31 1994-10-18 Olympus Optical Co Ltd 誘電体積層部品とその製造方法
JPH0923030A (ja) * 1995-07-05 1997-01-21 Oki Electric Ind Co Ltd 積層型圧電素子の製造方法
JP2001029346A (ja) * 1999-07-26 2001-02-06 Aloka Co Ltd 超音波探触子及びその製造方法
JP2004063886A (ja) * 2002-07-30 2004-02-26 Nec Tokin Corp 積層型圧電セラミック素子
JP2005072370A (ja) * 2003-08-26 2005-03-17 Ngk Insulators Ltd 積層セラミックス電子部品及び製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281286A (ja) * 2006-04-10 2007-10-25 Fujifilm Corp 圧電素子及びその製造方法並びに液体噴出装置
JP2007329414A (ja) * 2006-06-09 2007-12-20 Nec Tokin Corp 圧電アクチュエータ
JP2010519750A (ja) * 2007-02-20 2010-06-03 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング ピエゾアクチュエータおよびピエゾアクチュエータの製造方法
JP2008272438A (ja) * 2007-04-02 2008-11-13 Fujifilm Corp 超音波探触子及びその製造方法
JP2008311700A (ja) * 2007-06-12 2008-12-25 Fujifilm Corp 複合圧電材料、超音波探触子、超音波内視鏡、及び、超音波診断装置
JP2010161273A (ja) * 2009-01-09 2010-07-22 Murata Mfg Co Ltd 圧電素子及びそれを備える流体機器
JP2012155832A (ja) * 2011-01-07 2012-08-16 Nhk Spring Co Ltd 圧電素子の製造方法、圧電素子、圧電アクチュエータ、及びヘッド・サスペンション
JP2015035545A (ja) * 2013-08-09 2015-02-19 日本セラミック株式会社 圧電セラミック素体

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Publication number Publication date
US7054135B2 (en) 2006-05-30
US20060067029A1 (en) 2006-03-30

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