JP2006043584A - 塗布装置および塗布方法 - Google Patents
塗布装置および塗布方法 Download PDFInfo
- Publication number
- JP2006043584A JP2006043584A JP2004228105A JP2004228105A JP2006043584A JP 2006043584 A JP2006043584 A JP 2006043584A JP 2004228105 A JP2004228105 A JP 2004228105A JP 2004228105 A JP2004228105 A JP 2004228105A JP 2006043584 A JP2006043584 A JP 2006043584A
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- valve
- coating
- liquid storage
- storage space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 120
- 239000011248 coating agent Substances 0.000 title claims abstract description 113
- 239000007788 liquid Substances 0.000 claims abstract description 91
- 230000000740 bleeding effect Effects 0.000 claims description 3
- 238000007872 degassing Methods 0.000 abstract description 4
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1026—Valves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Degasification And Air Bubble Elimination (AREA)
Abstract
【解決手段】 1回目のショットが終了したならば、開閉弁14,21を閉とし、開閉弁11を開とし、且つシリンジポンプ9を元の位置に戻し、脱気モジュール8を介して再び塗布液貯留空間S内に塗布液を送り込む。このとき塗布液貯留空間S内は外部からのエアの巻き込みを防止するため余剰圧力で陽圧になっている。 この後、開閉弁11を閉じるとともに、分岐配管15の開閉弁17を開にする。すると前記したと同様に、塗布液貯留空間S内の余剰圧力は除去され大気圧に近い圧力まで低下する。このように、各ショットの直前に塗布液貯留空間S内の余剰圧力を除去することで、ショット毎の吐出前状態を常に一定の状態に保つことができる。
【選択図】 図1
Description
尚、塗布液貯留空間Sを大気に開放する場合には、圧力センサおよび圧力スイッチ16に関しては特に設けなくてもよい。
上記の状態から開閉弁3を開とし塗布液貯留タンク1内の塗布液を所定量だけエア抜きタンク6に送り込み、開閉弁3を閉じる。このときエア抜きタンク6は大気に開放されており、エア抜きタンク6に送り込まれた塗布液中の気泡が除去される。
Claims (3)
- 塗布液貯留タンク内の塗布液をエア抜きセクションを介して塗布液貯留空間に送り込み、ポンプにて塗布液貯留空間の体積を減少させることで塗布液貯留空間の下流側に設けたノズルから塗布液を吐出するようにした塗布装置において、前記エア抜きセクションとポンプとの間の配管および前記ポンプとノズルとの間の配管にはそれぞれ開閉弁が設けられ、これら開閉弁間の配管内の空間及びポンプ内の空間を前記塗布液貯留空間とし、この塗布液貯留空間を構成する配管の途中に開閉弁を備える分岐配管を設けてエア抜きタンクにつなげていることを特徴とする塗布装置。
- 請求項1に記載の塗布装置において、前記分岐管には圧力センサ、圧力スイッチまたは逆止弁が設けられていることを特徴とする塗布装置。
- 請求項1または請求項2に記載の塗布装置を用いた塗布方法において、前記エア抜きセクションとポンプとの間の配管に設けた開閉弁(11)を開、前記ポンプとノズルとの間の配管に設けた開閉弁(14)を閉、前記エア抜きタンクにつながる分岐配管の開閉弁(17)を閉として、前記エア抜きセクションから前記塗布液貯留空間に塗布液を送り込み、次いで、開閉弁(11)を閉、前記開閉弁(14)を閉、前記開閉弁(17)を開として、前記塗布液貯留空間内の余剰圧力を逃して塗布液貯留空間内の塗布液圧を大気圧若しくは一定圧とし、この後、前記開閉弁(11)を閉、前記開閉弁(14)を開、前記開閉弁(17)を閉として、ポンプを駆動して塗布液貯留空間内の体積を減少せしめて塗布液をノズルから吐出せしめることを特徴とする塗布方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004228105A JP4522187B2 (ja) | 2004-08-04 | 2004-08-04 | 塗布装置および塗布方法 |
KR1020050068859A KR101099256B1 (ko) | 2004-08-04 | 2005-07-28 | 도포장치 및 도포방법 |
TW094126237A TWI353892B (en) | 2004-08-04 | 2005-08-02 | Coating apparatus and method |
CN2005100885684A CN1736923B (zh) | 2004-08-04 | 2005-08-04 | 涂敷装置及涂敷方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004228105A JP4522187B2 (ja) | 2004-08-04 | 2004-08-04 | 塗布装置および塗布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006043584A true JP2006043584A (ja) | 2006-02-16 |
JP4522187B2 JP4522187B2 (ja) | 2010-08-11 |
Family
ID=36022751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004228105A Expired - Lifetime JP4522187B2 (ja) | 2004-08-04 | 2004-08-04 | 塗布装置および塗布方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4522187B2 (ja) |
KR (1) | KR101099256B1 (ja) |
CN (1) | CN1736923B (ja) |
TW (1) | TWI353892B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100889450B1 (ko) * | 2006-08-07 | 2009-03-23 | 도쿄 오카 고교 가부시키가이샤 | 약액 공급방법 |
JP2009141078A (ja) * | 2007-12-05 | 2009-06-25 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
JP2009178648A (ja) * | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | 塗布液供給システム |
WO2011037139A1 (ja) * | 2009-09-25 | 2011-03-31 | 武蔵エンジニアリング株式会社 | 気泡混入防止機構および該機構を備える液体材料吐出装置並びに液体材料吐出方法 |
JP4898778B2 (ja) * | 2006-02-21 | 2012-03-21 | 武蔵エンジニアリング株式会社 | 脱泡機構を備える液材吐出装置 |
JP2018099654A (ja) * | 2016-12-21 | 2018-06-28 | アネスト岩田株式会社 | シリンジポンプを用いた液体供給システム及びシリンジポンプへの液体供給方法 |
KR20220124620A (ko) * | 2021-03-03 | 2022-09-14 | 가부시키가이샤 스크린 홀딩스 | 급액 장치, 도포 장치, 에이징 장치, 및 급액 방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6942497B2 (ja) * | 2016-09-08 | 2021-09-29 | 東京エレクトロン株式会社 | 処理液供給装置 |
CN107029913A (zh) * | 2017-04-06 | 2017-08-11 | 武汉华星光电技术有限公司 | 一种涂布装置及涂布方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11333352A (ja) * | 1998-05-29 | 1999-12-07 | Dainippon Printing Co Ltd | ペースト供給装置及びそれを使用したプラズマディスプレイパネルの製造方法 |
JP2003181360A (ja) * | 2001-12-14 | 2003-07-02 | Mitsubishi Chemicals Corp | 塗布装置、塗布方法、および塗布基板の製造方法 |
JP2004141744A (ja) * | 2002-10-23 | 2004-05-20 | Toppan Printing Co Ltd | 塗布液供給装置及び方法 |
-
2004
- 2004-08-04 JP JP2004228105A patent/JP4522187B2/ja not_active Expired - Lifetime
-
2005
- 2005-07-28 KR KR1020050068859A patent/KR101099256B1/ko active IP Right Grant
- 2005-08-02 TW TW094126237A patent/TWI353892B/zh active
- 2005-08-04 CN CN2005100885684A patent/CN1736923B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11333352A (ja) * | 1998-05-29 | 1999-12-07 | Dainippon Printing Co Ltd | ペースト供給装置及びそれを使用したプラズマディスプレイパネルの製造方法 |
JP2003181360A (ja) * | 2001-12-14 | 2003-07-02 | Mitsubishi Chemicals Corp | 塗布装置、塗布方法、および塗布基板の製造方法 |
JP2004141744A (ja) * | 2002-10-23 | 2004-05-20 | Toppan Printing Co Ltd | 塗布液供給装置及び方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4898778B2 (ja) * | 2006-02-21 | 2012-03-21 | 武蔵エンジニアリング株式会社 | 脱泡機構を備える液材吐出装置 |
US8397955B2 (en) | 2006-02-21 | 2013-03-19 | Musashi Engineering, Inc. | Liquid material discharge device with debubbling mechanism |
TWI424885B (zh) * | 2006-02-21 | 2014-02-01 | Musashi Engineering Inc | A liquid discharge device having a defoaming mechanism |
KR100889450B1 (ko) * | 2006-08-07 | 2009-03-23 | 도쿄 오카 고교 가부시키가이샤 | 약액 공급방법 |
JP2009141078A (ja) * | 2007-12-05 | 2009-06-25 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
JP2009178648A (ja) * | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | 塗布液供給システム |
WO2011037139A1 (ja) * | 2009-09-25 | 2011-03-31 | 武蔵エンジニアリング株式会社 | 気泡混入防止機構および該機構を備える液体材料吐出装置並びに液体材料吐出方法 |
JP2011067756A (ja) * | 2009-09-25 | 2011-04-07 | Musashi Eng Co Ltd | 気泡混入防止機構および該機構を備える液体材料吐出装置並びに液体材料吐出方法 |
US8757449B2 (en) | 2009-09-25 | 2014-06-24 | Musashi Engineering, Inc. | Air bubble ingress prevention mechanism, liquid material discharge device provided with the same, and liquid material discharge method |
JP2018099654A (ja) * | 2016-12-21 | 2018-06-28 | アネスト岩田株式会社 | シリンジポンプを用いた液体供給システム及びシリンジポンプへの液体供給方法 |
KR20220124620A (ko) * | 2021-03-03 | 2022-09-14 | 가부시키가이샤 스크린 홀딩스 | 급액 장치, 도포 장치, 에이징 장치, 및 급액 방법 |
KR102649969B1 (ko) | 2021-03-03 | 2024-03-22 | 가부시키가이샤 스크린 홀딩스 | 급액 장치, 도포 장치, 에이징 장치, 및 급액 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN1736923A (zh) | 2006-02-22 |
JP4522187B2 (ja) | 2010-08-11 |
KR101099256B1 (ko) | 2011-12-27 |
TWI353892B (en) | 2011-12-11 |
TW200615053A (en) | 2006-05-16 |
KR20060048854A (ko) | 2006-05-18 |
CN1736923B (zh) | 2010-11-03 |
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