JP2006038779A5 - - Google Patents
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- Publication number
- JP2006038779A5 JP2006038779A5 JP2004222737A JP2004222737A JP2006038779A5 JP 2006038779 A5 JP2006038779 A5 JP 2006038779A5 JP 2004222737 A JP2004222737 A JP 2004222737A JP 2004222737 A JP2004222737 A JP 2004222737A JP 2006038779 A5 JP2006038779 A5 JP 2006038779A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- value
- series data
- calculating
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 6
- 238000011156 evaluation Methods 0.000 claims 4
- 238000009826 distribution Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000010894 electron beam technology Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004222737A JP2006038779A (ja) | 2004-07-30 | 2004-07-30 | パターン形状評価方法、評価装置、及び半導体装置の製造方法 |
| US11/185,852 US7366620B2 (en) | 2004-07-30 | 2005-07-21 | Evaluation method of fine pattern feature, its equipment, and method of semiconductor device fabrication |
| US12/078,840 US7684937B2 (en) | 2004-07-30 | 2008-04-07 | Evaluation method of fine pattern feature, its equipment, and method of semiconductor device fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004222737A JP2006038779A (ja) | 2004-07-30 | 2004-07-30 | パターン形状評価方法、評価装置、及び半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007196889A Division JP2007333745A (ja) | 2007-07-30 | 2007-07-30 | パターン形状評価方法、評価装置、及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006038779A JP2006038779A (ja) | 2006-02-09 |
| JP2006038779A5 true JP2006038779A5 (cg-RX-API-DMAC7.html) | 2008-12-04 |
Family
ID=35801063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004222737A Withdrawn JP2006038779A (ja) | 2004-07-30 | 2004-07-30 | パターン形状評価方法、評価装置、及び半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7366620B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2006038779A (cg-RX-API-DMAC7.html) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7813900B2 (en) * | 2006-02-01 | 2010-10-12 | National University Corporation The University Of Electro-Communications | Displacement detection method, displacement detection device, displacement detection program, phase singularity matching method and phase singularity matching program |
| KR101324419B1 (ko) | 2006-02-09 | 2013-11-01 | 케이엘에이-텐코 코포레이션 | 웨이퍼의 특성을 결정하기 위한 방법 및 시스템 |
| JP2008020735A (ja) * | 2006-07-13 | 2008-01-31 | Toshiba Corp | フォトマスクの評価方法及び半導体装置の製造方法 |
| CN101567048B (zh) * | 2008-04-21 | 2012-06-06 | 夏普株式会社 | 图像辨别装置及图像检索装置 |
| KR101647010B1 (ko) * | 2008-06-19 | 2016-08-10 | 케이엘에이-텐코어 코오포레이션 | 웨이퍼의 하나 이상의 특성들을 결정하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들 |
| US8298958B2 (en) * | 2008-07-17 | 2012-10-30 | Lam Research Corporation | Organic line width roughness with H2 plasma treatment |
| JP2010034402A (ja) * | 2008-07-30 | 2010-02-12 | Toshiba Corp | パターン形状予測方法 |
| WO2010052855A1 (ja) * | 2008-11-05 | 2010-05-14 | 株式会社日立ハイテクノロジーズ | パターン寸法計測方法及びそれを用いた走査電子顕微鏡 |
| US7879727B2 (en) * | 2009-01-15 | 2011-02-01 | Infineon Technologies Ag | Method of fabricating a semiconductor device including a pattern of line segments |
| SG2014015127A (en) * | 2009-04-27 | 2014-06-27 | Asahi Glass Co Ltd | Semiconductor heat treatment member having sic film |
| JP5452270B2 (ja) * | 2010-02-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | 寸法計測装置およびこれを用いた半導体装置の製造方法 |
| EP2567346B1 (en) * | 2010-05-05 | 2017-06-14 | Digimarc Corporation | Hidden image signaling |
| JP2014055789A (ja) * | 2012-09-11 | 2014-03-27 | Nuflare Technology Inc | パターン評価方法およびパターン評価装置 |
| JP6129651B2 (ja) * | 2013-06-11 | 2017-05-17 | 株式会社日立ハイテクノロジーズ | ラインパターンの形状評価方法及びその装置 |
| US9311639B2 (en) | 2014-02-11 | 2016-04-12 | Digimarc Corporation | Methods, apparatus and arrangements for device to device communication |
| JP2015176873A (ja) * | 2014-03-12 | 2015-10-05 | 株式会社東芝 | シミュレーション方法、シミュレーション装置、及び、コンピュータ読み取り可能な記録媒体 |
| US11521825B2 (en) | 2017-04-13 | 2022-12-06 | Fractilia, Llc | System and method for predicting stochastic-aware process window and yield and their use for process monitoring and control |
| US12142454B2 (en) | 2017-04-13 | 2024-11-12 | Fractilla, LLC | Detection of probabilistic process windows |
| US11508546B2 (en) | 2017-04-13 | 2022-11-22 | Fractilia, Llc | System and method for low-noise edge detection and its use for process monitoring and control |
| US10176966B1 (en) | 2017-04-13 | 2019-01-08 | Fractilia, Llc | Edge detection system |
| US10488188B2 (en) | 2017-04-13 | 2019-11-26 | Fractilia, Llc | System and method for removing noise from roughness measurements |
| US11361937B2 (en) | 2017-04-13 | 2022-06-14 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| US10522322B2 (en) | 2017-04-13 | 2019-12-31 | Fractilia, Llc | System and method for generating and analyzing roughness measurements |
| US10664955B2 (en) | 2017-04-13 | 2020-05-26 | Fractilia, Llc | Edge detection system and its use for machine learning |
| US11380516B2 (en) | 2017-04-13 | 2022-07-05 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| US10648801B2 (en) | 2017-04-13 | 2020-05-12 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| US10656532B2 (en) | 2017-04-13 | 2020-05-19 | Fractilia, Llc | Edge detection system and its use for optical proximity correction |
| US11355306B2 (en) | 2017-04-13 | 2022-06-07 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
| WO2018213487A1 (en) * | 2017-05-17 | 2018-11-22 | Applied Materials Israel Ltd. | Method, computer program product and system for detecting manufacturing process defects |
| US10731979B2 (en) * | 2018-01-12 | 2020-08-04 | Applied Materials Israel Ltd. | Method for monitoring nanometric structures |
| JP7011562B2 (ja) * | 2018-09-25 | 2022-01-26 | 株式会社日立ハイテク | パターン形状評価装置、パターン形状評価システム及びパターン形状評価方法 |
| CN114359112B (zh) * | 2022-03-11 | 2022-06-14 | 领伟创新智能系统(浙江)有限公司 | 基于加工表面图像Hoyer统计值的表面粗糙度评估方法 |
| CN114674858B (zh) * | 2022-03-14 | 2024-08-27 | 中南大学 | 一种三元正极材料性能指标综合评价方法及装置 |
| CN119725324B (zh) * | 2024-12-04 | 2025-07-04 | 北京智芯微电子科技有限公司 | 测试结构、栅极线宽粗糙度测试方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000117483A (ja) * | 1998-10-15 | 2000-04-25 | Kobe Steel Ltd | 溶接用ワイヤ |
| JP4040809B2 (ja) * | 1999-09-22 | 2008-01-30 | 株式会社東芝 | 微細パターン測定方法、微細パターン測定装置及び微細パターン測定プログラムを記録した記録媒体 |
| JP2002243428A (ja) | 2001-02-13 | 2002-08-28 | Hitachi Ltd | パターン検査方法およびその装置 |
| JP3870044B2 (ja) | 2001-07-25 | 2007-01-17 | 株式会社日立製作所 | パターン検査方法及びパターン検査装置 |
| DE10160172B4 (de) * | 2001-12-07 | 2016-06-09 | Carl Zeiss Microscopy Gmbh | Laserscanningmikroskop und Laserscanningmikroskopieverfahren |
| JP4364524B2 (ja) | 2003-02-20 | 2009-11-18 | 株式会社日立製作所 | パターン検査方法 |
| US8340393B2 (en) * | 2003-12-10 | 2012-12-25 | Applied Materials Israel Limited | Advanced roughness metrology |
-
2004
- 2004-07-30 JP JP2004222737A patent/JP2006038779A/ja not_active Withdrawn
-
2005
- 2005-07-21 US US11/185,852 patent/US7366620B2/en not_active Expired - Lifetime
-
2008
- 2008-04-07 US US12/078,840 patent/US7684937B2/en not_active Expired - Lifetime
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