JP2006024654A - インターポーザ - Google Patents

インターポーザ Download PDF

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Publication number
JP2006024654A
JP2006024654A JP2004199872A JP2004199872A JP2006024654A JP 2006024654 A JP2006024654 A JP 2006024654A JP 2004199872 A JP2004199872 A JP 2004199872A JP 2004199872 A JP2004199872 A JP 2004199872A JP 2006024654 A JP2006024654 A JP 2006024654A
Authority
JP
Japan
Prior art keywords
conductive layer
substrate
interposer
layer
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004199872A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006024654A5 (https=
Inventor
Masami Yakabe
正巳 八壁
Kenichi Kagawa
健一 加川
Tomohisa Hoshino
智久 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004199872A priority Critical patent/JP2006024654A/ja
Priority to PCT/JP2005/012425 priority patent/WO2006004128A1/ja
Priority to EP05765497A priority patent/EP1775761A4/en
Priority to US11/631,638 priority patent/US7866038B2/en
Priority to KR1020087003018A priority patent/KR100858075B1/ko
Priority to TW094122866A priority patent/TW200616503A/zh
Publication of JP2006024654A publication Critical patent/JP2006024654A/ja
Publication of JP2006024654A5 publication Critical patent/JP2006024654A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2004199872A 2004-07-06 2004-07-06 インターポーザ Pending JP2006024654A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004199872A JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ
PCT/JP2005/012425 WO2006004128A1 (ja) 2004-07-06 2005-07-05 貫通基板およびインターポーザ、ならびに貫通基板の製造方法
EP05765497A EP1775761A4 (en) 2004-07-06 2005-07-05 SUBSTRATE AND INTERMEDIATE AND METHOD FOR PRODUCING A SUBSTRATE
US11/631,638 US7866038B2 (en) 2004-07-06 2005-07-05 Through substrate, interposer and manufacturing method of through substrate
KR1020087003018A KR100858075B1 (ko) 2004-07-06 2005-07-05 인터포저
TW094122866A TW200616503A (en) 2004-07-06 2005-07-06 Through substrate and interposer, and method for manufacturing through substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199872A JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ

Publications (2)

Publication Number Publication Date
JP2006024654A true JP2006024654A (ja) 2006-01-26
JP2006024654A5 JP2006024654A5 (https=) 2007-04-05

Family

ID=35797732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004199872A Pending JP2006024654A (ja) 2004-07-06 2004-07-06 インターポーザ

Country Status (1)

Country Link
JP (1) JP2006024654A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9474147B2 (en) 2014-06-10 2016-10-18 Fujitsu Limited Socket for semiconductor component, printed circuit board unit, and information processing apparatus
US9570375B2 (en) 2012-06-27 2017-02-14 Longitude Semiconductor S.A.R.L. Semiconductor device having silicon interposer on which semiconductor chip is mounted

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163192A (ja) * 1997-11-25 1999-06-18 Hitachi Ltd セラミック多層同軸信号配線基板及びセラミック多層同軸信号配線基板の製造方法及び電子回路装置
JP2000151114A (ja) * 1998-11-11 2000-05-30 Sony Corp 多層基板及びその製造方法
JP2001332652A (ja) * 2000-05-24 2001-11-30 Nec Corp 半導体パッケージ及びその製造方法
JP2001352017A (ja) * 2000-06-06 2001-12-21 Fujitsu Ltd 電子装置実装基板及びその製造方法
JP2004526321A (ja) * 2001-02-22 2004-08-26 トル−シ・テクノロジーズ・インコーポレイテッド 開口に複数の導電層が形成された半導体構造体、及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163192A (ja) * 1997-11-25 1999-06-18 Hitachi Ltd セラミック多層同軸信号配線基板及びセラミック多層同軸信号配線基板の製造方法及び電子回路装置
JP2000151114A (ja) * 1998-11-11 2000-05-30 Sony Corp 多層基板及びその製造方法
JP2001332652A (ja) * 2000-05-24 2001-11-30 Nec Corp 半導体パッケージ及びその製造方法
JP2001352017A (ja) * 2000-06-06 2001-12-21 Fujitsu Ltd 電子装置実装基板及びその製造方法
JP2004526321A (ja) * 2001-02-22 2004-08-26 トル−シ・テクノロジーズ・インコーポレイテッド 開口に複数の導電層が形成された半導体構造体、及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570375B2 (en) 2012-06-27 2017-02-14 Longitude Semiconductor S.A.R.L. Semiconductor device having silicon interposer on which semiconductor chip is mounted
US9474147B2 (en) 2014-06-10 2016-10-18 Fujitsu Limited Socket for semiconductor component, printed circuit board unit, and information processing apparatus

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