JP2005516382A5 - - Google Patents

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Publication number
JP2005516382A5
JP2005516382A5 JP2003560974A JP2003560974A JP2005516382A5 JP 2005516382 A5 JP2005516382 A5 JP 2005516382A5 JP 2003560974 A JP2003560974 A JP 2003560974A JP 2003560974 A JP2003560974 A JP 2003560974A JP 2005516382 A5 JP2005516382 A5 JP 2005516382A5
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JP
Japan
Prior art keywords
aryl
formula
alkyl
group
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003560974A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005516382A (ja
Filing date
Publication date
Priority claimed from US10/158,513 external-priority patent/US7141188B2/en
Application filed filed Critical
Priority claimed from PCT/US2003/000948 external-priority patent/WO2003060979A2/en
Publication of JP2005516382A publication Critical patent/JP2005516382A/ja
Publication of JP2005516382A5 publication Critical patent/JP2005516382A5/ja
Pending legal-status Critical Current

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JP2003560974A 2002-01-15 2003-01-14 有機組成物 Pending JP2005516382A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US35018702P 2002-01-15 2002-01-15
US35055702P 2002-01-22 2002-01-22
US35301102P 2002-01-30 2002-01-30
US37621902P 2002-04-29 2002-04-29
US37842402P 2002-05-07 2002-05-07
US10/158,513 US7141188B2 (en) 2001-05-30 2002-05-30 Organic compositions
PCT/US2003/000948 WO2003060979A2 (en) 2002-01-15 2003-01-14 Organic compositions for low dielectric constant materials

Publications (2)

Publication Number Publication Date
JP2005516382A JP2005516382A (ja) 2005-06-02
JP2005516382A5 true JP2005516382A5 (xx) 2006-03-23

Family

ID=27558468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003560974A Pending JP2005516382A (ja) 2002-01-15 2003-01-14 有機組成物

Country Status (6)

Country Link
EP (1) EP1466356A2 (xx)
JP (1) JP2005516382A (xx)
KR (1) KR20040104454A (xx)
CN (1) CN1643669A (xx)
AU (1) AU2003210504A1 (xx)
WO (1) WO2003060979A2 (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878779B2 (ja) * 2004-06-10 2012-02-15 富士フイルム株式会社 膜形成用組成物、絶縁膜及び電子デバイス
US7491658B2 (en) * 2004-10-13 2009-02-17 International Business Machines Corporation Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
US7531209B2 (en) 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
JP4659486B2 (ja) * 2005-03-01 2011-03-30 富士フイルム株式会社 電子デバイス用絶縁膜、電子デバイス及び電子デバイス用絶縁膜の製造方法
JP2006257212A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 膜形成用組成物、それを用いた絶縁膜および電子デバイス
JP2007031663A (ja) * 2005-07-29 2007-02-08 Fujifilm Corp 膜形成用組成物、それを用いて形成された絶縁膜及び電子デバイス
JP2007314778A (ja) * 2006-04-26 2007-12-06 Fujifilm Corp 膜形成用組成物、該組成物を用いて形成した絶縁膜及び電子デバイス
WO2007143029A1 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Porous materials derived from polymer composites
WO2007143026A2 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
US7790234B2 (en) 2006-05-31 2010-09-07 Michael Raymond Ayers Low dielectric constant materials prepared from soluble fullerene clusters
US7875315B2 (en) 2006-05-31 2011-01-25 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
CA2669970A1 (en) * 2006-11-17 2008-05-22 University Of Massachusetts Lowell Functional hydrocarbon polymers and process for producing same
JP2008231259A (ja) * 2007-03-20 2008-10-02 Sumitomo Bakelite Co Ltd 有機絶縁材料
JP2009013116A (ja) 2007-07-05 2009-01-22 Daicel Chem Ind Ltd エチニルフェニルビアダマンタン誘導体
GB2451865A (en) 2007-08-15 2009-02-18 Univ Liverpool Microporous polymers from alkynyl monomers
US20240087880A1 (en) * 2022-08-26 2024-03-14 Applied Materials, Inc. Systems and methods for depositing low-k dielectric films

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3415741B2 (ja) * 1997-03-31 2003-06-09 東レ・ダウコーニング・シリコーン株式会社 電気絶縁性薄膜形成用組成物および電気絶縁性薄膜の形成方法
IL143207A0 (en) * 1998-11-24 2002-04-21 Dow Chemical Co A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom
JP3483500B2 (ja) * 1999-05-28 2004-01-06 富士通株式会社 絶縁膜形成材料、絶縁膜形成方法及び半導体装置
JP2001192539A (ja) * 2000-01-13 2001-07-17 Jsr Corp 熱硬化性樹脂組成物、その硬化物およびその硬化物を含む回路基板
US6509415B1 (en) * 2000-04-07 2003-01-21 Honeywell International Inc. Low dielectric constant organic dielectrics based on cage-like structures
JP4651774B2 (ja) * 2000-04-11 2011-03-16 新日鐵化学株式会社 芳香族オリゴマー、それを配合したフェノール樹脂組成物並びにエポキシ樹脂組成物およびその硬化物
JP2002003683A (ja) * 2000-06-26 2002-01-09 Hitachi Chem Co Ltd 低吸湿低複屈折樹脂組成物、これから得られる成形材、シート又はフィルムおよび光学用部品
EP1197998A3 (en) * 2000-10-10 2005-12-21 Shipley Company LLC Antireflective porogens
US20030006477A1 (en) * 2001-05-23 2003-01-09 Shipley Company, L.L.C. Porous materials
JP2003131001A (ja) * 2001-05-25 2003-05-08 Shipley Co Llc 多孔性光学物質
US7049005B2 (en) * 2001-05-30 2006-05-23 Honeywell International Inc. Organic compositions

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