JP2005505897A5 - - Google Patents

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Publication number
JP2005505897A5
JP2005505897A5 JP2003534996A JP2003534996A JP2005505897A5 JP 2005505897 A5 JP2005505897 A5 JP 2005505897A5 JP 2003534996 A JP2003534996 A JP 2003534996A JP 2003534996 A JP2003534996 A JP 2003534996A JP 2005505897 A5 JP2005505897 A5 JP 2005505897A5
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JP
Japan
Prior art keywords
composition
weight
range
interpolymer
copolymer
Prior art date
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Application number
JP2003534996A
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English (en)
Japanese (ja)
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JP4411074B2 (ja
JP2005505897A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/033400 external-priority patent/WO2003032087A2/en
Publication of JP2005505897A publication Critical patent/JP2005505897A/ja
Publication of JP2005505897A5 publication Critical patent/JP2005505897A5/ja
Application granted granted Critical
Publication of JP4411074B2 publication Critical patent/JP4411074B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003534996A 2001-10-12 2002-10-09 水性現像可能な光画像形成用厚膜組成物 Expired - Fee Related JP4411074B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32873501P 2001-10-12 2001-10-12
PCT/US2002/033400 WO2003032087A2 (en) 2001-10-12 2002-10-09 Aqueous developable photoimageable thick film compositions

Publications (3)

Publication Number Publication Date
JP2005505897A JP2005505897A (ja) 2005-02-24
JP2005505897A5 true JP2005505897A5 (enExample) 2006-01-05
JP4411074B2 JP4411074B2 (ja) 2010-02-10

Family

ID=23282196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003534996A Expired - Fee Related JP4411074B2 (ja) 2001-10-12 2002-10-09 水性現像可能な光画像形成用厚膜組成物

Country Status (9)

Country Link
US (1) US6994948B2 (enExample)
EP (1) EP1435020B1 (enExample)
JP (1) JP4411074B2 (enExample)
KR (1) KR100635430B1 (enExample)
CN (1) CN1809787B (enExample)
AU (1) AU2002353831A1 (enExample)
DE (1) DE60234942D1 (enExample)
TW (1) TWI255966B (enExample)
WO (1) WO2003032087A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4071171B2 (ja) * 2003-08-21 2008-04-02 太陽インキ製造株式会社 感光性導電組成物およびプラズマディスプレイパネル
US7618704B2 (en) * 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
KR100996235B1 (ko) * 2004-06-01 2010-11-25 주식회사 동진쎄미켐 PDP 어드레스 전극용 Pb 미함유 Ag 페이스트 조성물
US7135267B2 (en) * 2004-08-06 2006-11-14 E. I. Du Pont De Nemours And Company Aqueous developable photoimageable compositions for use in photo-patterning methods
JP2006133378A (ja) * 2004-11-04 2006-05-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
US7771625B2 (en) 2004-11-29 2010-08-10 Dainippon Ink And Chemicals, Inc. Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
US7291292B2 (en) 2005-08-26 2007-11-06 E.I. Du Pont De Nemours And Company Preparation of silver particles using thermomorphic polymers
US20100113871A1 (en) * 2006-09-13 2010-05-06 Aylvin Jorge Angelo Athanasius Dias Antimicrobial coating
JP2009138243A (ja) * 2007-12-07 2009-06-25 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク並びに銀粒子の製造方法
DE102008034946B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Herstellungsverfahren eines Edelmetallverbindungsmittels
DE102008045148A1 (de) * 2008-09-01 2010-03-04 Allgemeine Gold- Und Silberscheideanstalt Aktiengesellschaft Silberkatalysator zur Formaldehyd-Herstellung
US7857998B2 (en) * 2008-11-24 2010-12-28 E. I. Du Pont De Nemours And Company High conductivity polymer thick film silver conductor composition for use in RFID and other applications
US7887992B2 (en) * 2008-12-23 2011-02-15 E. I. Du Pont De Nemours And Company Photosensitive paste and process for production of pattern using the same
JP2013151753A (ja) * 2013-03-04 2013-08-08 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
CN104051689B (zh) * 2013-03-13 2020-06-02 三星Sdi株式会社 隔板和包括该隔板的可再充电锂电池
JP6405867B2 (ja) * 2013-12-16 2018-10-17 日立化成株式会社 樹脂ペースト組成物及び半導体装置
KR102220531B1 (ko) * 2018-04-23 2021-02-24 삼성에스디아이 주식회사 전극 형성용 조성물 및 이로부터 제조된 전극과 태양전지
JP2023050084A (ja) * 2021-09-29 2023-04-10 株式会社大阪ソーダ 導電性樹脂組成物、及び発熱抵抗体を形成した回路基板の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5080999A (en) 1985-06-10 1992-01-14 Fuji Photo Film Co., Ltd. Light-sensitive diazo resin composition containing a higher fatty acid or higher fatty acid amide
EP0259812A3 (en) * 1986-09-10 1990-01-31 E.I. Du Pont De Nemours And Company Photopolymerizable compositions containing inorganic fillers
US5180757A (en) 1987-12-16 1993-01-19 Michael Lucey Photopolymerizable compositions used in electronics
US5134175A (en) 1987-12-16 1992-07-28 Michael Lucey Curable composition for electrical and electronic components
US4925771A (en) 1988-05-31 1990-05-15 E. I. Dupont De Nemours And Company Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles
US4912019A (en) 1988-05-31 1990-03-27 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable ceramic coating composition
US5032490A (en) 1989-08-21 1991-07-16 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable copper conductor composition
US5049480A (en) 1990-02-20 1991-09-17 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable silver conductor composition
JP3672105B2 (ja) 1991-09-09 2005-07-13 東レ株式会社 感光性導電ペースト
JP3218767B2 (ja) 1992-01-24 2001-10-15 東レ株式会社 感光性導電ペースト
US6004705A (en) 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
JPH06313948A (ja) * 1993-04-28 1994-11-08 Fuji Photo Film Co Ltd 写真感光材料用成形品及びその成形方法並びにそれを用いた包装体
CN1179557A (zh) * 1996-05-21 1998-04-22 纳幕尔杜邦公司 采用乙烯吡咯烷酮聚合物的可水显影光敏厚膜组合物
TW367504B (en) 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer
JP3510761B2 (ja) 1997-03-26 2004-03-29 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP3686749B2 (ja) 1997-11-04 2005-08-24 太陽インキ製造株式会社 パターン状無機質焼成被膜及びプラズマディスプレイパネルの製造方法
JP4090103B2 (ja) * 1998-03-02 2008-05-28 太陽インキ製造株式会社 感光性組成物及びそれを用いて得られる焼成物パターン
JPH11246638A (ja) 1998-03-02 1999-09-14 Taiyo Ink Mfg Ltd 感光性組成物及びそれを用いて得られる焼成物パターン
JP3953625B2 (ja) 1998-03-02 2007-08-08 太陽インキ製造株式会社 感光性組成物
DE69910335T2 (de) 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
JP3394938B2 (ja) 1999-03-25 2003-04-07 株式会社村田製作所 感光性導体ペースト
US6194124B1 (en) 1999-08-12 2001-02-27 E. I. Du Pont De Nemours And Company Photosensitive ceramic compositions containing polycarbonate polymers
US6762009B2 (en) 2001-10-12 2004-07-13 E. I. Du Pont De Nemours And Company Aqueous developable photoimageable thick film compositions with photospeed enhancer

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