TWI255966B - Aqueous developable photoimageable thick film compositions - Google Patents

Aqueous developable photoimageable thick film compositions

Info

Publication number
TWI255966B
TWI255966B TW091123449A TW91123449A TWI255966B TW I255966 B TWI255966 B TW I255966B TW 091123449 A TW091123449 A TW 091123449A TW 91123449 A TW91123449 A TW 91123449A TW I255966 B TWI255966 B TW I255966B
Authority
TW
Taiwan
Prior art keywords
thick film
aqueous developable
film compositions
photoimageable thick
developable photoimageable
Prior art date
Application number
TW091123449A
Other languages
English (en)
Inventor
Howard David Glicksman
Haixin Yang
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of TWI255966B publication Critical patent/TWI255966B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Conductive Materials (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
  • Polymerisation Methods In General (AREA)
TW091123449A 2001-10-12 2002-10-11 Aqueous developable photoimageable thick film compositions TWI255966B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32873501P 2001-10-12 2001-10-12

Publications (1)

Publication Number Publication Date
TWI255966B true TWI255966B (en) 2006-06-01

Family

ID=23282196

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091123449A TWI255966B (en) 2001-10-12 2002-10-11 Aqueous developable photoimageable thick film compositions

Country Status (9)

Country Link
US (1) US6994948B2 (zh)
EP (1) EP1435020B1 (zh)
JP (1) JP4411074B2 (zh)
KR (1) KR100635430B1 (zh)
CN (1) CN1809787B (zh)
AU (1) AU2002353831A1 (zh)
DE (1) DE60234942D1 (zh)
TW (1) TWI255966B (zh)
WO (1) WO2003032087A2 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4071171B2 (ja) * 2003-08-21 2008-04-02 太陽インキ製造株式会社 感光性導電組成物およびプラズマディスプレイパネル
US7618704B2 (en) 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
KR100996235B1 (ko) * 2004-06-01 2010-11-25 주식회사 동진쎄미켐 ＰＤＰ 어드레스 전극용 Ｐｂ 미함유 Ａｇ 페이스트 조성물
US7135267B2 (en) 2004-08-06 2006-11-14 E. I. Du Pont De Nemours And Company Aqueous developable photoimageable compositions for use in photo-patterning methods
JP2006133378A (ja) * 2004-11-04 2006-05-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
WO2006057348A1 (ja) 2004-11-29 2006-06-01 Dainippon Ink And Chemicals, Inc. 表面処理された銀含有粉末の製造方法、及び表面処理された銀含有粉末を用いた銀ペースト
US7291292B2 (en) 2005-08-26 2007-11-06 E.I. Du Pont De Nemours And Company Preparation of silver particles using thermomorphic polymers
JP2010503737A (ja) * 2006-09-13 2010-02-04 ディーエスエム アイピー アセッツ ビー．ブイ． 金属銀粒子を含む抗菌性の親水性コーティング
JP2009138243A (ja) * 2007-12-07 2009-06-25 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク並びに銀粒子の製造方法
DE102008034946B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Herstellungsverfahren eines Edelmetallverbindungsmittels
DE102008045148A1 (de) * 2008-09-01 2010-03-04 Allgemeine Gold- Und Silberscheideanstalt Aktiengesellschaft Silberkatalysator zur Formaldehyd-Herstellung
US7857998B2 (en) * 2008-11-24 2010-12-28 E. I. Du Pont De Nemours And Company High conductivity polymer thick film silver conductor composition for use in RFID and other applications
US7887992B2 (en) * 2008-12-23 2011-02-15 E. I. Du Pont De Nemours And Company Photosensitive paste and process for production of pattern using the same
JP2013151753A (ja) * 2013-03-04 2013-08-08 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
JP2014179321A (ja) * 2013-03-13 2014-09-25 Samsung Sdi Co Ltd セパレータおよびこれを含むリチウム二次電池
JP6405867B2 (ja) * 2013-12-16 2018-10-17 日立化成株式会社 樹脂ペースト組成物及び半導体装置
KR102220531B1 (ko) * 2018-04-23 2021-02-24 삼성에스디아이 주식회사 전극 형성용 조성물 및 이로부터 제조된 전극과 태양전지

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5080999A (en) 1985-06-10 1992-01-14 Fuji Photo Film Co., Ltd. Light-sensitive diazo resin composition containing a higher fatty acid or higher fatty acid amide
EP0259812A3 (en) * 1986-09-10 1990-01-31 E.I. Du Pont De Nemours And Company Photopolymerizable compositions containing inorganic fillers
US5134175A (en) 1987-12-16 1992-07-28 Michael Lucey Curable composition for electrical and electronic components
US5180757A (en) 1987-12-16 1993-01-19 Michael Lucey Photopolymerizable compositions used in electronics
US4912019A (en) 1988-05-31 1990-03-27 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable ceramic coating composition
US4925771A (en) 1988-05-31 1990-05-15 E. I. Dupont De Nemours And Company Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles
US5032490A (en) 1989-08-21 1991-07-16 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable copper conductor composition
US5049480A (en) 1990-02-20 1991-09-17 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable silver conductor composition
JP3672105B2 (ja) 1991-09-09 2005-07-13 東レ株式会社 感光性導電ペースト
JP3218767B2 (ja) 1992-01-24 2001-10-15 東レ株式会社 感光性導電ペースト
US6004705A (en) 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
JPH06313948A (ja) * 1993-04-28 1994-11-08 Fuji Photo Film Co Ltd 写真感光材料用成形品及びその成形方法並びにそれを用いた包装体
TW367504B (en) 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer
CN1179557A (zh) * 1996-05-21 1998-04-22 纳幕尔杜邦公司 采用乙烯吡咯烷酮聚合物的可水显影光敏厚膜组合物
JP3510761B2 (ja) 1997-03-26 2004-03-29 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP3686749B2 (ja) 1997-11-04 2005-08-24 太陽インキ製造株式会社 パターン状無機質焼成被膜及びプラズマディスプレイパネルの製造方法
JPH11246638A (ja) 1998-03-02 1999-09-14 Taiyo Ink Mfg Ltd 感光性組成物及びそれを用いて得られる焼成物パターン
JP3953625B2 (ja) * 1998-03-02 2007-08-08 太陽インキ製造株式会社 感光性組成物
JP4090103B2 (ja) 1998-03-02 2008-05-28 太陽インキ製造株式会社 感光性組成物及びそれを用いて得られる焼成物パターン
DE69910335T2 (de) 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
JP3394938B2 (ja) 1999-03-25 2003-04-07 株式会社村田製作所 感光性導体ペースト
US6194124B1 (en) 1999-08-12 2001-02-27 E. I. Du Pont De Nemours And Company Photosensitive ceramic compositions containing polycarbonate polymers
US6762009B2 (en) 2001-10-12 2004-07-13 E. I. Du Pont De Nemours And Company Aqueous developable photoimageable thick film compositions with photospeed enhancer

Also Published As

Publication number Publication date
WO2003032087A2 (en) 2003-04-17
EP1435020B1 (en) 2009-12-30
EP1435020A2 (en) 2004-07-07
KR100635430B1 (ko) 2006-10-19
KR20050034593A (ko) 2005-04-14
AU2002353831A1 (en) 2003-04-22
DE60234942D1 (de) 2010-02-11
JP4411074B2 (ja) 2010-02-10
US20030087170A1 (en) 2003-05-08
CN1809787B (zh) 2010-11-03
WO2003032087A3 (en) 2003-06-19
CN1809787A (zh) 2006-07-26
JP2005505897A (ja) 2005-02-24
US6994948B2 (en) 2006-02-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees