JP2005502196A - フレキシブル回路用液晶ポリマー - Google Patents

フレキシブル回路用液晶ポリマー Download PDF

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Publication number
JP2005502196A
JP2005502196A JP2003525569A JP2003525569A JP2005502196A JP 2005502196 A JP2005502196 A JP 2005502196A JP 2003525569 A JP2003525569 A JP 2003525569A JP 2003525569 A JP2003525569 A JP 2003525569A JP 2005502196 A JP2005502196 A JP 2005502196A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal polymer
film
metal
etchant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003525569A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005502196A5 (enExample
Inventor
ルイ・ヤン
グオピン・マオ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005502196A publication Critical patent/JP2005502196A/ja
Publication of JP2005502196A5 publication Critical patent/JP2005502196A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2003525569A 2001-09-04 2002-08-15 フレキシブル回路用液晶ポリマー Pending JP2005502196A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/947,082 US6923919B2 (en) 2000-07-18 2001-09-04 Liquid crystal polymers for flexible circuits
PCT/US2002/026030 WO2003022021A1 (en) 2001-09-04 2002-08-15 Liquid crystal polymers for flexible circuits

Publications (2)

Publication Number Publication Date
JP2005502196A true JP2005502196A (ja) 2005-01-20
JP2005502196A5 JP2005502196A5 (enExample) 2006-01-05

Family

ID=25485490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003525569A Pending JP2005502196A (ja) 2001-09-04 2002-08-15 フレキシブル回路用液晶ポリマー

Country Status (7)

Country Link
US (1) US6923919B2 (enExample)
EP (1) EP1428417A1 (enExample)
JP (1) JP2005502196A (enExample)
KR (1) KR20040029148A (enExample)
CN (1) CN1320847C (enExample)
TW (1) TW540259B (enExample)
WO (1) WO2003022021A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006282791A (ja) * 2005-03-31 2006-10-19 Toray Eng Co Ltd 液晶ポリマーのエッチング液及び液晶ポリマーのエッチング方法。
JP2010165877A (ja) * 2009-01-16 2010-07-29 Faintekku:Kk フレキシブルプリント基板の製造方法

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040247921A1 (en) * 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
AU2002227426A1 (en) 2000-08-15 2002-06-24 World Properties Inc. Multi-layer circuits and methods of manufacture thereof
US20020064701A1 (en) * 2000-09-11 2002-05-30 Hand Doris I. Conductive liquid crystalline polymer film and method of manufacture thereof
AU2001292823A1 (en) 2000-09-20 2002-04-02 World Properties Inc. Electrostatic deposition of high temperature, high performance thermoplastics
JP2004516662A (ja) 2000-12-14 2004-06-03 ワールド・プロパティーズ・インコーポレイテッド 液晶ポリマー接着層および該接着層から形成された回路
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
US7142083B2 (en) 2002-09-17 2006-11-28 Lindsey Raymond A Electronics component and method for fabricating same
JP3689096B2 (ja) * 2002-10-02 2005-08-31 学校法人神奈川大学 薄膜の形成方法
US6819373B2 (en) * 2002-10-03 2004-11-16 International Business Machines Corporation Lamination of liquid crystal polymer dielectric films
US7549220B2 (en) * 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
US20050186404A1 (en) * 2004-02-23 2005-08-25 Guoping Mao Etched polycarbonate films
US7425276B2 (en) * 2004-06-30 2008-09-16 University Of South Florida Method for etching microchannel networks within liquid crystal polymer substrates
KR100584962B1 (ko) * 2004-07-26 2006-05-29 삼성전기주식회사 액정 중합체로 커버레이 성형된 경연성 인쇄회로기판 및그 제조 방법
US20070013600A1 (en) * 2005-07-14 2007-01-18 Centurion Wireless Technologies, Inc. Antenna radiators made from metalized plastic, composites, or fabrics
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
US20070235214A1 (en) * 2006-03-30 2007-10-11 Hall Stephen H Moisture resistant printed circuit board
US8263862B2 (en) * 2009-02-07 2012-09-11 Linden Photonics, Inc. Hermetic electrical ports in liquid crystal polymer packages
US20120021218A1 (en) 2010-07-23 2012-01-26 Syscom Advanced Materials, Inc. Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof
US9909063B2 (en) 2010-11-03 2018-03-06 3M Innovative Properties Company Polymer etchant and method of using same
US9324472B2 (en) 2010-12-29 2016-04-26 Syscom Advanced Materials, Inc. Metal and metallized fiber hybrid wire
US9145469B2 (en) 2012-09-27 2015-09-29 Ticona Llc Aromatic polyester containing a biphenyl chain disruptor
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
JP6929936B2 (ja) * 2017-04-06 2021-09-01 三菱製紙株式会社 樹脂組成物用のエッチング液及びエッチング方法
WO2019217053A1 (en) 2018-05-07 2019-11-14 Neograf Solutions, Llc Methods and apparatus for forming liquid crystal polymer flexible circuits
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法
CN112620983A (zh) * 2019-04-19 2021-04-09 吴国喜 一种lcp钻孔系统及方法
CN111499915A (zh) * 2019-12-30 2020-08-07 瑞声科技(新加坡)有限公司 一种lcp薄膜的表面处理方法
US11482884B2 (en) * 2020-12-28 2022-10-25 Nucurrent, Inc. Systems and methods for utilizing laser cutting and chemical etching in manufacturing wireless power antennas
US11538629B2 (en) 2020-12-28 2022-12-27 Nucurrent, Inc. Systems and methods for utilizing laser cutting and chemical etching in manufacturing wireless power antennas
CN113788975A (zh) * 2021-09-14 2021-12-14 上海普利特复合材料股份有限公司 一种lcp材料的表面处理方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB979779A (en) 1961-01-09 1965-01-06 Photocircuits Corp Method of making printed circuits
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface
US4426253A (en) * 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
JP2581543B2 (ja) * 1986-07-04 1997-02-12 エビナ電化工業 株式会社 メッキした全芳香族系ポリエステル液晶ポリマ−成形品の製造法
US5066545A (en) 1987-02-24 1991-11-19 Polyonics Corporation Process for forming polyimide-metal laminates
DE3884546T3 (de) * 1987-10-02 2000-03-23 Polyplastics Co. Ltd., Osaka Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz.
US4975312A (en) * 1988-06-20 1990-12-04 Foster-Miller, Inc. Multiaxially oriented thermotropic polymer substrate for printed wire board
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US4995941A (en) 1989-05-15 1991-02-26 Rogers Corporation Method of manufacture interconnect device
US5192590A (en) * 1989-11-03 1993-03-09 Raychem Corporation Coating metal on poly(aryl ether ketone) surfaces
DE4028210A1 (de) * 1990-09-06 1992-03-12 Basf Ag Verfahren zur oberflaechenbehandlung von formkoerpern auf der basis von fluessigkristallinen polymeren
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP2768390B2 (ja) 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
JP3245437B2 (ja) 1991-04-05 2002-01-15 株式会社クラレ 積層体の製造方法
US5227008A (en) 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
JPH0677648A (ja) 1992-08-20 1994-03-18 Polyplastics Co 立体的多層導電回路を有する複合成形品及びその製造方法
JPH07316825A (ja) * 1994-05-25 1995-12-05 Sankyo Kasei Co Ltd 部分メッキした芳香族系ポリエステル液晶ポリマー成形品の製造法
US5614114A (en) 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
JP2939477B2 (ja) 1994-08-16 1999-08-25 エイチエヌエイ・ホールディングス・インコーポレーテッド 液晶重合体−金属積層品および該積層品の製造法
JPH08288621A (ja) * 1995-04-19 1996-11-01 Sankyo Kasei Co Ltd 立体成形回路部品の形成方法と立体成形回路部品
US5670262A (en) * 1995-05-09 1997-09-23 The Dow Chemical Company Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
US5891528A (en) 1995-09-15 1999-04-06 M/Wave Printed circuit board process using plasma spraying of conductive metal
US5891795A (en) 1996-03-18 1999-04-06 Motorola, Inc. High density interconnect substrate
US6218022B1 (en) * 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3999834B2 (ja) 1996-12-12 2007-10-31 三共化成株式会社 成形回路部品などのめっき部品の製法
EP0905285B1 (en) * 1997-02-03 2000-12-27 Okuno Chemical Industries Co., Ltd. Method for electroplating nonconductive material
WO1999039021A1 (en) 1998-01-30 1999-08-05 E.I. Du Pont De Nemours And Company Process for metal plating liquid crystalline polymers and compositions related thereto
EP1069209B1 (en) 1999-07-16 2004-10-06 Enthone-OMI (Benelux) B.V. Process for plating plastics using a catalytic filler
US6114492A (en) * 2000-01-14 2000-09-05 Ticona Llc Process for producing liquid crystal polymer
US6403211B1 (en) * 2000-07-18 2002-06-11 3M Innovative Properties Company Liquid crystal polymer for flexible circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006282791A (ja) * 2005-03-31 2006-10-19 Toray Eng Co Ltd 液晶ポリマーのエッチング液及び液晶ポリマーのエッチング方法。
JP2010165877A (ja) * 2009-01-16 2010-07-29 Faintekku:Kk フレキシブルプリント基板の製造方法

Also Published As

Publication number Publication date
KR20040029148A (ko) 2004-04-03
CN1320847C (zh) 2007-06-06
US20020028293A1 (en) 2002-03-07
TW540259B (en) 2003-07-01
US6923919B2 (en) 2005-08-02
EP1428417A1 (en) 2004-06-16
WO2003022021A1 (en) 2003-03-13
CN1550124A (zh) 2004-11-24

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