GB979779A - Method of making printed circuits - Google Patents
Method of making printed circuitsInfo
- Publication number
- GB979779A GB979779A GB83661A GB83661A GB979779A GB 979779 A GB979779 A GB 979779A GB 83661 A GB83661 A GB 83661A GB 83661 A GB83661 A GB 83661A GB 979779 A GB979779 A GB 979779A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- particles
- resin
- printed
- copper oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Printed circuits are prepared by providing an insulating base with at least one surface having incorporated therein or thereon finely divided particles of cuprous oxide, curing the adhesive resinous bonding agent used in conjunction with said particles so that they adhere firmly to the base, exposing those particles which correspond with the desired circuit pattern to an acid to reduce at least some of the cuprous oxide to copper, and depositing metal, e.g. copper or nickel from a currentless metal deposition bath on to the copper particles. The circuit may be further built up by depositing more metal electrolytically on it. The insulating base may be of resinous material with incorporated copper oxide particles, or with a layer of resin containing copper oxide particles formed on one if its surfaces. Alternatively copper oxide particles can be applied to the uncured surface of a tacky resin which is then cured, or an adhesive ink containing copper oxide particles may be printed on to the resinous base and cured. When the surface is completely covered with copper oxide particles it is printed with a resist ink and the whole surface is then treated with sulphuric acid to reduce exposed copper oxide to copper. If the proportion of copper oxide particles in the surface is low, it may be necessary lightly to abrade the surface before the acid treatment. Other acids which may be used are acetic, phosphoric and hydrofluoric. In Example 1. A base is moulded from a mixture of epoxy resin, "Ciba 502" (Registered Trade Mark), copper oxide particles and diethylene triimine. One surface is covered with a resist, portions of which are then removed to expose copper oxide, and sulphuric acid is applied for 5-15 minutes. The base is rinsed and copper or nickel deposited in known manner. Copper may subsequently be electrolytically deposited (2). A coating of epoxy resin-cuprous oxide-hardener mixture is applied to a urea-formaldehyde resin support and cured thereon (3). An organosol composition of vinyl chloride-vinyl acetate copolymer, dioctyl phthalate and methyl ethyl ketone is placed in a mould and while still tacky is dusted with cuprous oxide particles and curing is completed. The surface is printed with a resist to leave the circuit pattern expose before treatment as in (1), (4). An ink containing phenol formaldehyde resin, polyvinyl butyral resin, ethanol, cuprous oxide, powdered silica and methyl ethyl ketone is printed on to a polymethyl methacrylate base and the circuit formed as in (1), (5). The ink used contains butadiene-acrylonitrile copolymer, phenolformaldehyde resin, zirconium silicate, silica, cuprous oxide, isophorone and xylene. It is printed on to an epoxy-glass laminate and cured (6). A composition containing epoxy resin, cuprous oxide, polyamide resin, zirconium silicate and silica was moulded and a circuit formed thereon as in example (1). Specification 938,365 is referred to.ALSO:Printed circuits are prepared by providing an insulating base with at least one surface having incorporated therein or thereon finely divided particles of cuprous oxide, curing the adhesive resinous bonding agent used in conjunction with said particles so that they adhere firmly to the base, exposing those particles which correspond with the desired circuit pattern to an acid, to reduce at least some of the cuprous oxide to copper, and depositing metal, e.g. copper or nickel, from a currentless metal deposition bath on to the copper particles. The circuit may be further built up by depositing more metal electrolytically on it. The insulating base may be of resinous material with incorporated copper oxide particles, or with a layer of resin containing copper oxide particles formed on one of its surfaces. Alternatively copper oxide particles can be applied to the uncured surface of a tacky resin which is then cured, or an adhesive ink containing copper oxide particles may be printed on to the resinous base and cured. When the surface is completely covered with copper oxide particles it is printed with a resist ink and the whole surface is then treated with sulphuric acid to reduce exposed copper oxide to copper. If the proportion of copper oxide particles in the surface is low, it may be necessary lightly to abrade the surface before the acid treatment. Other acids which may be used are acetic, phosphoric and hydrofluoric. In Example (1) a base is moulded from a mixture of epoxy resin ("Ciba 502", Registered Trade Mark), copper oxide particles and diethylene triamine. One surface is covered with a resist, portions of which are then removed to expose copper oxide, and sulphuric acid is applied for 5-15 minutes. The base is rinsed and copper or nickel deposited currentlessly in known manner. Copper may subsequently be electrolytically deposited. (2) A coating of epoxy resin-cuprous oxide-hardener mixture is applied to a ureaformaldehyde resin support and cured thereon. (3) An organosol composition of vinyl chloride-vinyl acetate copolymer, dioctylphthalate and methyl ethyl ketone is placed in a mould and while still tacky is dusted with cuprous oxide particles and curing is completed. The surface is printed with a resist to leave the circuit pattern exposed before treatment as in (1). (4) An ink containing phenol formaldehyde resin, polyvinyl butyral resin, ethanol, cuprous oxide, powdered silica and methyl ethyl ketone is printed on to a polymethyl methacrylate base and the circuit formed as in (1). (5) The ink used contains butadiene-acrylonitrile copolymer, phenol-formaldehyde resin, zirconium silicate, silica, cuprous oxide, isophorone and xylene. It is printed on to an epoxy-glass laminate and cured. (6) A composition containing epoxy resin, cuprous oxide, polyamide resin, zirconium silicate and silica was moulded and a circuit formed thereon as in Example (1). Specification 938,365 is referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB83661A GB979779A (en) | 1961-01-09 | 1961-01-09 | Method of making printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB83661A GB979779A (en) | 1961-01-09 | 1961-01-09 | Method of making printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB979779A true GB979779A (en) | 1965-01-06 |
Family
ID=9711322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB83661A Expired GB979779A (en) | 1961-01-09 | 1961-01-09 | Method of making printed circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB979779A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150948A (en) * | 1983-11-09 | 1985-07-10 | Brother Ind Ltd | Substrate processed for electroless plating for printed-wiring pattern |
EP1069209A1 (en) * | 1999-07-16 | 2001-01-17 | Enthone-OMI (Benelux) B.V. | Process for plating plastics using a catalytic filler |
US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
US6706326B1 (en) | 1999-07-16 | 2004-03-16 | Enthone Inc. | Process for plating plastics using a catalytic filler |
US6923919B2 (en) | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
-
1961
- 1961-01-09 GB GB83661A patent/GB979779A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150948A (en) * | 1983-11-09 | 1985-07-10 | Brother Ind Ltd | Substrate processed for electroless plating for printed-wiring pattern |
EP1069209A1 (en) * | 1999-07-16 | 2001-01-17 | Enthone-OMI (Benelux) B.V. | Process for plating plastics using a catalytic filler |
WO2001005518A1 (en) * | 1999-07-16 | 2001-01-25 | Enthone Inc. | Process for plating plastics using a catalytic filler |
US6706326B1 (en) | 1999-07-16 | 2004-03-16 | Enthone Inc. | Process for plating plastics using a catalytic filler |
US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
US6923919B2 (en) | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
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