JPS6246332B2 - - Google Patents
Info
- Publication number
- JPS6246332B2 JPS6246332B2 JP10442878A JP10442878A JPS6246332B2 JP S6246332 B2 JPS6246332 B2 JP S6246332B2 JP 10442878 A JP10442878 A JP 10442878A JP 10442878 A JP10442878 A JP 10442878A JP S6246332 B2 JPS6246332 B2 JP S6246332B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- copper
- powder
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 24
- 239000000725 suspension Substances 0.000 claims description 23
- 239000006082 mold release agent Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052582 BN Inorganic materials 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 5
- 239000004014 plasticizer Substances 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 229920001249 ethyl cellulose Polymers 0.000 claims description 4
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 17
- 229910001220 stainless steel Inorganic materials 0.000 description 12
- 239000010935 stainless steel Substances 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229920001220 nitrocellulos Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
本発明は、銅貼り絶縁基板の製造方法に係り、
特に含浸装置や高圧多段プレス等を全く必要とし
ないで簡単に、しかも接着力の優れた銅貼り絶縁
基板が得られる銅貼り絶縁基板の製造方法に関す
るものである。[Detailed Description of the Invention] The present invention relates to a method for manufacturing a copper-clad insulating substrate,
In particular, the present invention relates to a method for manufacturing a copper-clad insulating substrate, which can easily produce a copper-clad insulating substrate with excellent adhesive strength without requiring any impregnating equipment or high-pressure multi-stage press.
従来の銅貼り絶縁基板の製造方法は、まず、電
解により研磨されたロール面に電解析出せしめた
厚さ30〜50μ程度の銅箔の片面に接着剤を塗布
し、これをフエノール系樹脂またはエポキシ樹脂
等の積層板、またはこれらの樹脂を予め含浸せし
めた多層に堆積した含浸紙の上に載置し、全体を
熱プレスにより高圧において熱圧着または熱硬化
せしめて製造している。この方法は、含浸装置や
高圧多段プレス等の多くの大型設備を要するほ
か、工程が複雑で長く、均一な厚さの製品を得る
ことが非常に困難である。 The conventional manufacturing method for copper-clad insulating boards is to first apply an adhesive to one side of a 30-50μ thick copper foil that has been deposited electrolytically on a roll surface that has been electrolytically polished, and then coat it with a phenolic resin or It is manufactured by placing it on a laminated board of epoxy resin or the like or on impregnated paper impregnated with these resins in multiple layers, and then thermocompression bonding or thermosetting the whole at high pressure using a hot press. This method requires many large-scale equipment such as an impregnation device and a high-pressure multi-stage press, and the process is complicated and long, making it extremely difficult to obtain a product with a uniform thickness.
本発明は、以上の欠点を除去するためになされ
たもので、大型設備を要せず、比較的簡単で、し
かも接着力、耐熱性に優れた銅貼り絶縁基板の製
造方法を提供しようとするものである。 The present invention has been made to eliminate the above-mentioned drawbacks, and aims to provide a method for manufacturing a copper-clad insulating board that does not require large-scale equipment, is relatively simple, and has excellent adhesive strength and heat resistance. It is something.
本発明は、よく研磨した平滑金属基板上に所望
の深さを有する枠体を載置し、該枠体内に硬化型
注型レジンを注入し、該未硬化のレジン液表面に
銅箔を載置し該レジンを熱硬化せしめた後、前記
金属基板および枠体を剥離除去して片面銅貼り絶
縁基板を得る銅貼り絶縁基板の製造方法におい
て、(a)(イ)粒度30μ以下の窒化硼素および／または
二硫化モリブデン粉末0.5〜６重量％と、(ロ)バイ
ンダーとしてニトロセルロース、エチルセルロー
ス、セルロースアセテートブチレートの少くとも
１種の0.2〜３重量％と、(ハ)溶剤としてのメチル
エチルケトン、メチルイソブチルケトン、酢酸エ
チル、酢酸ブチルの少くとも１種の残分重量％と
からなる懸濁液離型剤を、前記金属基板面および
枠体内面にスプレー、浸漬またはローラー等によ
り予め薄く塗布し、20〜50℃の温度で乾燥被着せ
しめると共に、(b)前記硬化型注型レジンとして、
（い）エポキシ樹脂、ポリエステル樹脂等の熱硬
化性樹脂20〜40重量％と、（ろ）ポリアミド樹
脂、４・4′ジアミノジフエニルスルホン、ジシア
ンジアミド、弗化硼素−モノエチルアミン錯体等
の硬化剤25〜45重量％と、（は）ポリエチレング
リコール、ポリプロピレングリコール、ジブチル
フタレート等の可塑剤２〜10重量％と、（に）水
和アルミナ粉末、タルク粉末、石英粉末、ガラス
レイク、セリサイト等の粉末30〜45重量％とを混
合（い＋ろ＋は＋に）分散せしめた見掛け比重
1.2〜1.8、粘度200〜1500ポイズの懸濁液（い＋
ろ＋は＋に）を用いる銅貼り絶縁基板の製造方法
である。 In the present invention, a frame body having a desired depth is placed on a well-polished smooth metal substrate, a hardened casting resin is injected into the frame body, and a copper foil is placed on the surface of the uncured resin liquid. In the method for producing a copper-clad insulating substrate, in which the metal substrate and the frame are peeled off and the resin is heat-cured, a single-sided copper-clad insulating substrate is obtained. and/or 0.5 to 6% by weight of molybdenum disulfide powder, (b) 0.2 to 3% by weight of at least one of nitrocellulose, ethylcellulose, and cellulose acetate butyrate as a binder, and (c) methyl ethyl ketone and methyl as a solvent. A suspension mold release agent consisting of a residual weight percent of at least one of isobutyl ketone, ethyl acetate, and butyl acetate is applied thinly in advance to the metal substrate surface and the inner surface of the frame by spraying, dipping, or a roller, (b) as the hardening type casting resin;
(a) 20 to 40% by weight of a thermosetting resin such as an epoxy resin or a polyester resin, and (a) a curing agent such as a polyamide resin, 4,4'diaminodiphenylsulfone, dicyandiamide, or boron fluoride-monoethylamine complex25 ~45% by weight, (with) 2~10% by weight of plasticizers such as polyethylene glycol, polypropylene glycol, dibutyl phthalate, etc., and (with) powders such as hydrated alumina powder, talc powder, quartz powder, glass lake, sericite, etc. The apparent specific gravity of a mixture of 30 to 45% by weight (i+ro+ha+)
1.2-1.8, viscosity 200-1500 poise suspension (I+
This is a method of manufacturing a copper-clad insulating substrate using a copper-clad insulating substrate.
前記金属基板としては、アルミニウム、ステン
レス鋼、チタン鋼の各基板が用いられ、前記枠体
はフエノール板、硬質ゴム、アルミニウム板、鉄
板等から主として作られる。 As the metal substrate, aluminum, stainless steel, and titanium steel substrates are used, and the frame body is mainly made of phenol plate, hard rubber, aluminum plate, iron plate, etc.
本発明に係る窒化硼素粉末は、粒度が30μを越
えると粗大すぎて離型効果からもよくない。また
数量において、0.5重量％未満では離型効果が現
われず不可であり、６重量％を越えると、懸濁液
の安定性が得られず、塗布ムラも生じ不可であ
る。また、バインダー(ロ)が、0.2重量％未満では
バインダー効果が十分であり、３重量％を越える
と、塗布ムラが生じ不可である。次に前記硬化型
注型レジン(b)における、熱硬化性樹脂（い）が、
20重量％未満になると、流動性が十分でなく、ま
た銅箔面との接着が悪くなり、40重量％を越える
と耐熱性および強度がかえつて低下し、共に不可
である。しかして、硬化剤（ろ）が、25重量％未
満では硬化が不足し、耐熱性が悪くなり、また45
重量％を越えると硬化が早すぎて可使時間が著し
く短くなり、使用困難となり不可である。また可
塑剤（は）が、２重量％未満では、塑性が得られ
ず、10重量％を越えると、でき上る絶縁基板自体
に悪影響を与え共に不可である。次に水和アルミ
ナ等の粉末（に）が、30重量％未満になると、強
度が低下し、45重量％を越えると銅箔との接着や
基板強度自体に悪影響を与え共に不可である。 When the particle size of the boron nitride powder according to the present invention exceeds 30μ, it is too coarse and has poor mold release effects. In addition, if the amount is less than 0.5% by weight, no mold release effect will be obtained, and if it exceeds 6% by weight, the stability of the suspension will not be obtained and uneven coating will occur. Furthermore, when the binder (b) is less than 0.2% by weight, the binder effect is sufficient, and when it exceeds 3% by weight, uneven coating occurs and cannot be achieved. Next, the thermosetting resin (i) in the curable cast resin (b) is
If it is less than 20% by weight, the fluidity will not be sufficient and the adhesion to the copper foil surface will be poor, and if it exceeds 40% by weight, the heat resistance and strength will deteriorate, and both are unacceptable. However, if the curing agent (filter) is less than 25% by weight, curing will be insufficient, heat resistance will deteriorate, and 45% by weight will be insufficient.
If it exceeds % by weight, curing will be too rapid and the pot life will be significantly shortened, making it difficult to use and not acceptable. Furthermore, if the plasticizer is less than 2% by weight, no plasticity can be obtained, and if it exceeds 10% by weight, it will have an adverse effect on the resulting insulating substrate itself, making it unsuitable. Next, if the amount of powder such as hydrated alumina is less than 30% by weight, the strength will decrease, and if it exceeds 45% by weight, it will adversely affect the adhesion with the copper foil and the strength of the board itself, making both of them impossible.
さらに、この場合に、懸濁液（い＋ろ＋は＋
に）の見掛け比重が1.2未満では粉末の成分が不
足し耐熱性および強度が十分でなく、また1.8を
越えると銅箔の接着力が悪くなり共に不可であ
る。また、粘度も前記の下限未満では粉末の成分
が不足し不可となり、上限を越えると樹脂成分が
不足し不可である。 Furthermore, in this case, the suspension (I+RO+ is +
If the apparent specific gravity of (2) is less than 1.2, the powder components will be insufficient and the heat resistance and strength will not be sufficient, and if it exceeds 1.8, the adhesive strength of the copper foil will deteriorate and both are unacceptable. Further, if the viscosity is less than the lower limit, the powder component will be insufficient and the powder will be insufficient, and if it exceeds the upper limit, the resin component will be insufficient and the powder will be unacceptable.
次に本発明により得られた銅貼り絶縁基板の引
き剥し強度を測定（JIS−Ｃ−6481−1968）する
と、1.8〜3.0Kg／cmの強度が得られ、JIS規格の
1.6Kg／cm以上の引き剥し強度（JIS−Ｃ−6482〜
6485）が十分保証される。またハンダ耐熱性試験
にも十分耐える耐熱性を有する。また、従来方法
よりも簡略で、プレス、含浸装置等大がかりの設
備が不要であるのは勿論である。 Next, when the peel strength of the copper-clad insulating substrate obtained by the present invention was measured (JIS-C-6481-1968), a strength of 1.8 to 3.0 Kg/cm was obtained, which is in line with the JIS standard.
Peel strength of 1.6Kg/cm or more (JIS-C-6482~
6485) is fully guaranteed. It also has enough heat resistance to withstand solder heat resistance tests. Moreover, it is of course simpler than the conventional method and does not require large-scale equipment such as a press or an impregnation device.
以上本発明をさらに実施例について具体的に図
面にて説明する。 The present invention will be further described in detail with reference to the drawings.
実施例 １
予めよく研磨された平滑なステンレス板１の表
面および厚さ1.6mm鉄板の枠体２すなわち囲い枠
の内面にそれぞれ、下記組成の懸濁液離型剤３を
スプレーにて塗布し、40℃の温度にて乾燥し被着
させる。Example 1 A suspension mold release agent 3 having the following composition was applied by spraying to the surface of a smooth stainless steel plate 1 that had been well polished in advance and to the inner surface of the frame 2, that is, the enclosure frame, which was made of a 1.6 mm thick iron plate, respectively. Dry and apply at a temperature of 40°C.
懸濁液離型剤組成：
(イ) 平均粒度10μの窒化硼素３重量％、
(ロ) ニトロセルロース1.5重量％、
(ハ) 酢酸ブチル95.5重量％、
次に、表面および内面にそれぞれ上記離型剤３
を被着させたステンレス板１１の上に枠体１２を
載置し、この枠体１２の内側に下記組成を有する
硬化型注型レジン懸濁液（い＋ろ＋は＋に）４を
注入し、この液面に厚さ30μの銅箔５を静かに置
き170℃の温度に加熱硬化および接合させる。 Composition of suspension mold release agent: (a) 3% by weight of boron nitride with an average particle size of 10μ, (b) 1.5% by weight of nitrocellulose, (c) 95.5% by weight of butyl acetate, and then the above mold release applied to the surface and inside, respectively. Agent 3
A frame body 12 is placed on the stainless steel plate 11 coated with , and a hardening type casting resin suspension (I+RO+HA+NI) 4 having the following composition is injected into the inside of this frame body 12. Then, a copper foil 5 with a thickness of 30 μm is gently placed on the liquid surface and heated to a temperature of 170° C. to cure and bond.
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) ポリアミド樹脂 30重量％、
(は) ジブチルフタレート ２重量％、
(に) 水和アルミナ 38重量％、
見掛け比重1.4、粘度1100ポイズ。 Casting resin suspension composition: (i) 30% by weight of epoxy resin (product name: Epotote YH-434, manufactured by Toto Kasei Co., Ltd.), (b) 30% by weight of polyamide resin, (b) 2% by weight of dibutyl phthalate, (b) ) Hydrated alumina 38% by weight, apparent specific gravity 1.4, viscosity 1100 poise.
次にこの一体に成形されたステンレス板１、硬
化樹脂層６を冷却後、前記ステンレス板１および
枠体２を引き剥がし銅貼り絶縁基板７を得た。こ
のものについての引き剥し強度は2.6Kg／cmであ
り、ハンダ耐熱性は2.5Kg／cmであつた。また、
この時の基板の厚さは1.6mmであつた。 Next, after cooling the integrally molded stainless steel plate 1 and cured resin layer 6, the stainless steel plate 1 and frame 2 were peeled off to obtain a copper-clad insulating substrate 7. The peel strength of this product was 2.6 kg/cm, and the solder heat resistance was 2.5 kg/cm. Also,
The thickness of the substrate at this time was 1.6 mm.
実施例 ２
実施例１における懸濁液離型剤３の窒化硼素粉
末(イ)の代りに二硫化モリブデン粉末(イ)を用いたも
のを使用し、かつ次の如き組成の注型レジン懸濁
液（い＋ろ＋は＋に）４を使用し、その他は実施
例１と全く同様にして銅貼り絶縁基板７を得た。Example 2 Molybdenum disulfide powder (A) was used instead of boron nitride powder (A) in suspension mold release agent 3 in Example 1, and a cast resin suspension with the following composition was used. A copper-clad insulating substrate 7 was obtained in the same manner as in Example 1 except that the solution 4 was used.
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤ジシアンジアミド 30重量％、
(は) ポリエチレングリコール ３重量％、
(に) 水和アルミナ粉末 37重量％、
見掛け比重1.3、粘度1100ポイズ。 Casting resin suspension composition: (a) Epoxy resin (product name Epotote YH-434 manufactured by Toto Kasei Co., Ltd.) 30% by weight, (l) Curing agent dicyandiamide 30% by weight, (b) Polyethylene glycol 3% by weight, ( ) Hydrated alumina powder 37% by weight, apparent specific gravity 1.3, viscosity 1100 poise.
なお、でき上つた基板７の特性は次の如くであ
つた。 The characteristics of the completed substrate 7 were as follows.
引き剥し強度は2.6Kg／cm、 ハンダ耐熱性 2.4Kg／cm、 この時の基板の厚み 1.6mm。 Peel strength is 2.6Kg/cm, Solder heat resistance 2.4Kg/cm, The thickness of the board at this time was 1.6mm.
なお、前記二硫化モリブデン粉末(イ)の代りに、
その1/2量の窒化硼素粉末を置換して用いた場合
にもほぼ類似の結果が得られた。 In addition, instead of the molybdenum disulfide powder (a),
Almost similar results were obtained when half the amount of boron nitride powder was substituted.
実施例 ３
予めよく研磨された平滑なステンレス板１の表
面、および厚さ2.0mmのフエノール樹脂板から成
る枠体２、すなわち囲い枠の内面に、それぞれ下
記組成の懸濁液離型剤３をローラを用いて薄く塗
布し、30℃の温度にて約12分間乾燥し被着させ
る。Example 3 A suspension mold release agent 3 having the following composition was applied to the surface of a smooth stainless steel plate 1 that had been well polished in advance, and to the inner surface of a frame 2 made of a 2.0 mm thick phenolic resin plate, that is, a surrounding frame. Apply a thin layer using a roller and dry at 30℃ for about 12 minutes to adhere.
懸濁液離型剤組成：
(イ) 平均粒度１μの窒化硼素 ５重量％、
(ロ) セルロースアセテートブチレート １重量
％、
(ハ) メチルエチルケトン 94重量％、
次いで表面に前記離型剤３を被着させたステン
レス板１１の上に、同じくその内面に前記離型剤
３を被着させた枠体１２を載置し、この枠体１２
の内側に下記組成を有する硬化型注型レジン懸濁
液（い＋ろ＋は＋に）４を注入し、この液面に厚
さ30μの銅箔５を静かに置き180℃の温度にて加
熱硬化および接合させる。 Suspension release agent composition: (a) 5% by weight of boron nitride with an average particle size of 1 μm, (b) 1% by weight of cellulose acetate butyrate, (c) 94% by weight of methyl ethyl ketone, and then the surface was coated with the above mold release agent 3. On top of the coated stainless steel plate 11, the frame body 12 whose inner surface is coated with the mold release agent 3 is placed.
A curable casting resin suspension (I+RO+HA+) 4 having the following composition was injected into the inside of the mold, and a 30 μ thick copper foil 5 was gently placed on the liquid surface at a temperature of 180°C. Heat cure and bond.
注型レジン懸濁液組成：
(い) ポリエステル樹脂（昭和高分子株式会社製
商品名リゴラツク） 30重量％、
(ろ) ポリアミド樹脂 30重量％、
(は) ジブチルフタレート ２重量％、
(に) 水和アルミナ 38重量％、
見掛け比重1.4、粘度1200ポイズ。 Casting resin suspension composition: (i) Polyester resin (product name Rigoratsuku, manufactured by Showa Kobunshi Co., Ltd.) 30% by weight, (ii) Polyamide resin 30% by weight, (ii) Dibutyl phthalate 2% by weight, (ii) Water Japanese alumina 38% by weight, apparent specific gravity 1.4, viscosity 1200 poise.
次にこの一体に成形されたステンレス板１、硬
化樹脂層６および銅箔５を冷却後、これらから前
記ステンレス板１および枠体２を引き剥がし、銅
貼り絶縁基板７を得た。このものの引き剥し強度
は2.7Kg／cm、ハンダ耐熱性は2.6Kg／cmであつ
た。またこの時の絶縁基板の厚さは2.0mmであつ
た。 Next, after cooling the integrally molded stainless steel plate 1, cured resin layer 6, and copper foil 5, the stainless steel plate 1 and frame 2 were peeled off from them to obtain a copper-clad insulating substrate 7. This product had a peel strength of 2.7 kg/cm and a soldering heat resistance of 2.6 kg/cm. Further, the thickness of the insulating substrate at this time was 2.0 mm.
実施例 ４
予めよく研磨された平滑なアルミニウム板１、
厚さ1.6mmの鉄板の枠体２を用い、実施例１と全
く同様にして片面銅貼り絶縁基板を製造した。Example 4 Pre-polished smooth aluminum plate 1,
A single-sided copper-clad insulating substrate was manufactured in exactly the same manner as in Example 1 using a steel plate frame 2 with a thickness of 1.6 mm.
懸濁液離型剤組成：
(イ) 平均粒度５μの窒化硼素 ２重量％、
(ロ) エチルセルロース ２重量％、
(ハ) メチルイソブチルケトン 96重量％、
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤４・4′ジアミノジフエニルスルホン
30重量％、
(は) 可塑剤ポリエチレングリコール ５重量
％、
(に) 水和アルミナ粉末と石英粉末との混合物
（１：１） 35重量％、
見掛け比重1.4、粘度1100ポイズ。 Composition of suspension mold release agent: (a) 2% by weight of boron nitride with an average particle size of 5μ, (b) 2% by weight of ethyl cellulose, (c) 96% by weight of methyl isobutyl ketone, Composition of casting resin suspension: (i) Epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: Epotote YH-434) 30% by weight, (filter) hardening agent 4,4'diaminodiphenyl sulfone
30% by weight, (a) 5% by weight of plasticizer polyethylene glycol, (in) 35% by weight of a mixture of hydrated alumina powder and quartz powder (1:1), apparent specific gravity 1.4, viscosity 1100 poise.
得られた銅貼り絶縁基板の引き剥し強度は2.9
Kg／cmであり、ハンダ耐熱性は2.8Kg／cmであつ
た。またこの時の基板の厚さは1.6mmであつた。 The peel strength of the resulting copper-clad insulating board was 2.9.
Kg/cm, and the solder heat resistance was 2.8 Kg/cm. Further, the thickness of the substrate at this time was 1.6 mm.
実施例 ５
予めよく研磨された平滑なステンレス基板１、
厚さ25μの銅箔および厚さ1.0mmの鉄板の枠体２
を用い、実施例１と全く同様にして片面銅貼り絶
縁基板を製造した。Example 5 Smooth stainless steel substrate 1 well polished in advance
Frame 2 made of 25μ thick copper foil and 1.0mm thick iron plate
A single-sided copper-clad insulating substrate was manufactured in exactly the same manner as in Example 1.
懸濁液離型剤組成：
(イ) 平均粒度１μの二硫化モリブデン粉末 ４重
量％、
(ロ) エチルセルロース １重量％、
(ハ) 酢酸エチル 95重量％、
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤 弗化硼素−モノエチルアミン錯体
35重量％、
(は) 可塑剤 ポリプロピレングリコール ７重
量％、
(に) セリサイト粉末と水和アルミナ粉末との混
合物（１：１） 28重量％、
見掛け比重1.3、粘度1000ポイズ。 Composition of suspension mold release agent: (a) 4% by weight of molybdenum disulfide powder with an average particle size of 1μ, (b) 1% by weight of ethyl cellulose, (c) 95% by weight of ethyl acetate, Composition of casting resin suspension: (i) ) Epoxy resin (product name: Epotote YH-434, manufactured by Toto Kasei Co., Ltd.) 30% by weight, (ro) Curing agent: boron fluoride-monoethylamine complex
35% by weight, (a) plasticizer polypropylene glycol 7% by weight, (in) a mixture of sericite powder and hydrated alumina powder (1:1) 28% by weight, apparent specific gravity 1.3, viscosity 1000 poise.
得られた銅貼り絶縁基板の引き剥し強度は2.9
Kg／cmであり、ハンダ耐熱性は2.8Kg／cmであつ
た。またこの時の基板の厚さは1.0mmであつた。 The peel strength of the resulting copper-clad insulating board was 2.9.
Kg/cm, and the solder heat resistance was 2.8 Kg/cm. Further, the thickness of the substrate at this time was 1.0 mm.
図面は本発明の一実施例を模式的に示す工程略
図である。
１……よく研磨した表面平滑なステンレス板、
２……枠体、３……懸濁液離型剤（イ＋ロ＋
ハ）、４……硬化型注型レジン懸濁液（い＋ろ＋
は＋に）、５……銅箔、６……硬化樹脂層、７…
…本発明に係る銅貼り絶縁基板、１１……表面に
離型剤３を被着させたステンレス板、１２……内
面に離型剤３を被着させた枠体。
The drawings are process diagrams schematically showing one embodiment of the present invention. 1...A well-polished stainless steel plate with a smooth surface.
2...Frame body, 3...Suspension mold release agent (a+b+
C), 4...Curing type cast resin suspension (I+RO+
(+), 5... copper foil, 6... cured resin layer, 7...
. . . Copper-clad insulating substrate according to the present invention, 11 . . . Stainless steel plate with mold release agent 3 applied on the surface, 12 . . . Frame body with mold release agent 3 applied on the inner surface.
Claims (1)
有する枠体を載置し、該枠体内に硬化型注型レジ
ンを注入し、該未硬化のレジン液表面に銅箔を載
置し、該レジンを熱硬化せしめた後、前記金属基
板および枠体を剥離除去して片面銅貼り絶縁基板
を得る銅貼り絶縁基板の製造方法において、 (a) (イ)粒度30μ以下の窒化硼素および／または二
硫化モリブデン粉末0.5〜６重量％と、(ロ)バイ
ンダーとしてニトロセメロース、エチルセルロ
ース、セルロースアセテートブチレートの少く
とも１種の0.2〜３重量％と、(ハ)溶剤としての
メチルエチルケトン、メチルイソブチルケト
ン、酢酸エチル、酢酸ブチルの少なくとも１種
の残分重量％とからなる懸濁液離型剤を、前記
金属基板面および枠体内面にスプレー、浸漬ま
たはローラー等により予め薄く塗布し、20〜50
℃の温度で乾燥被着せしめると共に、 (b) 前記硬化型注型レジンとして、（い）エポキ
シ樹脂、ポリエステル樹脂等の熱硬化性樹脂20
〜40重量％と、（ろ）ポリアミド樹脂、４・
4′ジアミノジフエニルスルホン、ジシアンジア
ミド、弗化硼素−モノエチルアミン錯体等の硬
化剤25〜45重量％と、（は）ポリエチレングリ
コール、ポリプロピレングリコール、ジブチル
フタレート等の可塑剤２〜10重量％と、（に）
水和アルミナ粉末、タルク粉末、石英粉末、ガ
ラスフレイク、セリサイト等の粉末30〜45重量
％とを混合（い＋ろ＋は＋に）分散せしめた見
掛け比重1.2〜1.8、粘度200〜1500ポイズの懸
濁液（い＋ろ＋は＋に）を用いることを特徴と
する銅貼り絶縁基板の製造方法。[Claims] 1. A frame body having a desired depth is placed on a well-polished smooth metal substrate, a hardened casting resin is injected into the frame body, and copper is added to the surface of the uncured resin liquid. In a method for manufacturing a copper-clad insulating substrate, in which a foil is placed and the resin is thermally cured, the metal substrate and the frame are peeled and removed to obtain a single-sided copper-clad insulating substrate. 0.5 to 6% by weight of the following boron nitride and/or molybdenum disulfide powder, (b) 0.2 to 3% by weight of at least one of nitrocemellose, ethyl cellulose, and cellulose acetate butyrate as a binder, and (c) a solvent. A suspension mold release agent consisting of a residual weight percent of at least one of methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, and butyl acetate is applied to the metal substrate surface and the inner surface of the frame in advance by spraying, dipping, or rolling. Apply thinly, 20-50
(b) As the hardening type casting resin, (b) thermosetting resin such as epoxy resin or polyester resin.
~40% by weight, (ro) polyamide resin, 4.
25 to 45% by weight of a curing agent such as 4'diaminodiphenyl sulfone, dicyandiamide, boron fluoride-monoethylamine complex, (2) to 10% by weight of a plasticizer such as polyethylene glycol, polypropylene glycol, dibutyl phthalate, etc. )
Mixed with 30-45% by weight of powders such as hydrated alumina powder, talc powder, quartz powder, glass flakes, sericite, etc., dispersed (in a mixed manner) with an apparent specific gravity of 1.2-1.8 and a viscosity of 200-1500 poise. A method for manufacturing a copper-clad insulating substrate, characterized by using a suspension of (I+RO+HA+NI).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10442878A JPS5530951A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of copper-lined insulation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10442878A JPS5530951A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of copper-lined insulation substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5530951A JPS5530951A (en) | 1980-03-05 |
| JPS6246332B2 true JPS6246332B2 (en) | 1987-10-01 |
Family
ID=14380401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10442878A Granted JPS5530951A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of copper-lined insulation substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5530951A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05171398A (en) * | 1991-12-25 | 1993-07-09 | Chugoku Kako Kk | Production of composite product having sprayed metal layer and mold release agent used therefor |
| EP1023980B1 (en) * | 1999-01-28 | 2003-04-02 | Fujifilm Electronic Imaging Limited | Method of creating a load bearing surface |
| CN111761763B (en) * | 2020-05-25 | 2022-04-19 | 余姚市远东化工有限公司 | Tire release agent capable of being repeatedly released and preparation method thereof |
-
1978
- 1978-08-29 JP JP10442878A patent/JPS5530951A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5530951A (en) | 1980-03-05 |
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