JPS6226292B2 - - Google Patents
Info
- Publication number
- JPS6226292B2 JPS6226292B2 JP10442978A JP10442978A JPS6226292B2 JP S6226292 B2 JPS6226292 B2 JP S6226292B2 JP 10442978 A JP10442978 A JP 10442978A JP 10442978 A JP10442978 A JP 10442978A JP S6226292 B2 JPS6226292 B2 JP S6226292B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- copper foil
- powder
- surrounding frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000725 suspension Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000011889 copper foil Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 23
- 239000006082 mold release agent Substances 0.000 claims description 13
- 238000005266 casting Methods 0.000 claims description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 5
- 239000001856 Ethyl cellulose Substances 0.000 claims description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 229920001249 ethyl cellulose Polymers 0.000 claims description 4
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000020 Nitrocellulose Substances 0.000 claims description 3
- 229920006217 cellulose acetate butyrate Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001220 nitrocellulos Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は両面銅貼り絶縁基板の製造法に係り、
特に含浸装置や高圧多段プレス等を全く必要とし
ないで簡単に、しかも接着力の優れた両面銅貼り
絶縁基板が得られる両面銅貼り絶縁基板の製造法
に関するものである。[Detailed Description of the Invention] The present invention relates to a method for manufacturing a double-sided copper-clad insulating substrate,
In particular, the present invention relates to a method for manufacturing a double-sided copper-clad insulating substrate, which can easily produce a double-sided copper-clad insulating substrate with excellent adhesive strength without requiring any impregnating equipment or high-pressure multi-stage press.
従来の両面銅貼り絶縁基板の製造法は、先ず、
電解により研摩されたロール面に電解析出せしめ
た厚さ30〜50μ程度の２枚の銅箔の片面にそれぞ
れ接着剤を塗布し、これをフエノール系樹脂また
はエポキシ樹脂等の積層板、またはこれらの樹脂
を予め含浸せしめた多層に堆積した含浸紙布の上
下に挾んで接着剤層をそれぞれ内側にして載置
し、全体を熱プレスにより高圧において熱圧着ま
たは熱硬化接合せしめて製造している。この方法
は、含浸装置や高圧多段プレス等の多くの大型設
備を要するほか、工程が複雑で長く、均一な厚さ
の製品を得ることが非常に困難である。 The conventional manufacturing method for double-sided copper-clad insulating substrates is as follows:
Adhesive is applied to one side of each of two pieces of copper foil with a thickness of about 30 to 50μ deposited electrolytically on the roll surface polished by electrolysis, and this is applied to a laminate of phenolic resin, epoxy resin, etc. It is manufactured by sandwiching the upper and lower layers of impregnated paper cloth, which have been pre-impregnated with a resin, and placing the adhesive layer on the inside, and then thermocompression bonding or thermosetting bonding of the whole at high pressure using a heat press. . This method requires many large-scale equipment such as an impregnating device and a high-pressure multistage press, and the process is complicated and long, making it extremely difficult to obtain a product with uniform thickness.
本発明は以上の欠点を除去するためになされた
もので、大型設備を要せず、比較的簡単で、しか
も接着力、耐熱性に優れた銅貼り絶縁基板の製造
方法を提供しようとするものである。 The present invention has been made to eliminate the above-mentioned drawbacks, and aims to provide a method for manufacturing a copper-clad insulating substrate that does not require large-scale equipment, is relatively simple, and has excellent adhesive strength and heat resistance. It is.
本発明は、平滑な台上に載置された銅箔上に所
望の深さを有する囲い枠を載置し、該囲い枠内に
硬化型注型レジンを注入し、該未硬化レジン液の
表面に別の１枚の銅箔を載置し、該レジンを熱硬
化し銅箔と接着せしめた後、前記囲い枠を剥離除
去して上下の両面銅貼り絶縁基板を得る両面銅貼
り絶縁基板の製造法において、(a)(イ)粒度30μ以下
の窒化硼素および／または二硫化モリブデンの粉
末0.5〜６重量％と、(ロ)バインダーとしてニトロ
セルロース、エチルセルロース、セルロースアセ
テートブチレートの少くとも１種の0.2〜３重量
％と、(ハ)溶剤としてのメチルエチルケトン、メチ
ルイソブチルケトン、酢酸エチル、酢酸ブチルの
少くとも１種の残分重量％とからなる懸濁液離型
剤を、前記囲い枠内面にスプレー、浸漬またはロ
ーラー等により予め薄く塗布し、20〜50℃の温度
で乾燥、被着せしめると共に、(b)前記硬化型注型
レジンとして、（い）エポキシ樹脂、ポリエステ
ル樹脂等の熱硬化性樹脂20〜40重量％と、（ろ）
ポリアミド樹脂、４・4′ジアミノジフエニルスル
ホン、ジシアンジアミド、弗化硼素−モノエチル
アミン錯体等の硬化剤25〜45重量％と、（は）ポ
リエチレングリコール、ポリプロピレングリコー
ル、ジブチルフタレート等の可塑剤２〜10重量％
と、（に）水和アルミナ粉末、タルク粉末、石英
粉末、ガラスフレイク、セリサイト等の粉末30〜
45重量％とを混合（い＋ろ＋は＋に）分散せしめ
た見掛け比重1.2〜1.8、粘度200〜1500ポイズの
懸濁液（い＋ろ＋は＋に）を用いる両面銅貼り絶
縁基板の製造法である。 In the present invention, a surrounding frame having a desired depth is placed on a copper foil placed on a smooth table, a curable casting resin is injected into the surrounding frame, and the uncured resin liquid is injected into the surrounding frame. Another sheet of copper foil is placed on the surface, and the resin is heat-cured and bonded to the copper foil, and then the surrounding frame is peeled off and removed to obtain an upper and lower double-sided copper-clad insulating substrate. In the manufacturing method, (a) (b) 0.5 to 6% by weight of boron nitride and/or molybdenum disulfide powder with a particle size of 30 μ or less, and (b) at least one of nitrocellulose, ethylcellulose, and cellulose acetate butyrate as a binder. A suspension mold release agent consisting of 0.2 to 3% by weight of seeds and (c) a residual weight% of at least one of methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, and butyl acetate as a solvent is added to the surrounding frame. Preliminarily apply a thin layer to the inner surface by spraying, dipping, or using a roller, dry at a temperature of 20 to 50°C, and (b) as the above-mentioned hardening type casting resin, (b) heat epoxy resin, polyester resin, etc. Curing resin 20-40% by weight and (ro)
25 to 45% by weight of a curing agent such as polyamide resin, 4,4' diaminodiphenyl sulfone, dicyandiamide, boron fluoride-monoethylamine complex, and 2 to 10% by weight of a plasticizer such as polyethylene glycol, polypropylene glycol, dibutyl phthalate, etc. weight%
and (to) powders such as hydrated alumina powder, talc powder, quartz powder, glass flakes, sericite, etc.
45% by weight of a suspension with an apparent specific gravity of 1.2 to 1.8 and a viscosity of 200 to 1500 poise (I+RO+HA+). It is a manufacturing method.
前記の平滑な台としては、普通アルミニウム、
ステンレス鋼、チタン鋼の各平滑な基板が用いら
れ、前記枠体は、フエノール板、硬質ゴム、アル
ミニウム板、鉄板等から主として作られる。 The smooth table mentioned above is usually made of aluminum,
Smooth substrates of stainless steel and titanium steel are used, and the frame is mainly made of phenol plates, hard rubber, aluminum plates, iron plates, etc.
本発明に係る窒化硼素粉末は、粒度が30μを越
えると粗大すぎて離型効果からもよくない。また
数量において、0.5重量％未満では離型効果が現
われず不可であり、６重量％を越えると、懸濁液
の安定性が得られず、塗布ムラも生じ不可であ
る。また、バインダー(ロ)が、0.2重量％未満では
バインダー効果が不十分であり、３重量％を越え
ると、塗布ムラが生じ不可である。次に前記硬化
型注型レジン(b)における、熱硬化性樹脂（い）
が、20重量％未満になると、流動性が十分でな
く、また銅箔面との接着が悪くなり、40重量％を
越えると耐熱性および強度がかえつて低下し、共
に不可である。しかして、硬化剤（ろ）が、25重
量％未満では、硬化が不足し、耐熱性が悪くな
り、また45重量％を越えると硬化が早すぎて可使
時間が著しく短くなり、使用困難となり不可であ
る。また、可塑剤（は）が、２重量％未満では、
塑性が得られず、10重量％を越えると、でき上る
絶縁基板自体に悪影響を与え、共に不可である。
次に水和アルミナ等の粉末（に）が、30重量％未
満になると、強度が低下し、45重量％を越えると
銅箔との接着や、基板強度自体に悪影響を与え共
に不可である。 When the particle size of the boron nitride powder according to the present invention exceeds 30μ, it is too coarse and has poor mold release effects. In addition, if the amount is less than 0.5% by weight, no mold release effect will be obtained, and if it exceeds 6% by weight, the stability of the suspension will not be obtained and uneven coating will occur. Furthermore, if the binder (b) is less than 0.2% by weight, the binder effect is insufficient, and if it exceeds 3% by weight, uneven coating may occur. Next, in the curable cast resin (b), the thermosetting resin (a)
However, if it is less than 20% by weight, the fluidity will not be sufficient and the adhesion to the copper foil surface will be poor, and if it exceeds 40% by weight, the heat resistance and strength will deteriorate, and both are unacceptable. However, if the hardening agent (filter) is less than 25% by weight, curing will be insufficient and heat resistance will deteriorate, and if it exceeds 45% by weight, curing will be too rapid and the pot life will be significantly shortened, making it difficult to use. Not possible. In addition, if the plasticizer (ha) is less than 2% by weight,
Plasticity cannot be obtained, and if it exceeds 10% by weight, it will have an adverse effect on the resulting insulating substrate itself, and both are unacceptable.
Next, if the amount of powder such as hydrated alumina is less than 30% by weight, the strength will decrease, and if it exceeds 45% by weight, it will adversely affect the adhesion with the copper foil and the strength of the board itself, making both of them impossible.
さらに、この場合に、懸濁液（い＋ろ＋は＋
に）の見掛け比重が、1.2未満では粉末の成分が
不足し耐熱性および強度が十分でなく、また1.8
を越えると銅箔の接着力が悪くなり共に不可であ
る。また、粘度も前記の下限未満では粉末の成分
が不足し不可となり、上限を越えると樹脂成分が
不足し不可である。 Furthermore, in this case, the suspension (I+RO+ is +
If the apparent specific gravity of
If it exceeds this, the adhesion of the copper foil will deteriorate and both are unacceptable. Further, if the viscosity is less than the lower limit, the powder component will be insufficient and the powder will be insufficient, and if it exceeds the upper limit, the resin component will be insufficient and the powder will be unacceptable.
次に本発明により得られた両面銅貼り絶縁基板
の引き剥し強度を測定（JIS−Ｃ−4681−1968）
すると、1.8〜3.0Kg／cmの強度が得られ、JIS規
格の1.6Kg／cm以上の引き剥し強度（JIS−Ｃ−
6482〜6485）が十分保証される。またハンダ耐熱
性試験にも十分耐える耐熱性を有する。また、従
来方法よりも簡略で、プレス、含浸装置等大がか
りの設備が不要であるのは勿論である。 Next, the peel strength of the double-sided copper-clad insulating substrate obtained according to the present invention was measured (JIS-C-4681-1968).
As a result, a strength of 1.8 to 3.0 kg/cm was obtained, which exceeded the peel strength of 1.6 kg/cm or more according to the JIS standard (JIS-C-
6482-6485) are fully guaranteed. It also has enough heat resistance to withstand solder heat resistance tests. Moreover, it is of course simpler than the conventional method and does not require large-scale equipment such as a press or an impregnation device.
以下本発明をさらに実施例について具体的に図
面にて説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further specifically described below with reference to embodiments.
実施例 １
表面平滑なステンレス板１の表面上に厚さ30μ
の銅箔２を載置し、該銅箔２上に厚さ1.6mm鉄板
の枠体３すなわち囲い枠を載置する。該囲い枠３
の内面のみに下記組成の懸濁液離型剤４をスプレ
ーにて塗布し、40℃の温度にて乾燥し被着させ
る。Example 1 Thickness 30μ on the surface of smooth stainless steel plate 1
A copper foil 2 is placed on top of the copper foil 2, and a frame 3 made of an iron plate having a thickness of 1.6 mm, that is, a surrounding frame is placed on the copper foil 2. The surrounding frame 3
A suspension mold release agent 4 having the following composition is applied only to the inner surface of the mold by spraying, and dried at a temperature of 40°C to adhere.
懸濁液離型剤組成：
(イ) 平均粒度10μの窒化硼素 ３重量％、
(ロ) ニトロセルロース 1.5重量％、
(ハ) 酢酸ブチル 95.5重量％、
次に、内面に上記離型剤４を被着させた前記囲
い枠１３の内側の前記銅箔２上に、下記組成を有
する硬化型注型レジン懸濁液（い＋ろ＋は＋に）
５を注入し、この液面に厚さ30μの別の銅箔６を
静かに置き170℃の温度に加熱硬化および接合さ
せる。Suspension mold release agent composition: (a) 3% by weight of boron nitride with an average particle size of 10μ, (b) 1.5% by weight of nitrocellulose, (c) 95.5% by weight of butyl acetate. Next, the above mold release agent 4 was applied to the inner surface. A curable casting resin suspension having the following composition is applied onto the copper foil 2 inside the enclosing frame 13.
Another copper foil 6 with a thickness of 30 μm is gently placed on the liquid surface and heated to a temperature of 170° C. to cure and bond.
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) ポリアミド樹脂 30重量％、
(は) ジブチルフタレート ２重量％、
(に) 水和アルミナ 38重量％、
見掛け比重1.4、粘度1100ポイズ。Casting resin suspension composition: (i) 30% by weight of epoxy resin (product name: Epotote YH-434, manufactured by Toto Kasei Co., Ltd.), (b) 30% by weight of polyamide resin, (b) 2% by weight of dibutyl phthalate, (b) ) Hydrated alumina 38% by weight, apparent specific gravity 1.4, viscosity 1100 poise.
次にこの一体に成形された上下２枚の銅箔２，
６および硬化樹脂層７を冷却後、前記囲い枠３を
引き剥がし両面銅貼り絶縁基板８を得た。このも
のについての引き剥し強度は2.6Kg／cmであり、
ハンダ耐熱性は2.5Kg／cmであつた。また、この
時の基板の厚さは1.6mmであつた。 Next, these two pieces of copper foil 2, upper and lower, are molded into one piece,
After cooling 6 and the cured resin layer 7, the surrounding frame 3 was peeled off to obtain a double-sided copper-clad insulating substrate 8. The peel strength of this item is 2.6Kg/cm,
Solder heat resistance was 2.5 kg/cm. Further, the thickness of the substrate at this time was 1.6 mm.
実施例 ２
実施例１における懸濁液離型剤４の窒化硼素粉
末(イ)の代りに二硫化モリブデン粉末(イ)を用いたも
のを使用し、かつ次の如き組成の注型レジン懸濁
液（い＋ろ＋は＋に）５を使用し、その他は実施
例１と全く同様にして銅貼り絶縁基板８を得た。Example 2 Molybdenum disulfide powder (A) was used instead of boron nitride powder (A) in suspension mold release agent 4 in Example 1, and a cast resin suspension with the following composition was used. A copper-clad insulating substrate 8 was obtained in exactly the same manner as in Example 1 except that the solution 5 was used.
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤ジシアンジアミド 30重量％、
(は) ポリエチレングリコール ３重量％、
(に) 水和アルミナ粉末 37重量％、
見掛け比重1.3、粘度1000ポイズ。Casting resin suspension composition: (a) Epoxy resin (product name Epotote YH-434 manufactured by Toto Kasei Co., Ltd.) 30% by weight, (l) Curing agent dicyandiamide 30% by weight, (b) Polyethylene glycol 3% by weight, ( ) Hydrated alumina powder 37% by weight, apparent specific gravity 1.3, viscosity 1000 poise.
なお、でき上つた基板７の特性は次の如くであ
つた。 The characteristics of the completed substrate 7 were as follows.
引き剥し強度は 2.6Kg／cm、 ハンダ耐熱性 2.4Kg／cm、 この時の基板の厚み 1.6mm。Peel strength is 2.6Kg/cm, Solder heat resistance 2.4Kg/cm, The thickness of the board at this time is 1.6mm.
なお、前記二硫化モリブデン粉末(イ)の代りに、
その1/2量の窒化硼素粉末を置換して用いた場合
にも略々類似の結果が得られた。 In addition, instead of the molybdenum disulfide powder (a),
Almost similar results were obtained when half the amount of boron nitride powder was substituted.
実施例 ３
平滑なステンレス台板１の表面上に厚さ30μの
銅箔２を載置し、その上に厚さ2.0mmのフエノー
ル樹脂板からなる囲い枠３をさらに載置する。こ
の囲い枠３の内面のみに、下記組成の懸濁液離型
剤４をローラを用いて薄く塗布し、30℃の温度に
て約12分間乾燥し被着させる。Example 3 A copper foil 2 with a thickness of 30 μm is placed on the surface of a smooth stainless steel base plate 1, and an enclosing frame 3 made of a phenol resin plate with a thickness of 2.0 mm is further placed thereon. A suspension mold release agent 4 having the composition shown below is thinly applied only to the inner surface of the enclosure frame 3 using a roller, and dried at a temperature of 30° C. for about 12 minutes to adhere.
懸濁液離型剤組成：
(イ) 平均粒度１μの窒化硼素 ５重量％、
(ロ) セルロースアセテートブチレート １重量％、
(ハ) メチルエチルケトン 94重量％、
次いでその内面に前記離型剤４を被着させた囲
い枠１３の内側に下記組成を有する硬化型注型レ
ジン懸濁液（い＋ろ＋は＋に）５を注入し、この
液面に厚さ30μの別の銅箔６を静かに置き180℃
の温度にて30分間加熱硬化および接合させる。Suspension mold release agent composition: (a) 5% by weight of boron nitride with an average particle size of 1 μm, (b) 1% by weight of cellulose acetate butyrate, (c) 94% by weight of methyl ethyl ketone, and then the mold release agent 4 was applied to the inner surface of the suspension. A curable casting resin suspension 5 having the following composition is injected into the inside of the enclosing frame 13 that has been covered, and another copper foil 6 with a thickness of 30 μm is placed on the liquid surface. Place it gently at 180℃
Heat cure and bond at a temperature of 30 minutes.
注型レジン懸濁液組成：
(い) ポリエステル樹脂（昭和高分子株式会社製
商品名リゴラツク） 30重量％、
(ろ) ポリアミド樹脂 30重量％、
(は) ジブチルフタレート ２重量％、
(に) 水和アルミナ 38重量％、
見掛け比重1.4、粘度1200ポイズ。Casting resin suspension composition: (i) Polyester resin (product name Rigoratsuku, manufactured by Showa Kobunshi Co., Ltd.) 30% by weight, (ii) Polyamide resin 30% by weight, (ii) Dibutyl phthalate 2% by weight, (ii) Water Japanese alumina 38% by weight, apparent specific gravity 1.4, viscosity 1200 poise.
次にこの一体に成形接合された硬化樹脂層７お
よび上下２枚の銅箔２，６を冷却後、これらから
前記の囲い枠１３を引き剥がし、両面銅貼り絶縁
基板８を得た。このものの引き剥し強度は2.7
Kg／cm、ハンダ耐熱性は2.6Kg／cmであつた。ま
たこの時の絶縁基板の厚さは2.0mmであつた。 Next, after cooling the cured resin layer 7 and the upper and lower copper foils 2 and 6 integrally molded and bonded, the above-mentioned surrounding frame 13 was peeled off from them to obtain a double-sided copper-clad insulating substrate 8. The peel strength of this thing is 2.7
Kg/cm, and the solder heat resistance was 2.6 Kg/cm. Further, the thickness of the insulating substrate at this time was 2.0 mm.
実施例 ４
平滑なアルミニウム台板１、厚さ1.6mmの鉄板
の囲い枠３および２枚の銅箔２，６を用い、実施
例１と全く同様にして両面銅貼り絶縁基板を製造
した。Example 4 A double-sided copper-clad insulating substrate was manufactured in exactly the same manner as in Example 1 using a smooth aluminum base plate 1, a 1.6 mm thick iron plate surrounding frame 3, and two copper foils 2 and 6.
懸濁液離型剤組成：
(イ) 平均粒度５μの窒化硼素 ２重量％、
(ロ) エチルセルロース ２重量％、
(ハ) メチルイソブチルケトン 96重量％、
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤４・4′ジアミノジフエニルスルホン
30重量％、
(は) 可塑性ポリエチレングリコール５重量％、
(に) 水和アルミナ粉末と石英粉末との混合物
（１：１） 35重量％、
見掛け比重1.4、粘度1100ポイズ。Composition of suspension mold release agent: (a) 2% by weight of boron nitride with an average particle size of 5μ, (b) 2% by weight of ethyl cellulose, (c) 96% by weight of methyl isobutyl ketone, Composition of casting resin suspension: (i) Epoxy resin (manufactured by Toto Kasei Co., Ltd., trade name: Epotote YH-434) 30% by weight, (filter) hardening agent 4,4'diaminodiphenyl sulfone
30% by weight, (a) 5% by weight of plastic polyethylene glycol, (in) 35% by weight of a mixture of hydrated alumina powder and quartz powder (1:1), apparent specific gravity 1.4, viscosity 1100 poise.
得られた両面銅貼り絶縁基板の引き剥し強度は
2.9Kg／cmであり、ハンダ耐熱性は2.8Kg／cmであ
つた。またこの時の基板の厚さは1.6mmであつ
た。 The peel strength of the obtained double-sided copper-clad insulated substrate is
The solder heat resistance was 2.9Kg/cm, and the solder heat resistance was 2.8Kg/cm. Further, the thickness of the substrate at this time was 1.6 mm.
実施例 ５
平滑なステンレス台板１、厚さ25μの２枚の銅
箔および厚さ1.0mmの鉄板の囲い枠３を用い、実
施例１と全く同様にして両面銅貼り絶縁基板を製
造した。Example 5 A double-sided copper-clad insulating substrate was manufactured in exactly the same manner as in Example 1 using a smooth stainless steel base plate 1, two sheets of copper foil with a thickness of 25 μm, and an enclosure frame 3 made of an iron plate with a thickness of 1.0 mm.
懸濁液離型剤組成：
(イ) 平均粒度１μの二硫化モリブデン粉末
４重量％、
(ロ) エチルセルロース １重量％、
(ハ) 酢酸エチル 95重量％、
注型レジン懸濁液組成：
(い) エポキシ樹脂（東都化成株式会社製商品名
エポトートYH−434） 30重量％、
(ろ) 硬化剤 弗化硼素−モノエチルアミン錯体
35重量％、
(は) 可塑剤 ポリプロピレングリコール
７重量％、
(に) セリサイト粉末と水和アルミナ粉末との混
合物（１：１） 28重量％、
見掛け比重1.3、粘度1000ポイズ。Composition of suspension mold release agent: (a) Molybdenum disulfide powder with an average particle size of 1μ
4% by weight, (b) Ethyl cellulose 1% by weight, (c) Ethyl acetate 95% by weight, Casting resin suspension composition: (i) Epoxy resin (trade name: Epotote YH-434, manufactured by Toto Kasei Co., Ltd.) 30% by weight , (ro) Curing agent Boron fluoride-monoethylamine complex
35% by weight, (is) plasticizer polypropylene glycol
7% by weight, (in) mixture of sericite powder and hydrated alumina powder (1:1) 28% by weight, apparent specific gravity 1.3, viscosity 1000 poise.
得られた両面銅貼り絶縁基板の引き剥し強度は
2.9Kg／cmであり、ハンダ耐熱性は2.8Kg／cmであ
つた。またこの時の基板の厚さは1.0mmであつ
た。 The peel strength of the obtained double-sided copper-clad insulated substrate is
The solder heat resistance was 2.9Kg/cm, and the solder heat resistance was 2.8Kg/cm. Further, the thickness of the substrate at this time was 1.0 mm.
図面は本発明の一実施例を模式的に示す工程略
図である。
１……表面平滑な台板、２……銅箔、３……囲
い枠、４……懸濁液離型剤（イ＋ロ＋ハ）、５…
…硬化型注型レジン懸濁液（い＋ろ＋は＋に）、
６……別の銅箔、７……硬化樹脂層、８……本発
明に係る両面銅貼り絶縁基板、１３……内面に離
型剤３を被着させた枠体。
The drawings are process diagrams schematically showing one embodiment of the present invention. 1... Base plate with smooth surface, 2... Copper foil, 3... Surrounding frame, 4... Suspension mold release agent (a+b+c), 5...
...Curing cast resin suspension (I+RO+HA+NI),
6... Another copper foil, 7... Cured resin layer, 8... Double-sided copper-clad insulating substrate according to the present invention, 13... Frame body with mold release agent 3 coated on the inner surface.
Claims (1)
を有する囲い枠を載置し、該囲い枠内に硬化型注
型レジンを注入し、該未硬化レジン液の表面に別
の１枚の銅箔を載置し、該レジンを熱硬化し銅箔
と接着せしめた後、前記囲い枠を剥離除去して両
面銅貼り絶縁基板を得る両面銅貼り絶縁基板の製
造法において、 (a) (イ)粒度30μ以下の窒化硼素および／または二
硫化モリブデンの粉末0.5〜６重量％と、(ロ)バ
インダーとしてニトロセルロース、エチルセル
ロース、セルロースアセテートブチレートの少
くとも１種の0.2〜３重量％と、(ハ)溶剤として
のメチルエチルケトン、メチルイソブチルケト
ン、酢酸エチル、酢酸ブチルの少くとも１種の
残分重量％とからなる懸濁液離型剤を、前記囲
い枠内面にスプレー、浸漬またはローラー等に
より予め薄く塗布し、20〜50℃の温度で乾燥被
着せしめると共に、 (b) 前記硬化型注型レジンとして、（い）エポキ
シ樹脂、ポリエステル樹脂等の熱硬化性樹脂20
〜40重量％と、（ろ）ポリアミド樹脂、４・
4′ジアミノジフエニルスルホン、ジシアンジア
ミド、弗化硼素−モノエチルアミン錯体等の硬
化剤25〜45重量％と、（は）ポリエチレングリ
コール、ポリプロピレングリコール、ジブチル
フタレート等の可塑剤２〜10重量％と、（に）
水和アルミナ粉末、タルク粉末、石英粉末、ガ
ラスフレイク、セリサイト等の粉末30〜45重量
％とを混合（い＋ろ＋は＋に）分散せしめた見
掛け比重1.2〜1.8、粘度200〜1500ポイズの懸
濁液（い＋ろ＋は＋に）を用いることを特徴と
する両面銅貼り絶縁基板の製造法。[Claims] 1. Place a surrounding frame having a desired depth on a copper foil placed on a smooth table, inject a curable casting resin into the surrounding frame, and pour the uncured resin into the surrounding frame. Another piece of copper foil is placed on the surface of the resin solution, and after the resin is heat-cured and bonded to the copper foil, the surrounding frame is peeled off and removed to obtain a double-sided copper-clad insulation board. In the manufacturing method of the substrate, (a) (a) 0.5 to 6% by weight of boron nitride and/or molybdenum disulfide powder with a particle size of 30μ or less, and (b) at least nitrocellulose, ethylcellulose, or cellulose acetate butyrate as a binder. A suspension mold release agent consisting of 0.2 to 3% by weight of one type and (c) a residual weight% of at least one of methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, and butyl acetate as a solvent is added to the enclosure. (b) As the above-mentioned hardening type casting resin, (b) heat-coating epoxy resin, polyester resin, etc. Curing resin 20
~40% by weight, (ro) polyamide resin, 4.
25 to 45% by weight of a curing agent such as 4'diaminodiphenyl sulfone, dicyandiamide, boron fluoride-monoethylamine complex, (2) to 10% by weight of a plasticizer such as polyethylene glycol, polypropylene glycol, dibutyl phthalate, etc. )
Mixed with 30-45% by weight of powders such as hydrated alumina powder, talc powder, quartz powder, glass flakes, sericite, etc., dispersed (apparent specific gravity 1.2-1.8, viscosity 200-1500 poise) A method for manufacturing a double-sided copper-clad insulating substrate, characterized by using a suspension of (I+RO+HA+NI).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10442978A JPS5530952A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of insulation substrate having the copper- lined |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10442978A JPS5530952A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of insulation substrate having the copper- lined |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5530952A JPS5530952A (en) | 1980-03-05 |
| JPS6226292B2 true JPS6226292B2 (en) | 1987-06-08 |
Family
ID=14380426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10442978A Granted JPS5530952A (en) | 1978-08-29 | 1978-08-29 | Manufacturing of insulation substrate having the copper- lined |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5530952A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4985747A (en) * | 1988-06-09 | 1991-01-15 | Oki Electric Industry Co., Ltd. | Terminal structure and process of fabricating the same |
| US9156740B2 (en) * | 2011-05-03 | 2015-10-13 | Innovalight, Inc. | Ceramic boron-containing doping paste and methods therefor |
-
1978
- 1978-08-29 JP JP10442978A patent/JPS5530952A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5530952A (en) | 1980-03-05 |
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