JPH03149890A - Ceramic circuit board - Google Patents
Ceramic circuit boardInfo
- Publication number
- JPH03149890A JPH03149890A JP28975289A JP28975289A JPH03149890A JP H03149890 A JPH03149890 A JP H03149890A JP 28975289 A JP28975289 A JP 28975289A JP 28975289 A JP28975289 A JP 28975289A JP H03149890 A JPH03149890 A JP H03149890A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- resin
- board
- metal foil
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000011888 foil Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000002131 composite material Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 alicyclic acid anhydride Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、熱伝導性に優れ、熱膨張率の小さいセラミッ
ク回路用基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a ceramic circuit board having excellent thermal conductivity and a low coefficient of thermal expansion.
従来、電気回路用の基板、例えばガラスエポキシ基板Ｃ
ＪＩＳ Ｃ−６８４０およびＪＩＳ Ｃ−６４８４に規
定）はガラスクロスにエポキシ樹脂を含浸して予備乾燥
して得たプリプレグを銅箔とともに一体成形した銅張り
積層板で最も多く製造され使用されている基板である。Conventionally, electric circuit boards, such as glass epoxy boards C
JIS C-6840 and JIS C-6484) is a copper-clad laminate made by integrally molding prepreg obtained by impregnating glass cloth with epoxy resin and pre-drying it together with copper foil, and is the most commonly manufactured and used board. It is.
高性能で小型の電子機器が普及し、電子部品の高集積化
、高密度実装化がますます進展する中で、基板の熱伝導
性に優れ、基板の平面方向および断面方向の熱膨張率の
小さい寸法安定性に優れた基板が要求されている。With the spread of high-performance, compact electronic devices, and the increasing integration and high-density packaging of electronic components, the board has excellent thermal conductivity, and the coefficient of thermal expansion in the planar and cross-sectional directions of the board is low. There is a demand for substrates that are small and have excellent dimensional stability.
ＪＩＳ Ｃ−６８４０およびＣ−６４８４に規定されて
いる印刷回路用銅張積層板では基板の熱伝導率が小さく
放熱性が悪く、そのため基板の温度上昇も大きくなる。In copper-clad laminates for printed circuits specified in JIS C-6840 and C-6484, the thermal conductivity of the substrate is low and heat dissipation is poor, and therefore the temperature of the substrate increases.
また基板の熱膨張係数もＸＹ（平面）方向でｔｓｘ ｔ
ｏ−／”ｃ、２（断面）方向テ５０〜６０Ｘ １０−＠
／℃と搭載部品の熱膨張係数の差による温度上昇時の応
力や基板の断面歪みによる信頼性の低下が問題となる。Also, the thermal expansion coefficient of the substrate is tsx t in the XY (plane) direction.
o-/”c, 2 (cross section) direction Te 50~60X 10-@
Problems include stress due to temperature rise due to the difference between /℃ and the coefficient of thermal expansion of the mounted components, and a decrease in reliability due to cross-sectional distortion of the board.
従って、上記の基板を高密度実装する基板に使用する場
合、使用範囲がかなり限定されるという問題点があり、
このような実情から、熱伝導性に優れ、熱膨張の少ない
高密度実装用の基板の開発が大きな課題であった。Therefore, when using the above board for high-density mounting, there is a problem that the scope of use is quite limited.
Under these circumstances, the development of a substrate for high-density mounting that has excellent thermal conductivity and low thermal expansion has been a major challenge.
本発明の目的は上記の課題を解決する回路用基板を提供
することにある。An object of the present invention is to provide a circuit board that solves the above problems.
すなわち、本発明はセラミック粉末を成形して得られた
多孔体に樹脂を含浸、固化させてなる複合体よりなる板
の片面または両面に金属箔を張り合わせた回路用基板を
提供するものである。That is, the present invention provides a circuit board in which metal foil is laminated on one or both sides of a composite plate made by impregnating and solidifying a porous body obtained by molding ceramic powder with resin.
以下、本発明を詳細に説明する。The present invention will be explained in detail below.
本発明に使用のセラミック粉末としては熱伝導性に優れ
、熱膨張の小さいものがよく、例えばアルミナ、窒化ア
ルミニウム、炭化ケイ素等が挙げられる。これら粉末の
粒径は、特に限定されないが、通常平均粒径で１−１０
０μｍの範囲である。The ceramic powder used in the present invention preferably has excellent thermal conductivity and low thermal expansion, such as alumina, aluminum nitride, silicon carbide, and the like. The particle size of these powders is not particularly limited, but the average particle size is usually 1-10
It is in the range of 0 μm.
セラミック成形体はセラミック粉末を板状または柱状に
成形して得ることができるが、成形方法は特に限定され
ず、周知のプレス成形、鋳込み成形等が採用される。−
得られた成形体は液状樹脂が含浸可能な連通孔をもつ多
孔体の構造を有しており、またセラミック粉末の粒子が
連続的に連なっているので、ガラス−エポキシ基板に比
較して高熱伝導性を有している。The ceramic molded body can be obtained by molding ceramic powder into a plate shape or column shape, but the molding method is not particularly limited, and well-known press molding, cast molding, etc. are employed. - The obtained molded body has a porous structure with communicating pores that can be impregnated with liquid resin, and because the ceramic powder particles are continuously connected, it can withstand high heat compared to a glass-epoxy substrate. It has conductivity.
本発明においてはこの成形体に樹脂を含浸し、ついで固
化させるが、樹脂としては、セラミック成形体の強度を
高め、銅箔と接着するもので、銅箔との接着力、耐熱性
、耐湿性などが良好なものが好ましく、例えば、エポキ
シ樹脂、フェノールノボラック樹脂等の熱硬化性樹脂、
また熱可塑性樹脂も使用できるが、熱硬化性樹脂が好ま
しい。In the present invention, this molded body is impregnated with resin and then solidified. The resin increases the strength of the ceramic molded body and adheres to the copper foil, and has excellent adhesive strength with the copper foil, heat resistance, and moisture resistance. For example, thermosetting resins such as epoxy resins and phenol novolac resins,
Although thermoplastic resins can also be used, thermosetting resins are preferred.
含浸は、通常板状または柱状の成形体を脱気しながら液
状の樹脂を含浸させ、必要に応じて予備硬化（半硬化）
させておくのが好ましい。Impregnation is usually performed by impregnating a plate-shaped or columnar molded body with liquid resin while degassing it, and pre-curing (semi-curing) as necessary.
It is preferable to leave it alone.
また、固体状樹脂を溶媒に溶かして使用することもでき
るが、この場合は含浸させた後に乾燥して溶媒を除いて
おく。Further, the solid resin can be used by being dissolved in a solvent, but in this case, the solvent is removed by drying after impregnation.
成形体が所望の厚みの板状のものはそのまま使用するこ
とができるが、厚板、柱状のものについては、通常の機
械加工により所望の厚みの板状に切断して使用する。基
板としての厚みは目的に応じて適宜決めることカセでき
、特に限定されないが、一般に０．５〜２ｍｍ 、好ま
しくは１〜２ｓａｍの範囲である。A plate-shaped molded product with a desired thickness can be used as is, but a thick plate or column-shaped molded product is used after being cut into a plate-like shape with a desired thickness by ordinary machining. The thickness of the substrate can be determined as appropriate depending on the purpose, and is not particularly limited, but is generally in the range of 0.5 to 2 mm, preferably 1 to 2 sam.
金属箔としては銅箔、銀箔、アルミニウム箔等の電導性
のよい金属の箔が用いられるが、銅箔が一般的である。As the metal foil, a metal foil with good conductivity such as copper foil, silver foil, or aluminum foil is used, and copper foil is generally used.
板の片面または両面に金属箔の張り合わせは、含浸させ
た樹脂が半硬化の状態で金属箔を張る方法と樹脂を熱硬
化させてから金属箔を張る方法がある。前者の方法は、
板の片面もしくは両面に金属箔を重ね、加熱プレスし、
さらに樹脂を加熱硬化させ片面もしくは両面回路用基板
を作る。後者の場合は板と金属箔との張り合わせは板に
接着剤を塗布して行うことができる。There are two methods for attaching metal foil to one or both sides of a board: one is to apply the metal foil while the impregnated resin is in a semi-hardened state, and the other is to apply the metal foil after thermosetting the resin. The former method is
Layer metal foil on one or both sides of the plate, heat press,
The resin is then heated and cured to create single-sided or double-sided circuit boards. In the latter case, the plate and the metal foil can be bonded together by applying an adhesive to the plate.
以上のようにして複合体の板を基板とした回路用基板が
作成できる。In the manner described above, a circuit board using a composite plate as a substrate can be produced.
また、本発明の回路用基板を用いて多層回路基板を作成
する場合は、前述の片面および両面に金属箔を張り合わ
せた回路用基板の金属箔をエッチングして所望の電気回
路を形成した回路基板を複数枚作成しておき、各基板の
間に、上記の樹脂を含浸させ、次いで予備硬化させた厚
みが０．１−１ｍ＋■程度のセラミック板を挟み、積み
重ねて加熱プレスし、必要に応じてさらに加熱硬化する
ことにより多層回路基板を作ることもできる。In addition, when creating a multilayer circuit board using the circuit board of the present invention, a circuit board in which a desired electric circuit is formed by etching the metal foil of the circuit board described above with metal foil laminated on one and both sides. A plurality of boards are made, and a ceramic board impregnated with the above resin and then pre-cured with a thickness of about 0.1-1m+■ is sandwiched between each board, stacked and hot pressed, and as needed. A multilayer circuit board can also be made by further heating and curing.
以上説明した通り、本発明により熱伝導性に優れ、熱膨
張率の小さい高密度実装が可能な回路用基板を提供する
ことができる。As explained above, according to the present invention, it is possible to provide a circuit board that has excellent thermal conductivity, has a small coefficient of thermal expansion, and can be mounted at high density.
以下、発明を実施例により説明するが、本発明はこれら
に限定されるものではない。EXAMPLES The invention will be described below with reference to Examples, but the invention is not limited thereto.
実施例 ｌ
平均粒径５μｍのＡｌｔｏｓを圧力１、５７ｏｎ／ｃｍ
”でプレス成形して厚み１．６ｍｍの板を成形した。該
成形体を１０−”ａ■Ｈｇ以下の真空下で脱気しながら
スミエポキシ＠）ＥＬＡ １２８（住友化学工業■製）
５４重量部、硬化剤として脂環式酸無水物であるＨＮ５
５００ （日立化成工業■製）４７重量部および硬化促
進剤としてスミキュアーＯＤ（住友化学工業■製）（Ｌ
５４重量部の割合からなる液状エポキシ樹脂組成物を含
浸させ、ついで予備硬化（１５０℃、８分間）させた。Example l Altos with an average particle size of 5 μm was applied at a pressure of 1, 57 on/cm
A plate with a thickness of 1.6 mm was formed by press molding with ``Sumi Epoxy@) ELA 128 (manufactured by Sumitomo Chemical Co., Ltd.) while degassing the molded body under a vacuum of 10 mm or less Hg.
54 parts by weight, HN5 which is an alicyclic acid anhydride as a curing agent
500 (manufactured by Hitachi Chemical) and 47 parts by weight of Sumicure OD (manufactured by Sumitomo Chemical) (L) as a curing accelerator.
It was impregnated with a liquid epoxy resin composition in a proportion of 54 parts by weight, and then precured (150° C., 8 minutes).
予備硬化させた成形体の両面に銅箔（ＪＴＣ，３５μ園
厚み、日本鉱業■製）を重ね合わせてプレス（１８０℃
、３０分間、５０Ｋｇ／ｃｍ” ） した。プレスして
できた板を、さらに１５０℃、５時間オーブンの中へ入
れてエポキシ樹脂を完全に硬化させ、両面回路用基板を
作った。得られた基板の熱伝導率は２．６Ｗ／ｍ−にで
あり、線熱膨張率（ＸＹ方向およびＺ方向）は１２Ｘ
１Ｇ−／℃であった。Copper foil (JTC, 35μ thick, manufactured by Nihon Kogyo ■) was placed on both sides of the pre-cured molded body and pressed (180℃).
, 30 minutes, 50 kg/cm").The pressed board was further placed in an oven at 150°C for 5 hours to completely cure the epoxy resin, and a double-sided circuit board was made. The thermal conductivity of the substrate is 2.6 W/m-, and the linear thermal expansion coefficient (XY direction and Z direction) is 12X
It was 1 G-/°C.
Claims (1)
浸、固化させてなる複合体よりなる板の片面または両面
に金属箔が張り合わされていることを特徴とするセラミ
ック回路用基板。A ceramic circuit board comprising a composite plate made by impregnating and solidifying a porous body obtained by molding ceramic powder with a resin, and having metal foil laminated on one or both sides of the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28975289A JPH03149890A (en) | 1989-11-06 | 1989-11-06 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28975289A JPH03149890A (en) | 1989-11-06 | 1989-11-06 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03149890A true JPH03149890A (en) | 1991-06-26 |
Family
ID=17747305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28975289A Pending JPH03149890A (en) | 1989-11-06 | 1989-11-06 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03149890A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0715488A1 (en) | 1994-11-30 | 1996-06-05 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
| US5531945A (en) * | 1992-04-13 | 1996-07-02 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of base board for printed wiring |
| WO2021065390A1 (en) * | 2019-09-30 | 2021-04-08 | 昭和電工株式会社 | Joined body and primer-equipped material |
-
1989
- 1989-11-06 JP JP28975289A patent/JPH03149890A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5531945A (en) * | 1992-04-13 | 1996-07-02 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of base board for printed wiring |
| EP0715488A1 (en) | 1994-11-30 | 1996-06-05 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
| WO2021065390A1 (en) * | 2019-09-30 | 2021-04-08 | 昭和電工株式会社 | Joined body and primer-equipped material |
| JPWO2021065390A1 (en) * | 2019-09-30 | 2021-11-11 | 昭和電工株式会社 | Bonds and materials with primers |
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