GB902142A - Process for depositing a metallised surface on an article - Google Patents

Process for depositing a metallised surface on an article

Info

Publication number
GB902142A
GB902142A GB1916158A GB1916158A GB902142A GB 902142 A GB902142 A GB 902142A GB 1916158 A GB1916158 A GB 1916158A GB 1916158 A GB1916158 A GB 1916158A GB 902142 A GB902142 A GB 902142A
Authority
GB
United Kingdom
Prior art keywords
resin
mixture
polyester
coated
polyester resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1916158A
Inventor
Nigel Cecil William Judd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Development Corp UK
Original Assignee
National Research Development Corp UK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Development Corp UK filed Critical National Research Development Corp UK
Priority to GB1916158A priority Critical patent/GB902142A/en
Publication of GB902142A publication Critical patent/GB902142A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/073Displacement plating, substitution plating or immersion plating, e.g. for finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulding By Coating Moulds (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

A article is metallized by forming a layer of metal powder and a resinous material which passes slowly through a gelled condition during a room temperature curing cycle, exposing the metal powder when the medium is further cured, and depositing a metal layer on the exposed metal particles. The metal particles may be of spherical form and their size may be up to 5 microns. The mixture may be applied as a thin layer on a former or mould surface which may be pre-treated to ensure adherence of the resin, or the surface may be treated with a release agent so that the resin mixture layer may be removed therefrom. In the latter case, a support may be applied to the mixture while in gelled condition so that union is effected. Finely divided silica powder may be added to increase the electrical resistance. The resin may be a polyester, epoxy, or polyvinyl resin, and may contain cobalt naphthenate, methyl ethyl ketone peroxide, and an amine derivative. In Example 1, an aluminium plate coated with a silicone release agent is coated with a mixture consisting of polyestervinyl resin, flexible polyester-vinyl resin, iron powder, cobalt naphthenate, and methyl ethyl ketone peroxide, and, after gelling, a laminate of six layers of glass cloth impregnated with polyester resin, cobalt naphthenate, and methyl ethyl ketone peroxide. After curing, the laminate is removed and the iron-resin surface abraded, washed and immersed in acidified copper sulphate solution to effect copper plating. In Example 2, a glass fibre-polyester resin sheet coated with a polyester resin-iron powder mixture is abraded, washed and treated in an aqueous solution of nickel chloride, sodium hypophosphite and sodium glycollate to effect nickel plating. In Example 3, a glass fibre-polyester resin sheet is coated with a polyester-vinyl resincobalt powder mixture and, after abrasion, is copper plated. In Example 4, nickel powder is used, and gold plating effected by immersion in an acidified bath of gold potassium chloride. In Example 5, a semi-cylindrical plastic mould is coated with an aqueous sodium alginate parting agent and then with a polyester-vinyl resin, iron powder, and silica powder mixture. Three layers of glass cloth impregnated with uncured polyester resin are applied, and then a glass fibre honeycomb impregnated with polyester resin is applied and temporarily tied in position. A glass cloth impregnated with a polyester-vinyl resin composition containing silica powder is applied, and then further layers of the impregnated glass cloth. The whole is temporarily covered with "Cellophane" (Registered Trade Mark) and removed from the mould after curing. After abrasion, a wooden trough is built up round the semi-cylindrical moulded structure and acidified copper sulphate solution poured in to effect copper plating. In Example 6, an iron powder surfaced polyester resin-glass fibre laminate is abraded, washed, dried, coated with photosensitive enamel, printed from a negative, developed to form a resist, and copper plated. In Example 7, a pressure-moulded asbestosreinforced phenolic pulg carrying lead-out wires is painted, after abrasion, with a thin film of polyester resin-iron powder mixture, and the surface and lead-out wires are abraded until a common flush surface is obtained. Photo-sensitive solution is applied and dried, and a circuit printed thereon from a negative. After development of the resist, the plug is copper plated in an acidified copper sulphate bath. In Example 8, the abraded surface of a glass fibre reinforced polyester resin laminate is coated with a polyester resin, iron powder and silica powder mixture, allowed to cure, and abraded. In Example 9, a laminate produced as in Example 1 is electroplated to increase the thickness of the copper, parts of the surface are masked, and etching is effected with ferric chloride solution. In the production of electric circuits, a resin-metal powder mixture may be applied to the whole of a surface, and after curing a thin film of water-resistant lacquer is applied. After exposure of the metal powder by abrasion in the lines of the circuit, the lines are plated. Alternatively, the mixture may be printed in the desired pattern by the silk screen process and then treated uniformly, or the circuit pattern may be formed by photographic means. Several composite layers each comprising a support, a resin-metal powder mixture, and a plated layer may be used. The articles formed may include conducting supports for articles made by electroplating or moulds, e.g. plastic moulds, provided with metal faces. According to the first Provisional Specification, the exposed metal particles may be treated with an activating agent such as a saturated solution of stannous chloride. A mixture of an epoxide resin, 4-micron size carbonyl iron powder, and triethylene tetramine may be coated on to asbestos fibre reinforced phenolic resin. The resinous material may also be polyvinyl acetate or a butyral modified phenolic resin.ALSO:An article is metallized by forming a layer of a mixture of metal powder and a resinous material which passes slowly through a gelled condition during a room temperature curing cycle, exposing the metal powder when the medium is further cured, and depositing a metal layer on the exposed metal particles. The metal particles may be of spherical form and their size may be up to 5 microns. The mixture may be applied as a thin layer on a former or mould surface which may be pretreated to ensure adherence of the resin, or the surface may be treated with a release agent so that the resin mixture layer may be removed therefrom. In the latter case, a support may be applied to the mixture while in gelled condition so that union is effected. Finely divided silica powder may be added to increase the electrical resistance. The resin may be a polyester, epoxy, or polyvinyl resin, and may contain cobalt naphthenate, methyl ethyl ketone peroxide and amine derivative. In Example 1, an aluminium plate coated with a silicone release agent is coated with a mixture consisting of polyester-vinyl resin, flexible polyester-vinyl resin, iron powder, cobalt naphthenate, and methyl ethyl ketone peroxide and, after gelling, a laminate of six layers of glass cloth impregnated with polyester resin, cobalt naphthenate, and methyl ethyl ketone peroxide. After curing, the laminate is removed and the iron-resin surface abraded, washed and immersed in acidified copper sulphate solution to effect copper plating. In Example 2, a glass fibre-polyester resin sheet coated with a polyester resin-iron powder mixture is abraded, washed and treated in an aqueous solution of nickel chloride, sodium hypophosphite and sodium glycollate to effect nickel plating. In Example 3, a glass fibre-polyester resin sheet is coated with a polyester-vinyl resin-cobalt powder mixture and, after abrasion, is copper-plated. In Example 4, nickel powder is used, and gold plating effected by immersion in an acidified bath of gold potassium chloride. In Example 5, a semi-cylindrical plastic mould is coated with an aqueous sodium alginate parting agent and then with a polyester-vinyl resin, iron powder, and silica powder mixture. Three layers of glass cloth impregnated with uncured polyester resin are applied, and then a glass fibre honeycomb impregnated with polyester resin is applied and temporarily tied in position. A glass cloth impregnated with a polyester-vinyl resin composition containing silica powder is applied, and then further layers of the impregnated glass cloth. The whole is temporarily covered with "Cellophane" (Registered Trade Mark), and removed from the mould after curing. After abrasion, a wooden trough is built up round the semi-cylindrical moulded structure and acidified copper sulphate solution poured in to effect copper-plating. In Example 6, an iron powder surfaced polyester resin-glass fibre laminate is abraded, washed, dried, coated with photo-sensitive enamel, printed from a negative, developed to form a resist, and copper-plated. In Example 7, a pressure-moulded asbestos-reinforced phenolic plug carrying lead-out wires is painted, after abrasion, with a thin film of polyester resin-iron powder mixture, and the surface and lead-out wires are abraded until a common flush surface is obtained. Photo-sensitive solution is applied and dried, and a circuit printed thereon from a negative. After development of the resist, the plug is copper-plated in an acidified copper sulphate bath. In Example 8, the abraded surface of a glass fibre reinforced polyester resin laminate is coated with a polyester resin, iron powder and silica powder mixture, allowed to cure, and abraded. In Example 9, a laminate produced as in Example 1 is electroplated to increase the thickness of the copper, parts of the surface are masked, and etching is effected with ferric chloride solution. In the production of electric circuits, a resin-metal powder mixture may be applied to the whole of a surface, and after curing a thin film of water-resistant lacquer is applied. After exposure of the metal powder by abrasion in the lines of the circuit, the lines are plated. Alternatively, the mixture may be printed in the desired pattern by the silk screen process and then treated uniformly, or the circuit pattern may be formed by photo-graphic means. Several composite layers each comprising a support, a resin-metal powder mixture, and a plated layer may be used. The articles formed may include conducting supports for articles made by electroplating or moulds, e.g. plastic moulds, provided with metal faces. According to the first Provisional Specification, the exposed metal particles may be treated with an activating agent such as a saturated solution of stannous chloride. A mixture of an epoxide resin, 4-micron size carbonyl iron, and triethylene tetramine may be coated on to as
GB1916158A 1958-06-16 1958-06-16 Process for depositing a metallised surface on an article Expired GB902142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1916158A GB902142A (en) 1958-06-16 1958-06-16 Process for depositing a metallised surface on an article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1916158A GB902142A (en) 1958-06-16 1958-06-16 Process for depositing a metallised surface on an article

Publications (1)

Publication Number Publication Date
GB902142A true GB902142A (en) 1962-07-25

Family

ID=10124781

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1916158A Expired GB902142A (en) 1958-06-16 1958-06-16 Process for depositing a metallised surface on an article

Country Status (1)

Country Link
GB (1) GB902142A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3332860A (en) * 1963-09-19 1967-07-25 Basf Ag Metallizing plastic surfaces
DE2629865A1 (en) * 1975-07-02 1977-01-27 Maeda Shell Service Kk METAL DEPOSITION METAL PROCESS ON MOLDED BODIES MADE OF SYNTHETIC RESIN
GB2000629A (en) * 1977-06-30 1979-01-10 Polaroid Corp Electric batteries
EP0130462A2 (en) * 1983-06-24 1985-01-09 Amoco Corporation Printed circuits
EP2977201A1 (en) * 2014-07-24 2016-01-27 Recubrimientos Plasticos, S.A. Magnetorheological metal multi-panel
CN108844924A (en) * 2018-07-17 2018-11-20 河南师范大学 Capillary pipe structure local surface plasma resonance biochemical sensor
CN114000139A (en) * 2021-12-31 2022-02-01 常州市业峰汽车部件有限公司 Anticorrosion technology of aluminum alloy hub
CN115106535A (en) * 2022-08-29 2022-09-27 南通领跑者新材料科技有限公司 Preparation method of flaky metal powder

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3332860A (en) * 1963-09-19 1967-07-25 Basf Ag Metallizing plastic surfaces
DE1301186B (en) * 1963-09-19 1969-08-14 Basf Ag Process for the metallization of surfaces of plastic objects
DE2629865A1 (en) * 1975-07-02 1977-01-27 Maeda Shell Service Kk METAL DEPOSITION METAL PROCESS ON MOLDED BODIES MADE OF SYNTHETIC RESIN
GB2000629A (en) * 1977-06-30 1979-01-10 Polaroid Corp Electric batteries
GB2000629B (en) * 1977-06-30 1982-04-15 Polaroid Corp Improvements in electric batteries
EP0130462A2 (en) * 1983-06-24 1985-01-09 Amoco Corporation Printed circuits
EP0130462A3 (en) * 1983-06-24 1986-07-30 Amoco Corporation Printed circuits
EP2977201A1 (en) * 2014-07-24 2016-01-27 Recubrimientos Plasticos, S.A. Magnetorheological metal multi-panel
CN108844924A (en) * 2018-07-17 2018-11-20 河南师范大学 Capillary pipe structure local surface plasma resonance biochemical sensor
CN114000139A (en) * 2021-12-31 2022-02-01 常州市业峰汽车部件有限公司 Anticorrosion technology of aluminum alloy hub
CN114000139B (en) * 2021-12-31 2022-03-18 常州市业峰汽车部件有限公司 Anticorrosion technology of aluminum alloy hub
CN115106535A (en) * 2022-08-29 2022-09-27 南通领跑者新材料科技有限公司 Preparation method of flaky metal powder

Similar Documents

Publication Publication Date Title
US3925578A (en) Sensitized substrates for chemical metallization
ES337132A1 (en) Base material and method for the manufacture of printed circuits
US3481777A (en) Electroless coating method for making printed circuits
CN107081916A (en) The preparation method of nickel coated glass fibres fabric/epoxy resin electromagnetic shielding composite material
GB902142A (en) Process for depositing a metallised surface on an article
JPH01501432A (en) Method of manufacturing multilayer printed circuit board
US4253875A (en) Catalytic lacquer for producing printing circuits
US4997674A (en) Conductive metallization of substrates via developing agents
DE3267541D1 (en) Method of producing printed circuit boards
US3642476A (en) Method of preparing glass masters
JPH03204992A (en) Swelling agent for pretreatment of syntheticresin before electroless metal, manufacture of wholly metallized substrate, wholly metallized substrate, and manufacture of printed wiring board, chip supporter, hybrid circuit, multilyered laminate semi-finished product, and electromagnetic shield semi-finished product
ES487017A1 (en) Printed circuits
US3928663A (en) Modified hectorite for electroless plating
CN104244587A (en) Three-dimensional circuit manufacturing method and thermosetting spraying solution
GB1209963A (en) Method of manufacturing printed circuits having metallised holes
US4084968A (en) Method of manufacturing electrically conductive metal layers on substrates
GB979779A (en) Method of making printed circuits
JPH0423391A (en) Manufacture of multilayer wiring circuit board
JPH0191492A (en) Manufacture of circuit board
JPS6362919B2 (en)
JPS5734919A (en) Molding and electrodepositing method for fiber reinforced plastic composite material
GB863850A (en) Improvements in or relating to a method of making an electric conductor adhering to an insulating support
JP2590298B2 (en) Method for producing three-dimensional molded article having three-dimensional conductive circuit on surface
JPS61288488A (en) Manufacture of molded circuit board
JPH0222149B2 (en)