GB902142A - Process for depositing a metallised surface on an article - Google Patents
Process for depositing a metallised surface on an articleInfo
- Publication number
- GB902142A GB902142A GB1916158A GB1916158A GB902142A GB 902142 A GB902142 A GB 902142A GB 1916158 A GB1916158 A GB 1916158A GB 1916158 A GB1916158 A GB 1916158A GB 902142 A GB902142 A GB 902142A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- mixture
- polyester
- coated
- polyester resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
A article is metallized by forming a layer of metal powder and a resinous material which passes slowly through a gelled condition during a room temperature curing cycle, exposing the metal powder when the medium is further cured, and depositing a metal layer on the exposed metal particles. The metal particles may be of spherical form and their size may be up to 5 microns. The mixture may be applied as a thin layer on a former or mould surface which may be pre-treated to ensure adherence of the resin, or the surface may be treated with a release agent so that the resin mixture layer may be removed therefrom. In the latter case, a support may be applied to the mixture while in gelled condition so that union is effected. Finely divided silica powder may be added to increase the electrical resistance. The resin may be a polyester, epoxy, or polyvinyl resin, and may contain cobalt naphthenate, methyl ethyl ketone peroxide, and an amine derivative. In Example 1, an aluminium plate coated with a silicone release agent is coated with a mixture consisting of polyestervinyl resin, flexible polyester-vinyl resin, iron powder, cobalt naphthenate, and methyl ethyl ketone peroxide, and, after gelling, a laminate of six layers of glass cloth impregnated with polyester resin, cobalt naphthenate, and methyl ethyl ketone peroxide. After curing, the laminate is removed and the iron-resin surface abraded, washed and immersed in acidified copper sulphate solution to effect copper plating. In Example 2, a glass fibre-polyester resin sheet coated with a polyester resin-iron powder mixture is abraded, washed and treated in an aqueous solution of nickel chloride, sodium hypophosphite and sodium glycollate to effect nickel plating. In Example 3, a glass fibre-polyester resin sheet is coated with a polyester-vinyl resincobalt powder mixture and, after abrasion, is copper plated. In Example 4, nickel powder is used, and gold plating effected by immersion in an acidified bath of gold potassium chloride. In Example 5, a semi-cylindrical plastic mould is coated with an aqueous sodium alginate parting agent and then with a polyester-vinyl resin, iron powder, and silica powder mixture. Three layers of glass cloth impregnated with uncured polyester resin are applied, and then a glass fibre honeycomb impregnated with polyester resin is applied and temporarily tied in position. A glass cloth impregnated with a polyester-vinyl resin composition containing silica powder is applied, and then further layers of the impregnated glass cloth. The whole is temporarily covered with "Cellophane" (Registered Trade Mark) and removed from the mould after curing. After abrasion, a wooden trough is built up round the semi-cylindrical moulded structure and acidified copper sulphate solution poured in to effect copper plating. In Example 6, an iron powder surfaced polyester resin-glass fibre laminate is abraded, washed, dried, coated with photosensitive enamel, printed from a negative, developed to form a resist, and copper plated. In Example 7, a pressure-moulded asbestosreinforced phenolic pulg carrying lead-out wires is painted, after abrasion, with a thin film of polyester resin-iron powder mixture, and the surface and lead-out wires are abraded until a common flush surface is obtained. Photo-sensitive solution is applied and dried, and a circuit printed thereon from a negative. After development of the resist, the plug is copper plated in an acidified copper sulphate bath. In Example 8, the abraded surface of a glass fibre reinforced polyester resin laminate is coated with a polyester resin, iron powder and silica powder mixture, allowed to cure, and abraded. In Example 9, a laminate produced as in Example 1 is electroplated to increase the thickness of the copper, parts of the surface are masked, and etching is effected with ferric chloride solution. In the production of electric circuits, a resin-metal powder mixture may be applied to the whole of a surface, and after curing a thin film of water-resistant lacquer is applied. After exposure of the metal powder by abrasion in the lines of the circuit, the lines are plated. Alternatively, the mixture may be printed in the desired pattern by the silk screen process and then treated uniformly, or the circuit pattern may be formed by photographic means. Several composite layers each comprising a support, a resin-metal powder mixture, and a plated layer may be used. The articles formed may include conducting supports for articles made by electroplating or moulds, e.g. plastic moulds, provided with metal faces. According to the first Provisional Specification, the exposed metal particles may be treated with an activating agent such as a saturated solution of stannous chloride. A mixture of an epoxide resin, 4-micron size carbonyl iron powder, and triethylene tetramine may be coated on to asbestos fibre reinforced phenolic resin. The resinous material may also be polyvinyl acetate or a butyral modified phenolic resin.ALSO:An article is metallized by forming a layer of a mixture of metal powder and a resinous material which passes slowly through a gelled condition during a room temperature curing cycle, exposing the metal powder when the medium is further cured, and depositing a metal layer on the exposed metal particles. The metal particles may be of spherical form and their size may be up to 5 microns. The mixture may be applied as a thin layer on a former or mould surface which may be pretreated to ensure adherence of the resin, or the surface may be treated with a release agent so that the resin mixture layer may be removed therefrom. In the latter case, a support may be applied to the mixture while in gelled condition so that union is effected. Finely divided silica powder may be added to increase the electrical resistance. The resin may be a polyester, epoxy, or polyvinyl resin, and may contain cobalt naphthenate, methyl ethyl ketone peroxide and amine derivative. In Example 1, an aluminium plate coated with a silicone release agent is coated with a mixture consisting of polyester-vinyl resin, flexible polyester-vinyl resin, iron powder, cobalt naphthenate, and methyl ethyl ketone peroxide and, after gelling, a laminate of six layers of glass cloth impregnated with polyester resin, cobalt naphthenate, and methyl ethyl ketone peroxide. After curing, the laminate is removed and the iron-resin surface abraded, washed and immersed in acidified copper sulphate solution to effect copper plating. In Example 2, a glass fibre-polyester resin sheet coated with a polyester resin-iron powder mixture is abraded, washed and treated in an aqueous solution of nickel chloride, sodium hypophosphite and sodium glycollate to effect nickel plating. In Example 3, a glass fibre-polyester resin sheet is coated with a polyester-vinyl resin-cobalt powder mixture and, after abrasion, is copper-plated. In Example 4, nickel powder is used, and gold plating effected by immersion in an acidified bath of gold potassium chloride. In Example 5, a semi-cylindrical plastic mould is coated with an aqueous sodium alginate parting agent and then with a polyester-vinyl resin, iron powder, and silica powder mixture. Three layers of glass cloth impregnated with uncured polyester resin are applied, and then a glass fibre honeycomb impregnated with polyester resin is applied and temporarily tied in position. A glass cloth impregnated with a polyester-vinyl resin composition containing silica powder is applied, and then further layers of the impregnated glass cloth. The whole is temporarily covered with "Cellophane" (Registered Trade Mark), and removed from the mould after curing. After abrasion, a wooden trough is built up round the semi-cylindrical moulded structure and acidified copper sulphate solution poured in to effect copper-plating. In Example 6, an iron powder surfaced polyester resin-glass fibre laminate is abraded, washed, dried, coated with photo-sensitive enamel, printed from a negative, developed to form a resist, and copper-plated. In Example 7, a pressure-moulded asbestos-reinforced phenolic plug carrying lead-out wires is painted, after abrasion, with a thin film of polyester resin-iron powder mixture, and the surface and lead-out wires are abraded until a common flush surface is obtained. Photo-sensitive solution is applied and dried, and a circuit printed thereon from a negative. After development of the resist, the plug is copper-plated in an acidified copper sulphate bath. In Example 8, the abraded surface of a glass fibre reinforced polyester resin laminate is coated with a polyester resin, iron powder and silica powder mixture, allowed to cure, and abraded. In Example 9, a laminate produced as in Example 1 is electroplated to increase the thickness of the copper, parts of the surface are masked, and etching is effected with ferric chloride solution. In the production of electric circuits, a resin-metal powder mixture may be applied to the whole of a surface, and after curing a thin film of water-resistant lacquer is applied. After exposure of the metal powder by abrasion in the lines of the circuit, the lines are plated. Alternatively, the mixture may be printed in the desired pattern by the silk screen process and then treated uniformly, or the circuit pattern may be formed by photo-graphic means. Several composite layers each comprising a support, a resin-metal powder mixture, and a plated layer may be used. The articles formed may include conducting supports for articles made by electroplating or moulds, e.g. plastic moulds, provided with metal faces. According to the first Provisional Specification, the exposed metal particles may be treated with an activating agent such as a saturated solution of stannous chloride. A mixture of an epoxide resin, 4-micron size carbonyl iron, and triethylene tetramine may be coated on to as
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1916158A GB902142A (en) | 1958-06-16 | 1958-06-16 | Process for depositing a metallised surface on an article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1916158A GB902142A (en) | 1958-06-16 | 1958-06-16 | Process for depositing a metallised surface on an article |
Publications (1)
Publication Number | Publication Date |
---|---|
GB902142A true GB902142A (en) | 1962-07-25 |
Family
ID=10124781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1916158A Expired GB902142A (en) | 1958-06-16 | 1958-06-16 | Process for depositing a metallised surface on an article |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB902142A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3332860A (en) * | 1963-09-19 | 1967-07-25 | Basf Ag | Metallizing plastic surfaces |
DE2629865A1 (en) * | 1975-07-02 | 1977-01-27 | Maeda Shell Service Kk | METAL DEPOSITION METAL PROCESS ON MOLDED BODIES MADE OF SYNTHETIC RESIN |
GB2000629A (en) * | 1977-06-30 | 1979-01-10 | Polaroid Corp | Electric batteries |
EP0130462A2 (en) * | 1983-06-24 | 1985-01-09 | Amoco Corporation | Printed circuits |
EP2977201A1 (en) * | 2014-07-24 | 2016-01-27 | Recubrimientos Plasticos, S.A. | Magnetorheological metal multi-panel |
CN108844924A (en) * | 2018-07-17 | 2018-11-20 | 河南师范大学 | Capillary pipe structure local surface plasma resonance biochemical sensor |
CN114000139A (en) * | 2021-12-31 | 2022-02-01 | 常州市业峰汽车部件有限公司 | Anticorrosion technology of aluminum alloy hub |
CN115106535A (en) * | 2022-08-29 | 2022-09-27 | 南通领跑者新材料科技有限公司 | Preparation method of flaky metal powder |
-
1958
- 1958-06-16 GB GB1916158A patent/GB902142A/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3332860A (en) * | 1963-09-19 | 1967-07-25 | Basf Ag | Metallizing plastic surfaces |
DE1301186B (en) * | 1963-09-19 | 1969-08-14 | Basf Ag | Process for the metallization of surfaces of plastic objects |
DE2629865A1 (en) * | 1975-07-02 | 1977-01-27 | Maeda Shell Service Kk | METAL DEPOSITION METAL PROCESS ON MOLDED BODIES MADE OF SYNTHETIC RESIN |
GB2000629A (en) * | 1977-06-30 | 1979-01-10 | Polaroid Corp | Electric batteries |
GB2000629B (en) * | 1977-06-30 | 1982-04-15 | Polaroid Corp | Improvements in electric batteries |
EP0130462A2 (en) * | 1983-06-24 | 1985-01-09 | Amoco Corporation | Printed circuits |
EP0130462A3 (en) * | 1983-06-24 | 1986-07-30 | Amoco Corporation | Printed circuits |
EP2977201A1 (en) * | 2014-07-24 | 2016-01-27 | Recubrimientos Plasticos, S.A. | Magnetorheological metal multi-panel |
CN108844924A (en) * | 2018-07-17 | 2018-11-20 | 河南师范大学 | Capillary pipe structure local surface plasma resonance biochemical sensor |
CN114000139A (en) * | 2021-12-31 | 2022-02-01 | 常州市业峰汽车部件有限公司 | Anticorrosion technology of aluminum alloy hub |
CN114000139B (en) * | 2021-12-31 | 2022-03-18 | 常州市业峰汽车部件有限公司 | Anticorrosion technology of aluminum alloy hub |
CN115106535A (en) * | 2022-08-29 | 2022-09-27 | 南通领跑者新材料科技有限公司 | Preparation method of flaky metal powder |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3925578A (en) | Sensitized substrates for chemical metallization | |
ES337132A1 (en) | Base material and method for the manufacture of printed circuits | |
US3481777A (en) | Electroless coating method for making printed circuits | |
CN107081916A (en) | The preparation method of nickel coated glass fibres fabric/epoxy resin electromagnetic shielding composite material | |
GB902142A (en) | Process for depositing a metallised surface on an article | |
JPH01501432A (en) | Method of manufacturing multilayer printed circuit board | |
US4253875A (en) | Catalytic lacquer for producing printing circuits | |
US4997674A (en) | Conductive metallization of substrates via developing agents | |
DE3267541D1 (en) | Method of producing printed circuit boards | |
US3642476A (en) | Method of preparing glass masters | |
JPH03204992A (en) | Swelling agent for pretreatment of syntheticresin before electroless metal, manufacture of wholly metallized substrate, wholly metallized substrate, and manufacture of printed wiring board, chip supporter, hybrid circuit, multilyered laminate semi-finished product, and electromagnetic shield semi-finished product | |
ES487017A1 (en) | Printed circuits | |
US3928663A (en) | Modified hectorite for electroless plating | |
CN104244587A (en) | Three-dimensional circuit manufacturing method and thermosetting spraying solution | |
GB1209963A (en) | Method of manufacturing printed circuits having metallised holes | |
US4084968A (en) | Method of manufacturing electrically conductive metal layers on substrates | |
GB979779A (en) | Method of making printed circuits | |
JPH0423391A (en) | Manufacture of multilayer wiring circuit board | |
JPH0191492A (en) | Manufacture of circuit board | |
JPS6362919B2 (en) | ||
JPS5734919A (en) | Molding and electrodepositing method for fiber reinforced plastic composite material | |
GB863850A (en) | Improvements in or relating to a method of making an electric conductor adhering to an insulating support | |
JP2590298B2 (en) | Method for producing three-dimensional molded article having three-dimensional conductive circuit on surface | |
JPS61288488A (en) | Manufacture of molded circuit board | |
JPH0222149B2 (en) |