TW540259B - Liquid crystal polymers for flexible circuits - Google Patents
Liquid crystal polymers for flexible circuits Download PDFInfo
- Publication number
- TW540259B TW540259B TW091120042A TW91120042A TW540259B TW 540259 B TW540259 B TW 540259B TW 091120042 A TW091120042 A TW 091120042A TW 91120042 A TW91120042 A TW 91120042A TW 540259 B TW540259 B TW 540259B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid crystal
- crystal polymer
- metal
- film
- solution
- Prior art date
Links
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 133
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 131
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 238000000034 method Methods 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000007864 aqueous solution Substances 0.000 claims abstract description 16
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 32
- 238000012360 testing method Methods 0.000 claims description 22
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003916 ethylene diamine group Chemical group 0.000 claims 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 66
- 230000008569 process Effects 0.000 abstract description 33
- 239000000203 mixture Substances 0.000 abstract description 24
- -1 alkali metal salt Chemical class 0.000 abstract description 8
- 239000002904 solvent Substances 0.000 abstract description 8
- 229910052783 alkali metal Inorganic materials 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 7
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 abstract description 5
- 238000000151 deposition Methods 0.000 abstract description 4
- 238000001771 vacuum deposition Methods 0.000 abstract description 3
- 230000001464 adherent effect Effects 0.000 abstract description 2
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 99
- 229920002120 photoresistant polymer Polymers 0.000 description 44
- 239000010410 layer Substances 0.000 description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 29
- 229910052802 copper Inorganic materials 0.000 description 29
- 239000010949 copper Substances 0.000 description 29
- 238000005530 etching Methods 0.000 description 28
- 229920001721 polyimide Polymers 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 229920006254 polymer film Polymers 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 230000003197 catalytic effect Effects 0.000 description 9
- 238000005553 drilling Methods 0.000 description 9
- 238000001465 metallisation Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000032798 delamination Effects 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 238000003486 chemical etching Methods 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000002648 laminated material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000000053 physical method Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241000531908 Aramides Species 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- 244000131522 Citrus pyriformis Species 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- HJJVPARKXDDIQD-UHFFFAOYSA-N bromuconazole Chemical compound ClC1=CC(Cl)=CC=C1C1(CN2N=CN=C2)OCC(Br)C1 HJJVPARKXDDIQD-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/947,082 US6923919B2 (en) | 2000-07-18 | 2001-09-04 | Liquid crystal polymers for flexible circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW540259B true TW540259B (en) | 2003-07-01 |
Family
ID=25485490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091120042A TW540259B (en) | 2001-09-04 | 2002-09-03 | Liquid crystal polymers for flexible circuits |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6923919B2 (enExample) |
| EP (1) | EP1428417A1 (enExample) |
| JP (1) | JP2005502196A (enExample) |
| KR (1) | KR20040029148A (enExample) |
| CN (1) | CN1320847C (enExample) |
| TW (1) | TW540259B (enExample) |
| WO (1) | WO2003022021A1 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040247921A1 (en) * | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
| AU2002227426A1 (en) | 2000-08-15 | 2002-06-24 | World Properties Inc. | Multi-layer circuits and methods of manufacture thereof |
| US20020064701A1 (en) * | 2000-09-11 | 2002-05-30 | Hand Doris I. | Conductive liquid crystalline polymer film and method of manufacture thereof |
| AU2001292823A1 (en) | 2000-09-20 | 2002-04-02 | World Properties Inc. | Electrostatic deposition of high temperature, high performance thermoplastics |
| JP2004516662A (ja) | 2000-12-14 | 2004-06-03 | ワールド・プロパティーズ・インコーポレイテッド | 液晶ポリマー接着層および該接着層から形成された回路 |
| US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
| US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
| US7142083B2 (en) | 2002-09-17 | 2006-11-28 | Lindsey Raymond A | Electronics component and method for fabricating same |
| JP3689096B2 (ja) * | 2002-10-02 | 2005-08-31 | 学校法人神奈川大学 | 薄膜の形成方法 |
| US6819373B2 (en) * | 2002-10-03 | 2004-11-16 | International Business Machines Corporation | Lamination of liquid crystal polymer dielectric films |
| US7549220B2 (en) * | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
| US7012017B2 (en) * | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
| US20050186404A1 (en) * | 2004-02-23 | 2005-08-25 | Guoping Mao | Etched polycarbonate films |
| US7425276B2 (en) * | 2004-06-30 | 2008-09-16 | University Of South Florida | Method for etching microchannel networks within liquid crystal polymer substrates |
| KR100584962B1 (ko) * | 2004-07-26 | 2006-05-29 | 삼성전기주식회사 | 액정 중합체로 커버레이 성형된 경연성 인쇄회로기판 및그 제조 방법 |
| JP4104154B2 (ja) * | 2005-03-31 | 2008-06-18 | 東レエンジニアリング株式会社 | 液晶ポリマーのエッチング液及び液晶ポリマーのエッチング方法。 |
| US20070013600A1 (en) * | 2005-07-14 | 2007-01-18 | Centurion Wireless Technologies, Inc. | Antenna radiators made from metalized plastic, composites, or fabrics |
| US20070120089A1 (en) * | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| US20070235214A1 (en) * | 2006-03-30 | 2007-10-11 | Hall Stephen H | Moisture resistant printed circuit board |
| JP5421598B2 (ja) * | 2009-01-16 | 2014-02-19 | 株式会社ファインテック | フレキシブルプリント基板の製造方法 |
| US8263862B2 (en) * | 2009-02-07 | 2012-09-11 | Linden Photonics, Inc. | Hermetic electrical ports in liquid crystal polymer packages |
| US20120021218A1 (en) | 2010-07-23 | 2012-01-26 | Syscom Advanced Materials, Inc. | Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof |
| US9909063B2 (en) | 2010-11-03 | 2018-03-06 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| US9324472B2 (en) | 2010-12-29 | 2016-04-26 | Syscom Advanced Materials, Inc. | Metal and metallized fiber hybrid wire |
| US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
| WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
| JP6929936B2 (ja) * | 2017-04-06 | 2021-09-01 | 三菱製紙株式会社 | 樹脂組成物用のエッチング液及びエッチング方法 |
| WO2019217053A1 (en) | 2018-05-07 | 2019-11-14 | Neograf Solutions, Llc | Methods and apparatus for forming liquid crystal polymer flexible circuits |
| CN112912466A (zh) * | 2018-10-24 | 2021-06-04 | 三菱制纸株式会社 | 树脂组合物的蚀刻液及蚀刻方法 |
| CN112620983A (zh) * | 2019-04-19 | 2021-04-09 | 吴国喜 | 一种lcp钻孔系统及方法 |
| CN111499915A (zh) * | 2019-12-30 | 2020-08-07 | 瑞声科技(新加坡)有限公司 | 一种lcp薄膜的表面处理方法 |
| US11482884B2 (en) * | 2020-12-28 | 2022-10-25 | Nucurrent, Inc. | Systems and methods for utilizing laser cutting and chemical etching in manufacturing wireless power antennas |
| US11538629B2 (en) | 2020-12-28 | 2022-12-27 | Nucurrent, Inc. | Systems and methods for utilizing laser cutting and chemical etching in manufacturing wireless power antennas |
| CN113788975A (zh) * | 2021-09-14 | 2021-12-14 | 上海普利特复合材料股份有限公司 | 一种lcp材料的表面处理方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB979779A (en) | 1961-01-09 | 1965-01-06 | Photocircuits Corp | Method of making printed circuits |
| US3791848A (en) * | 1972-05-19 | 1974-02-12 | Western Electric Co | A method of improving the adherence of a metal deposit to a polyimide surface |
| US4426253A (en) * | 1981-12-03 | 1984-01-17 | E. I. Du Pont De Nemours & Co. | High speed etching of polyimide film |
| JP2581543B2 (ja) * | 1986-07-04 | 1997-02-12 | エビナ電化工業 株式会社 | メッキした全芳香族系ポリエステル液晶ポリマ−成形品の製造法 |
| US5066545A (en) | 1987-02-24 | 1991-11-19 | Polyonics Corporation | Process for forming polyimide-metal laminates |
| DE3884546T3 (de) * | 1987-10-02 | 2000-03-23 | Polyplastics Co. Ltd., Osaka | Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz. |
| US4975312A (en) * | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
| US4846929A (en) * | 1988-07-13 | 1989-07-11 | Ibm Corporation | Wet etching of thermally or chemically cured polyimide |
| US4995941A (en) | 1989-05-15 | 1991-02-26 | Rogers Corporation | Method of manufacture interconnect device |
| US5192590A (en) * | 1989-11-03 | 1993-03-09 | Raychem Corporation | Coating metal on poly(aryl ether ketone) surfaces |
| DE4028210A1 (de) * | 1990-09-06 | 1992-03-12 | Basf Ag | Verfahren zur oberflaechenbehandlung von formkoerpern auf der basis von fluessigkristallinen polymeren |
| US5318803A (en) * | 1990-11-13 | 1994-06-07 | International Business Machines Corporation | Conditioning of a substrate for electroless plating thereon |
| JP2768390B2 (ja) | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
| JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
| US5227008A (en) | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| JPH0677648A (ja) | 1992-08-20 | 1994-03-18 | Polyplastics Co | 立体的多層導電回路を有する複合成形品及びその製造方法 |
| JPH07316825A (ja) * | 1994-05-25 | 1995-12-05 | Sankyo Kasei Co Ltd | 部分メッキした芳香族系ポリエステル液晶ポリマー成形品の製造法 |
| US5614114A (en) | 1994-07-18 | 1997-03-25 | Electro Scientific Industries, Inc. | Laser system and method for plating vias |
| JP2939477B2 (ja) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
| JPH08288621A (ja) * | 1995-04-19 | 1996-11-01 | Sankyo Kasei Co Ltd | 立体成形回路部品の形成方法と立体成形回路部品 |
| US5670262A (en) * | 1995-05-09 | 1997-09-23 | The Dow Chemical Company | Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
| US5891528A (en) | 1995-09-15 | 1999-04-06 | M/Wave | Printed circuit board process using plasma spraying of conductive metal |
| US5891795A (en) | 1996-03-18 | 1999-04-06 | Motorola, Inc. | High density interconnect substrate |
| US6218022B1 (en) * | 1996-09-20 | 2001-04-17 | Toray Engineering Co., Ltd. | Resin etching solution and process for etching polyimide resins |
| JP3999834B2 (ja) | 1996-12-12 | 2007-10-31 | 三共化成株式会社 | 成形回路部品などのめっき部品の製法 |
| EP0905285B1 (en) * | 1997-02-03 | 2000-12-27 | Okuno Chemical Industries Co., Ltd. | Method for electroplating nonconductive material |
| WO1999039021A1 (en) | 1998-01-30 | 1999-08-05 | E.I. Du Pont De Nemours And Company | Process for metal plating liquid crystalline polymers and compositions related thereto |
| EP1069209B1 (en) | 1999-07-16 | 2004-10-06 | Enthone-OMI (Benelux) B.V. | Process for plating plastics using a catalytic filler |
| US6114492A (en) * | 2000-01-14 | 2000-09-05 | Ticona Llc | Process for producing liquid crystal polymer |
| US6403211B1 (en) * | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
-
2001
- 2001-09-04 US US09/947,082 patent/US6923919B2/en not_active Expired - Fee Related
-
2002
- 2002-08-15 CN CNB028171616A patent/CN1320847C/zh not_active Expired - Fee Related
- 2002-08-15 WO PCT/US2002/026030 patent/WO2003022021A1/en not_active Ceased
- 2002-08-15 JP JP2003525569A patent/JP2005502196A/ja active Pending
- 2002-08-15 KR KR10-2004-7003187A patent/KR20040029148A/ko not_active Ceased
- 2002-08-15 EP EP02763460A patent/EP1428417A1/en not_active Withdrawn
- 2002-09-03 TW TW091120042A patent/TW540259B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040029148A (ko) | 2004-04-03 |
| CN1320847C (zh) | 2007-06-06 |
| US20020028293A1 (en) | 2002-03-07 |
| US6923919B2 (en) | 2005-08-02 |
| JP2005502196A (ja) | 2005-01-20 |
| EP1428417A1 (en) | 2004-06-16 |
| WO2003022021A1 (en) | 2003-03-13 |
| CN1550124A (zh) | 2004-11-24 |
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