JP2005353741A5 - - Google Patents

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Publication number
JP2005353741A5
JP2005353741A5 JP2004171220A JP2004171220A JP2005353741A5 JP 2005353741 A5 JP2005353741 A5 JP 2005353741A5 JP 2004171220 A JP2004171220 A JP 2004171220A JP 2004171220 A JP2004171220 A JP 2004171220A JP 2005353741 A5 JP2005353741 A5 JP 2005353741A5
Authority
JP
Japan
Prior art keywords
temperature
heat sink
electronic device
width
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004171220A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353741A (ja
JP4534613B2 (ja
Filing date
Publication date
Priority claimed from JP2004171220A external-priority patent/JP4534613B2/ja
Priority to JP2004171220A priority Critical patent/JP4534613B2/ja
Application filed filed Critical
Priority to DE102005016830A priority patent/DE102005016830A1/de
Priority to US11/105,548 priority patent/US7843700B2/en
Publication of JP2005353741A publication Critical patent/JP2005353741A/ja
Publication of JP2005353741A5 publication Critical patent/JP2005353741A5/ja
Publication of JP4534613B2 publication Critical patent/JP4534613B2/ja
Application granted granted Critical
Priority to US12/923,968 priority patent/US8179688B2/en
Priority to US13/359,776 priority patent/US20120120610A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004171220A 2004-04-14 2004-06-09 電子装置 Expired - Fee Related JP4534613B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004171220A JP4534613B2 (ja) 2004-06-09 2004-06-09 電子装置
DE102005016830A DE102005016830A1 (de) 2004-04-14 2005-04-12 Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US11/105,548 US7843700B2 (en) 2004-04-14 2005-04-14 Semiconductor device
US12/923,968 US8179688B2 (en) 2004-04-14 2010-10-19 Semiconductor device
US13/359,776 US20120120610A1 (en) 2004-04-14 2012-01-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004171220A JP4534613B2 (ja) 2004-06-09 2004-06-09 電子装置

Publications (3)

Publication Number Publication Date
JP2005353741A JP2005353741A (ja) 2005-12-22
JP2005353741A5 true JP2005353741A5 (enExample) 2009-03-26
JP4534613B2 JP4534613B2 (ja) 2010-09-01

Family

ID=35587962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004171220A Expired - Fee Related JP4534613B2 (ja) 2004-04-14 2004-06-09 電子装置

Country Status (1)

Country Link
JP (1) JP4534613B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5257096B2 (ja) * 2009-01-23 2013-08-07 サンケン電気株式会社 半導体装置
JP2010177619A (ja) * 2009-02-02 2010-08-12 Sanken Electric Co Ltd 半導体モジュール
KR101255930B1 (ko) * 2011-07-04 2013-04-23 삼성전기주식회사 전력 모듈 패키지 및 그 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245677U (enExample) * 1988-09-22 1990-03-29
JP2563171Y2 (ja) * 1992-06-26 1998-02-18 シャープ株式会社 樹脂封止型半導体装置
JP2701712B2 (ja) * 1993-11-11 1998-01-21 日本電気株式会社 半導体装置
JP3189161B2 (ja) * 1995-09-13 2001-07-16 ローム株式会社 オーディオ信号増幅半導体装置
JP2002314030A (ja) * 2001-04-12 2002-10-25 Mitsubishi Electric Corp 半導体装置
JP2003209217A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp 半導体装置
JP3867639B2 (ja) * 2002-07-31 2007-01-10 株式会社デンソー 混成集積回路装置

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