JP4862385B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP4862385B2 JP4862385B2 JP2005361575A JP2005361575A JP4862385B2 JP 4862385 B2 JP4862385 B2 JP 4862385B2 JP 2005361575 A JP2005361575 A JP 2005361575A JP 2005361575 A JP2005361575 A JP 2005361575A JP 4862385 B2 JP4862385 B2 JP 4862385B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- graphite sheet
- generating component
- heat generating
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
7 押さえ板
8 開口部
9 黒鉛シート
10 放熱体
Claims (1)
- 回路基板に実装した発熱部品と、この発熱部品に当接させた放熱体とを備え、前記発熱部品と前記放熱体との間に黒鉛シートを介在させ、この黒鉛シートは、前記発熱部品側に設けた押さえ板により、前記放熱体に押圧された状態で、この押さえ板と前記放熱体との間に挟持され、かつ前記押さえ板の、前記発熱部品に対応する部分には開口部を設け、前記開口部を通して前記発熱部品と前記黒鉛シートとを当接させるものであり、前記押さえ板は前記放熱体よりも熱伝導性の低い材料により形成し、前記押さえ板は前記回路基板側に接触しないようにした電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005361575A JP4862385B2 (ja) | 2005-12-15 | 2005-12-15 | 電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005361575A JP4862385B2 (ja) | 2005-12-15 | 2005-12-15 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007165685A JP2007165685A (ja) | 2007-06-28 |
JP4862385B2 true JP4862385B2 (ja) | 2012-01-25 |
Family
ID=38248225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005361575A Active JP4862385B2 (ja) | 2005-12-15 | 2005-12-15 | 電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4862385B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2851948B1 (en) | 2012-05-16 | 2017-05-10 | NEC Corporation | Connecting structure of cooling device, cooling device, and method for connecting cooling device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10145064A (ja) * | 1996-11-05 | 1998-05-29 | Advantest Corp | 高放熱性伝熱部品 |
JP2002271066A (ja) * | 2001-03-12 | 2002-09-20 | Nec Gumma Ltd | ヒートシンクの取付構造 |
JP4430451B2 (ja) * | 2004-04-21 | 2010-03-10 | 大成ラミネーター株式会社 | 半導体素子の放熱装置 |
-
2005
- 2005-12-15 JP JP2005361575A patent/JP4862385B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007165685A (ja) | 2007-06-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20070146990A1 (en) | Heat dissipating assembly | |
US7436673B2 (en) | Heat sink fixing assembly | |
US20110075369A1 (en) | Electronic device | |
JP2008010768A (ja) | 電子機器および実装構造体 | |
JP2011081437A (ja) | 電子機器 | |
JP2001326485A (ja) | 携帯型電子機器 | |
JP2008198864A (ja) | 電子機器および半導体パッケージ | |
JP2008072062A (ja) | 実装構造、およびこれを備えた電子機器 | |
JP2016184659A (ja) | 冷却装置および装置 | |
JP6885194B2 (ja) | 電子機器 | |
JP2009094196A (ja) | 携帯通信機の放熱構造 | |
JP2007049015A (ja) | 電子機器構造と、電子機器構造が用いられた電子機器 | |
JP4438526B2 (ja) | パワー部品冷却装置 | |
JP2006339223A (ja) | Cpuの放熱構造 | |
JP4862385B2 (ja) | 電子機器 | |
TW201201000A (en) | Heat dissipation apparatus | |
JP2010212543A (ja) | 熱伝導部材および携帯型電子機器 | |
JP2008192657A (ja) | 電子機器 | |
JP2012129379A (ja) | 放熱フィン | |
JP2016184658A (ja) | 冷却装置および装置 | |
JP2008160029A (ja) | 冷却構造および電子機器 | |
JP6371245B2 (ja) | 熱伝導性部材、冷却構造及び装置 | |
JP2006245025A (ja) | 電子機器の放熱構造 | |
TWM383283U (en) | Slimming uniform temperature board and heat dissipating module with the uniform temperature board | |
JP2018096613A (ja) | 放熱構造及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081111 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090206 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20091127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110419 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110525 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110809 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111011 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111024 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141118 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4862385 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141118 Year of fee payment: 3 |