JP2005322915A - 構成要素の表面実装アタッチメント - Google Patents

構成要素の表面実装アタッチメント Download PDF

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Publication number
JP2005322915A
JP2005322915A JP2005134097A JP2005134097A JP2005322915A JP 2005322915 A JP2005322915 A JP 2005322915A JP 2005134097 A JP2005134097 A JP 2005134097A JP 2005134097 A JP2005134097 A JP 2005134097A JP 2005322915 A JP2005322915 A JP 2005322915A
Authority
JP
Japan
Prior art keywords
component
substrate
solder
solder mask
smt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005134097A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005322915A5 (enExample
Inventor
Patricia M Albanese
マリー アルバニーズ パトリシア
John W Osenbach
ダブリュ．オーゼンバッハ ジョン
Thomas H Shilling
エッチ．シリング トーマス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems LLC filed Critical Agere Systems LLC
Publication of JP2005322915A publication Critical patent/JP2005322915A/ja
Publication of JP2005322915A5 publication Critical patent/JP2005322915A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005134097A 2004-05-04 2005-05-02 構成要素の表面実装アタッチメント Withdrawn JP2005322915A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/838,897 US20050247761A1 (en) 2004-05-04 2004-05-04 Surface mount attachment of components

Publications (2)

Publication Number Publication Date
JP2005322915A true JP2005322915A (ja) 2005-11-17
JP2005322915A5 JP2005322915A5 (enExample) 2007-08-16

Family

ID=34941133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005134097A Withdrawn JP2005322915A (ja) 2004-05-04 2005-05-02 構成要素の表面実装アタッチメント

Country Status (6)

Country Link
US (2) US20050247761A1 (enExample)
EP (1) EP1593450A1 (enExample)
JP (1) JP2005322915A (enExample)
KR (1) KR20060047725A (enExample)
CN (1) CN1741715A (enExample)
TW (1) TW200607422A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2851151A1 (en) * 2013-09-20 2015-03-25 Alstom Technology Ltd Method of fixing through brazing heat resistant component on a surface of a heat exposed component
JP2015103782A (ja) * 2013-11-28 2015-06-04 株式会社東芝 半導体装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6889568B2 (en) 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7721238B2 (en) * 2004-09-22 2010-05-18 Digi International Inc. Method and apparatus for configurable printed circuit board circuit layout pattern
ATE397310T1 (de) * 2005-11-01 2008-06-15 Black & Decker Inc Kodiereinheit mit widerständen für einen kabelbaum
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
CN101990364B (zh) * 2009-08-04 2012-05-09 纬创资通股份有限公司 组装组件至电路板的方法与相关电路板组装系统
WO2011161552A2 (en) 2010-06-14 2011-12-29 Black & Decker Inc. Control unit for brushless motor in a power tool
US9450471B2 (en) 2012-05-24 2016-09-20 Milwaukee Electric Tool Corporation Brushless DC motor power tool with combined PCB design
JP6036303B2 (ja) * 2013-01-07 2016-11-30 セイコーエプソン株式会社 パッケージ、光学モジュール、及び電子機器
US9787159B2 (en) 2013-06-06 2017-10-10 Milwaukee Electric Tool Corporation Brushless DC motor configuration for a power tool
US9972553B1 (en) 2016-01-06 2018-05-15 National Technology & Engineering Solutions Of Sandia, Llc Packaging system with cleaning channel and method of making the same
US10695875B2 (en) * 2018-03-19 2020-06-30 Asia Vital Components Co., Ltd. Soldering method of soldering jig

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007317A1 (en) * 1987-03-19 1988-09-22 Western Digital Corporation Solder paste replacement method and article
US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US5001829A (en) * 1990-01-02 1991-03-26 General Electric Company Method for connecting a leadless chip carrier to a substrate
JPH0423485A (ja) * 1990-05-18 1992-01-27 Cmk Corp プリント配線板とその製造法
US5425647A (en) 1992-04-29 1995-06-20 Alliedsignal Inc. Split conductive pad for mounting components to a circuit board
US5163605A (en) 1992-04-30 1992-11-17 Allied-Signal Inc. Method for mounting components to a circuit board
US5453581A (en) * 1993-08-30 1995-09-26 Motorola, Inc. Pad arrangement for surface mount components
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
EP0740340B1 (en) * 1995-04-07 2002-06-26 Shinko Electric Industries Co. Ltd. Structure and process for mounting semiconductor chip
US5759737A (en) * 1996-09-06 1998-06-02 International Business Machines Corporation Method of making a component carrier
IT1291779B1 (it) * 1997-02-17 1999-01-21 Magnetek Spa Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
JP3367886B2 (ja) * 1998-01-20 2003-01-20 株式会社村田製作所 電子回路装置
JP2000022316A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 印刷配線板及び印刷配線ユニットを内蔵した電子機器
JP3882500B2 (ja) * 2000-03-02 2007-02-14 株式会社村田製作所 厚膜絶縁組成物およびそれを用いたセラミック電子部品、ならびに電子装置
TW523857B (en) * 2001-12-06 2003-03-11 Siliconware Precision Industries Co Ltd Chip carrier configurable with passive components
US20050011672A1 (en) * 2003-07-17 2005-01-20 Alawani Ashish D. Overmolded MCM with increased surface mount component reliability

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2851151A1 (en) * 2013-09-20 2015-03-25 Alstom Technology Ltd Method of fixing through brazing heat resistant component on a surface of a heat exposed component
JP2015103782A (ja) * 2013-11-28 2015-06-04 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
TW200607422A (en) 2006-02-16
KR20060047725A (ko) 2006-05-18
CN1741715A (zh) 2006-03-01
US20080041620A1 (en) 2008-02-21
US20050247761A1 (en) 2005-11-10
EP1593450A1 (en) 2005-11-09

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