JP2005294781A - 有機物除去装置および膜厚測定装置 - Google Patents
有機物除去装置および膜厚測定装置 Download PDFInfo
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- JP2005294781A JP2005294781A JP2004122416A JP2004122416A JP2005294781A JP 2005294781 A JP2005294781 A JP 2005294781A JP 2004122416 A JP2004122416 A JP 2004122416A JP 2004122416 A JP2004122416 A JP 2004122416A JP 2005294781 A JP2005294781 A JP 2005294781A
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- substrate
- organic substance
- film thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/44—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of scythes or sickles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Sampling And Sample Adjustment (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】膜厚測定装置1の本体部には、基板9に付着した有機物を除去する有機物除去部3が設けられる。有機物除去部3は内部が清浄に保たれるチャンバ本体31を有し、チャンバ本体31内には基板を加熱するホットプレート32、基板を冷却するクーリングプレート33、チャンバ本体31の内部においてホットプレート32からクーリングプレート33へと基板9を移動する搬送アーム34が設けられる。これにより、基板9に付着した有機物を除去した後、冷却が完了するまでの間、基板9がチャンバ本体31の内部の清浄な雰囲気内にて保持され、有機物の再付着を抑制することができる。
【選択図】図3
Description
3,3a,3b,3c,3d 有機物除去部
4 制御ユニット
9 基板
23 エリプソメータ
25 搬送ロボット
31,31a,31b チャンバ本体
32 ホットプレート
33,33a,33b クーリングプレート
34 搬送アーム
35 センタリングユニット
36 基板待避機構
311,311a〜311c,312 開口
315,315a〜315c,316 ノズル部
318 排気管
S11〜S17 ステップ
S21〜S28 ステップ
Claims (12)
- 基板に付着した有機物を除去する有機物除去装置であって、
基板を加熱するホットプレートと、
前記基板を冷却するクーリングプレートと、
前記ホットプレートから前記クーリングプレートへと基板を移動する移動機構と、
前記ホットプレートおよび前記クーリングプレートが内部に配置され、前記ホットプレートから前記クーリングプレートに至る基板の移動経路も内部に含むチャンバ本体と、
を備えることを特徴とする有機物除去装置。 - 請求項1に記載の有機物除去装置であって、
前記ホットプレートおよび前記クーリングプレートが、水平姿勢にて水平方向に並んで配置されることを特徴とする有機物除去装置。 - 請求項1または2に記載の有機物除去装置であって、
前記移動機構が前記チャンバ本体の内部に配置されることを特徴とする有機物除去装置。 - 請求項3に記載の有機物除去装置であって、
前記チャンバ本体が基板が通過する開口を1つのみ有し、前記チャンバ本体に対して基板が搬入および搬出される際に前記基板が前記クーリングプレートに対して受け渡しされることを特徴とする有機物除去装置。 - 請求項1ないし3のいずれかに記載の有機物除去装置であって、
前記チャンバ本体が、
前記ホットプレートへと搬入される基板が通過する開口と、
前記クーリングプレートから搬出される基板が通過するもう1つの開口と、
を有することを特徴とする有機物除去装置。 - 請求項5に記載の有機物除去装置であって、
前記チャンバ本体が、前記もう1つの開口を通過する基板に向けてガスを噴出するノズル部をさらに有することを特徴とする有機物除去装置。 - 請求項1ないし3のいずれかに記載の有機物除去装置であって、
前記チャンバ本体が、
基板が通過する開口と、
前記開口が形成される面に沿ってガスを噴出するノズル部と、
を有することを特徴とする有機物除去装置。 - 請求項1ないし7のいずれかに記載の有機物除去装置であって、
前記チャンバ本体の内部において、前記クーリングプレートから基板を受け取って待避させる基板待避機構をさらに備えることを特徴とする有機物除去装置。 - 請求項1ないし8のいずれかに記載の有機物除去装置であって、
前記チャンバ本体の内部のガスを排気する機構をさらに備えることを特徴とする有機物除去装置。 - 基板上に形成された薄膜の厚さを測定する膜厚測定装置であって、
基板に付着した有機物を除去する請求項1ないし9のいずれかに記載の有機物除去装置と、
前記有機物除去装置による除去処理後の基板の膜厚を測定する膜厚測定部と、
を備えることを特徴とする膜厚測定装置。 - 請求項10に記載の膜厚測定装置であって、
前記膜厚測定部がエリプソメータを有することを特徴とする膜厚測定装置。 - 請求項10または11に記載の膜厚測定装置であって、
前記有機物除去装置の前記クーリングプレートが、基板の位置を調整する機構を有することを特徴とする膜厚測定装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004122416A JP4270457B2 (ja) | 2004-03-10 | 2004-04-19 | 有機物除去装置および膜厚測定装置 |
US11/069,995 US20050198857A1 (en) | 2004-03-10 | 2005-03-03 | Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate |
TW094106752A TWI271810B (en) | 2004-03-10 | 2005-03-07 | Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate |
KR1020050020053A KR100651018B1 (ko) | 2004-03-10 | 2005-03-10 | 기판에 흡착된 유기물을 제거하는 장치와 방법, 및 기판 상에 형성된 박막의 두께를 측정하는 장치와 방법 |
CNA2005100543460A CN1691274A (zh) | 2004-03-10 | 2005-03-10 | 去除基板上有机污染物的装置和方法与测量基板上薄膜厚度的装置和方法 |
US12/219,094 US20090019722A1 (en) | 2004-03-10 | 2008-07-16 | Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004066528 | 2004-03-10 | ||
JP2004122416A JP4270457B2 (ja) | 2004-03-10 | 2004-04-19 | 有機物除去装置および膜厚測定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005294781A true JP2005294781A (ja) | 2005-10-20 |
JP4270457B2 JP4270457B2 (ja) | 2009-06-03 |
Family
ID=34921748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004122416A Expired - Fee Related JP4270457B2 (ja) | 2004-03-10 | 2004-04-19 | 有機物除去装置および膜厚測定装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20050198857A1 (ja) |
JP (1) | JP4270457B2 (ja) |
KR (1) | KR100651018B1 (ja) |
CN (1) | CN1691274A (ja) |
TW (1) | TWI271810B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100847582B1 (ko) | 2007-06-26 | 2008-07-21 | 세크론 주식회사 | 반도체소자 이송시스템 및 이를 이용하는 반도체소자이송방법 |
KR100912459B1 (ko) | 2008-01-02 | 2009-08-14 | 한국표준과학연구원 | 박막 두께 측정방법 |
JP2015056669A (ja) * | 2013-09-12 | 2015-03-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 半導体ウエハ用のアニールモジュール |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5043021B2 (ja) * | 2005-10-04 | 2012-10-10 | アプライド マテリアルズ インコーポレイテッド | 基板を乾燥するための方法及び装置 |
JP4527670B2 (ja) | 2006-01-25 | 2010-08-18 | 東京エレクトロン株式会社 | 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体 |
JP5109376B2 (ja) | 2007-01-22 | 2012-12-26 | 東京エレクトロン株式会社 | 加熱装置、加熱方法及び記憶媒体 |
KR101314540B1 (ko) | 2012-05-04 | 2013-10-04 | (주) 씨앤아이테크놀로지 | 열교환 플레이트가 구비된 기판 회전용 플립 챔버 및 그 구동방법 |
JP6009832B2 (ja) * | 2012-06-18 | 2016-10-19 | 株式会社Screenホールディングス | 基板処理装置 |
US10629854B2 (en) * | 2017-08-18 | 2020-04-21 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Substrate pre-baking device |
JP6899314B2 (ja) | 2017-11-17 | 2021-07-07 | 浜松ホトニクス株式会社 | 吸着方法 |
US11194259B2 (en) * | 2018-08-30 | 2021-12-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Equipment module with enhanced protection from airborne contaminants, and method of operation |
KR102166269B1 (ko) * | 2019-04-03 | 2020-10-15 | (주)에스티아이 | 기판처리장치 및 기판처리방법 |
US11127588B2 (en) | 2019-04-12 | 2021-09-21 | Micron Technology, Inc. | Semiconductor processing applying supercritical drying |
TWI721729B (zh) * | 2019-12-25 | 2021-03-11 | 佳宸科技有限公司 | 晶圓傳送盒清洗設備及系統 |
CN113130347A (zh) * | 2019-12-31 | 2021-07-16 | 佳宸科技有限公司 | 晶圆传送盒清洗设备及系统 |
CN111781115B (zh) * | 2020-07-10 | 2022-08-02 | 上海市计量测试技术研究院 | 一种空气污染物滤膜称量设备及称量方法 |
CN116423309B (zh) * | 2023-04-04 | 2023-12-22 | 张家港扬子江冷轧板有限公司 | 一种轧辊磨削机 |
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JPH08153666A (ja) * | 1994-11-30 | 1996-06-11 | Hitachi Ltd | 有機物除去装置 |
JP3298785B2 (ja) * | 1996-03-25 | 2002-07-08 | 三菱電機株式会社 | 半導体製造装置および発塵評価方法 |
JP3559139B2 (ja) * | 1997-03-21 | 2004-08-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6325078B2 (en) * | 1998-01-07 | 2001-12-04 | Qc Solutions, Inc., | Apparatus and method for rapid photo-thermal surface treatment |
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JP2004515918A (ja) * | 2000-12-04 | 2004-05-27 | 株式会社荏原製作所 | 基板処理装置及びその方法 |
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JP2004519557A (ja) * | 2001-02-23 | 2004-07-02 | 株式会社荏原製作所 | 銅めっき液、めっき方法及びめっき装置 |
CN1329972C (zh) * | 2001-08-13 | 2007-08-01 | 株式会社荏原制作所 | 半导体器件及其制造方法 |
JP2003142427A (ja) * | 2001-11-06 | 2003-05-16 | Ebara Corp | めっき液、半導体装置及びその製造方法 |
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-
2004
- 2004-04-19 JP JP2004122416A patent/JP4270457B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-03 US US11/069,995 patent/US20050198857A1/en not_active Abandoned
- 2005-03-07 TW TW094106752A patent/TWI271810B/zh not_active IP Right Cessation
- 2005-03-10 CN CNA2005100543460A patent/CN1691274A/zh active Pending
- 2005-03-10 KR KR1020050020053A patent/KR100651018B1/ko not_active IP Right Cessation
-
2008
- 2008-07-16 US US12/219,094 patent/US20090019722A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100847582B1 (ko) | 2007-06-26 | 2008-07-21 | 세크론 주식회사 | 반도체소자 이송시스템 및 이를 이용하는 반도체소자이송방법 |
KR100912459B1 (ko) | 2008-01-02 | 2009-08-14 | 한국표준과학연구원 | 박막 두께 측정방법 |
JP2015056669A (ja) * | 2013-09-12 | 2015-03-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 半導体ウエハ用のアニールモジュール |
Also Published As
Publication number | Publication date |
---|---|
TWI271810B (en) | 2007-01-21 |
US20090019722A1 (en) | 2009-01-22 |
KR100651018B1 (ko) | 2006-11-29 |
CN1691274A (zh) | 2005-11-02 |
TW200537635A (en) | 2005-11-16 |
KR20060043824A (ko) | 2006-05-15 |
US20050198857A1 (en) | 2005-09-15 |
JP4270457B2 (ja) | 2009-06-03 |
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