JP2005194630A - 堆積プロセスにおける副産物の揮発度を維持する方法及び装置 - Google Patents
堆積プロセスにおける副産物の揮発度を維持する方法及び装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
- H01J37/32844—Treating effluent gases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
【解決手段】プロセス副産物を揮発性に保ち、ポンプ及びシステム供給ライン中の望ましくない副産物堆積を防ぐかまたは実質的に無くすような、また、ポンプ及び供給ライン内部の表面に形成されることがある任意の堆積物を再揮発するような様式で、フッ素を含むガスを、ポンプ送圧システム、またはポンプ送圧及び低減システム中に注入する。
【選択図】図1
Description
11 バッキングポンプ
12 包囲体
13 パイプ
14 排気ガス低減システム
15 設備酸廃棄物処理システム
16 設備排気ダクト
17 キャビネット抽出システム
18 フォアライン
21 フッ素ガス
22 HF回収システム
23 フィードバックループ
201 プラズマ発生器
202 フッ素発生器
203 F2瓶
204 分配マニホルド
205 熱分解装置
Claims (32)
- 薄膜を基板の上に堆積する方法であって:
反応チャンバを含む堆積装置を用意し、該チャンバは入口及びフォアラインと連通している排気口を有し、該フォアラインはポンプと連通している工程と;
前記チャンバに基板を用意する工程と;
前記基板の上に堆積する成分を前記チャンバに導入する工程と;
前記成分を前記基板の上に堆積する工程と;
フッ素含有成分を前記フォアラインに導入する工程と;
を含む方法。 - 前記フッ素含有成分は、フッ素及びフッ素ラジカルからなる群から選択される、請求項1に記載の方法。
- 前記フッ素含有成分は、フッ素容器、フッ素発生器、及びフッ素プラズマ発生器からなる群から選択されるフッ素源装置から供給される、請求項1に記載の方法。
- 前記フッ素含有成分は、F2、NF3、C2F6、SF6及びClF3からなる群から選択されるフッ素前駆体から発生する、請求項1に記載の方法。
- 前記フッ素含有成分は前記ポンプに導入される、請求項1に記載の方法。
- 前記フッ素含有成分は前記ポンプとブースターとの間の前記フォアラインに導入される、請求項1に記載の方法。
- 前記フッ素含有成分は前記ポンプの上流の前記フォアラインに導入される、請求項1に記載の方法。
- 前記基板は集積回路である、請求項1に記載の方法。
- 前記基板はウェーハである、請求項1に記載の方法。
- 前記成分は、レニウム含有化合物、モリブデン含有化合物、チタン含有化合物及びタングステン含有化合物からなる群から選択される材料を含む、請求項1に記載の方法。
- 前記成分はアンモニア含有化合物を含む、請求項1に記載の方法。
- 前記成分を予め定められた量で第1の流れ中に供給し、その結果該第1の流れの一部分は未反応のままであり、前記排気口から前記チャンバを出るようにする工程と;
前記フォアライン中で前記第1の流れの未反応の部分と前記フッ素含有成分とを接触させる工程と;
前記第1の流れ及び前記フッ素含有成分の反応から副産物を生成する工程と;
をさらに含む、請求項1に記載の方法。 - 前記副産物は精製される、請求項12に記載の方法。
- 前記副産物はHFまたはNF3である、請求項12に記載の方法。
- 前記副産物は、堆積プロセスにおいて使用するためにリサイクルされる、請求項12に記載の方法。
- 前記副産物は貯蔵される、請求項12に記載の方法。
- 化学気相成長及び原子レベル堆積からなる群から堆積方法が選択される、請求項1に記載の方法。
- 薄膜を基板の上に堆積する装置であって:
反応チャンバであって、該チャンバは入口及びフォアラインと連通している排気口を有し、該フォアラインはポンプと連通している反応チャンバと;
第1の流れを前記チャンバに供給するための、前記入口と連通している第1の流れ源と;
第2の流れを前記フォアラインに供給するための、前記フォアラインと連通している第2の流れ源であって、前記第2の流れはフッ素含有化合物を含む第2の流れ源と;
前記第2の流れがある量の前記第1の流れと反応するのに十分な量で前記フォアラインに供給されるように前記第1の流れ及び前記第2の流れを調節するための手段と;
を含む装置。 - 前記フッ素含有成分は、フッ素及びフッ素ラジカルからなる群から選択される、請求項18に記載の装置。
- 前記第2の流れ源は、フッ素容器、フッ素発生器、及びフッ素プラズマ発生器からなる群から選択される、請求項18に記載の装置。
- 前記フッ素含有化合物は、F2、NF3、C2F6、SF6及びClF3からなる群から選択されるフッ素前駆体から発生する、請求項18に記載の装置。
- 前記第2の流れは前記ポンプに導入される、請求項18に記載の装置。
- 前記ポンプの上流の前記フォアラインと連通しているブースターをさらに含み、前記第2の流れは前記ポンプと前記ブースターとの間の前記フォアラインに導入される、請求項18に記載の装置。
- 前記第2の流れは前記ポンプの上流の前記フォアラインに導入される、請求項18に記載の装置。
- 前記第1の流れは、レニウム含有化合物、モリブデン含有化合物、チタン含有化合物及びタングステン含有化合物からなる群から選択される材料を含む、請求項18に記載の装置。
- 前記第1の流れはアンモニア含有化合物を含む、請求項18に記載の装置。
- 前記装置は、化学気相成長装置及び原子レベル堆積装置からなる群から選択される、請求項18に記載の装置。
- 前記第1の流れ及び前記第2の流れは反応して副産物を形成する、請求項18に記載の装置。
- 前記副産物は精製される、請求項28に記載の装置。
- 前記副産物はHFまたはNF3である、請求項28に記載の装置。
- 前記副産物を前記フォアラインに向かわせるためのリサイクルループをさらに含む、請求項28に記載の装置。
- 前記副産物のための貯蔵チャンバをさらに含む、請求項28に記載の装置。
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US53361503P | 2003-12-31 | 2003-12-31 | |
US60/533615 | 2003-12-31 | ||
US11/018,641 US20050250347A1 (en) | 2003-12-31 | 2004-12-21 | Method and apparatus for maintaining by-product volatility in deposition process |
US11/018641 | 2004-12-21 |
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JP2005194630A true JP2005194630A (ja) | 2005-07-21 |
JP5031189B2 JP5031189B2 (ja) | 2012-09-19 |
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JP2004378477A Active JP5031189B2 (ja) | 2003-12-31 | 2004-12-28 | 堆積プロセスにおける副産物の揮発度を維持する方法及び装置 |
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US (1) | US20050250347A1 (ja) |
EP (1) | EP1560252B1 (ja) |
JP (1) | JP5031189B2 (ja) |
KR (1) | KR101216927B1 (ja) |
CN (1) | CN100537844C (ja) |
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- 2004-12-28 JP JP2004378477A patent/JP5031189B2/ja active Active
- 2004-12-31 CN CNB2004100818863A patent/CN100537844C/zh active Active
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JP6718566B1 (ja) * | 2019-06-27 | 2020-07-08 | カンケンテクノ株式会社 | 排ガス除害ユニット |
Also Published As
Publication number | Publication date |
---|---|
US20050250347A1 (en) | 2005-11-10 |
KR101216927B1 (ko) | 2012-12-31 |
CN100537844C (zh) | 2009-09-09 |
CN1676666A (zh) | 2005-10-05 |
EP1560252A2 (en) | 2005-08-03 |
JP5031189B2 (ja) | 2012-09-19 |
EP1560252B1 (en) | 2016-03-09 |
KR20050071361A (ko) | 2005-07-07 |
EP1560252A3 (en) | 2006-03-29 |
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