JP2005191025A - ワイヤボンディング構造 - Google Patents
ワイヤボンディング構造 Download PDFInfo
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- JP2005191025A JP2005191025A JP2003426718A JP2003426718A JP2005191025A JP 2005191025 A JP2005191025 A JP 2005191025A JP 2003426718 A JP2003426718 A JP 2003426718A JP 2003426718 A JP2003426718 A JP 2003426718A JP 2005191025 A JP2005191025 A JP 2005191025A
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48491—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
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- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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Abstract
【解決手段】基板10のランド11にボンディングパッド14を半田付けし、このボンディングパッド14にボンディングワイヤ15をボンディングしたワイヤボンディング構造において、ランド11に半田13を十字状に塗布し、この十字状の半田13にボンディングパッド14を半田付けし、このボンディングパッド14にボンディングワイヤ15の先端部15aをボンディングした。
【選択図】図1
Description
11 ランド
13 半田
14 ボンディングパッド
15 ボンディングワイヤ
15a 先端部
Claims (2)
- 基板のランドにボンディングパッドを半田付けし、このボンディングパッドにボンディングワイヤをボンディングしたワイヤボンディング構造において、
前記ランドに半田を十字状に塗布し、この十字状の半田に前記ボンディングパッドを半田付けし、このボンディングパッドに前記ボンディングワイヤの先端部をボンディングしたことを特徴とするワイヤボンディング構造。 - 請求項1記載のワイヤボンディング構造において、
前記ランドを円形状に形成すると共に、前記ボンディングパッドを該円形状のランドと同径の円板状に形成し、前記円形状のランドの中央より外周縁に向けて前記半田を十字状に塗布したことを特徴とするワイヤボンディング構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003426718A JP4039674B2 (ja) | 2003-12-24 | 2003-12-24 | ワイヤボンディングの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003426718A JP4039674B2 (ja) | 2003-12-24 | 2003-12-24 | ワイヤボンディングの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005191025A true JP2005191025A (ja) | 2005-07-14 |
JP4039674B2 JP4039674B2 (ja) | 2008-01-30 |
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ID=34786165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003426718A Expired - Fee Related JP4039674B2 (ja) | 2003-12-24 | 2003-12-24 | ワイヤボンディングの製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4039674B2 (ja) |
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2003
- 2003-12-24 JP JP2003426718A patent/JP4039674B2/ja not_active Expired - Fee Related
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JP4039674B2 (ja) | 2008-01-30 |
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