JP2005175495A - 半導体構造およびその製造方法 - Google Patents
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Abstract
【解決手段】 この製造方法は、基板にシャロー・トレンチ・アイソレーション(STI)を形成するステップと、基板上に第1の物質および第2の物質を設けるステップとを含む。第1の物質および第2の物質は、pFET領域およびnFET領域に、それぞれ第1のアイランドおよび第2のアイランドを形成する。finFETを形成する前に、第1および第2のアイランド層上に、伸張性ハードマスクを形成する。ハードマスクを有するfinFETの側壁に、Siエピタキシャル層を成長させる。ハードマスクは、キャッピング層となり、張力のもとにあって、nFETfinの横方向の湾曲を防ぐ。
【選択図】 図13
Description
オオツカ(Ootsuka)等のIEDM2000、p575 Ernst等のVLSI Symp.2002年、p92
Claims (20)
- 半導体構造を製造する方法であって、
第1の格子定数を有する物質の第1のアイランドを形成するステップと、
第2の格子定数を有する物質の第2のアイランドを形成するステップと、
前記第1のアイランドおよび前記第2のアイランドの上に、伸張性キャッピング層を形成するために用いるマスクを設けるステップと、
前記第1のアイランドおよび前記第2のアイランドから少なくとも第1のfinFETおよび第2のfinFETを形成するステップと、
を備え、前記伸張性キャッピング層は前記第1および第2のfinFETの一方の湾曲を防ぐことを特徴とする、方法。 - 前記第1のアイランドはSiGe物質から成り、前記第2のアイランドはSi:C物質から成り、前記マスクは窒化物ハードマスクであることを特徴とする、請求項1に記載の方法。
- 前記第1のおよび第2のfinFETは側壁像転送およびエッチングによって形成されることを特徴とする、請求項1に記載の方法。
- 前記第1のfinFETおよび前記第2のfinFETの側壁にSiエピタキシャル側壁層を選択的に成長させるステップを更に備え、前記伸張性キャッピング層は、前記Siエピタキシャル側壁層の成長の間、少なくとも前記第2のfinFETの湾曲を防ぐことを特徴とする、請求項1に記載の方法。
- エッチングによって、前記第1および第2のfinFET上の前記ハードマスクから前記伸張性キャッピング層を形成し、
前記第1のfinFETはSiGeから成り、引張応力のもとに置かれ、
前記第2のfinFETはSi:Cから成り、圧縮応力のもとに置かれることを特徴とする、請求項1に記載の方法。 - 前記伸張性キャッピング層は前記Si:CfinFETの崩壊または湾曲を防ぐことを特徴とする、請求項5に記載の方法。
- 基板にシャロー・トレンチ・アイソレーション(STI)を形成するステップと、
pFET領域およびnFET領域においてそれぞれ熱アニーリング・プロセスによって前記第1のアイランドおよび前記第2のアイランドを形成するために前記基板内に物質を混合するステップと、
を更に備え、前記STIは、前記第1のアイランドおよび前記第2のアイランドを緩和させ、それらの緩和を容易にすることを特徴とする、請求項1に記載の方法。 - 前記第1のアイランドは、Ge物質の堆積又は成長のいずれか一方によって形成され、前記第2のアイランドは、Si:CまたはC物質の堆積又は成長のいずれか一方によって形成され、前記第1のアイランドおよび前記第2のアイランドは、異なる緩和結晶格子を有することを特徴とする、請求項1に記載の方法。
- 前記Siエピタキシャル側壁層は前記第1の物質および前記第2の物質とは異なる格子定数を有し、前記選択的に成長させたSiエピタキシャル側壁層が前記第1のアイランドおよび前記第2のアイランドをそれぞれ引張および圧縮により歪ませるようになっていることを特徴とする、請求項4に記載の方法。
- 前記第1のfinFETはa−Si以上の格子定数を有し、前記第2のfinFETはa−Si以下の格子定数を有することを特徴とする、請求項4に記載の方法。
- 前記第1のアイランドは実質的にSiGeから成り、前記第2のアイランドはSi:Cから成り、前記SiGeアイランドおよび前記Si:Cアイランドからそれぞれ形成されたエッチングSiGefinFETおよびSi:CfinFET上に側壁層をエピタキシャル成長させ、前記SiGeおよびSi:CfinFETに対して前記エピタキシャル成長側壁層の格子を一致させるために、前記SiGefinFETおよび前記Si:CfinFETはそれぞれ引張応力および圧縮応力のもとに置かれることを特徴とする、請求項1に記載の方法。
- 半導体構造を製造する方法であって、
第1の物質によって基板にシャロー・トレンチ・アイソレーション(STI)を形成するステップと、
pFET領域に関連した第1のアイランドおよびnFET領域に関連した第2のアイランドを形成するステップと、
前記pFET領域および前記nFET領域上に引張応力のもとでハードマスクを設けるステップと、
前記pFET領域および前記nFET領域においてそれぞれ前記ハードマスクのキャッピング層を用いてpFETfinおよびnFETfinを形成するステップと、
前記pFETfinおよび前記nFETfin上に側壁を成長させ、前記キャッピング層が側壁成長の間の前記nFETの湾曲を防ぐ、ステップと、
を備えることを特徴とする方法。 - 前記pFETフィンはSiGeから成る物質から形成され、前記nFETはSi:CまたはCのいずれか一方から成る物質から形成されることを特徴とする、請求項12に記載の方法。
- 前記SiGeは引張により歪み、前記Si:Cは圧縮により歪み、前記ハードマスクは、側壁形成による圧縮応力に逆らうことによって前記nFETの湾曲を防ぐことを特徴とする、請求項13に記載の方法。
- 前記STIを緩和するステップを更に備え、前記STIは、熱アニーリング・ステップの間に前記第1のアイランドおよび前記第2のアイランドの緩和を容易にすることを特徴とする、請求項12に記載の方法。
- 前記側壁はSiから成り、該Siは、前記pFETおよび前記nFETとは異なる格子定数を有し、前記Si側壁が前記pFETおよび前記nFETにそれぞれ引張および圧縮により応力を加えるようになっていることを特徴とする、請求項12に記載の方法。
- 半導体構造であって、
基板と、
前記基板内の緩和シャロー・トレンチ・アイソレーション(STI)と、
第1の格子定数を有する第1の物質から成る第1のfinFETおよび高い伸張性の物質のキャップと、
第2の格子定数を有する第2の物質から成る第2のfinFETおよび高い伸張性の物質のキャップと、
前記第1のfinFETおよび前記第2のfinFET上にSiのエピタキシャル成長させた側壁と、
を備え、前記第2のfinFET上の前記高い伸張性の物質のキャップは、前記Siエピタキシャル側壁が成長する際に前記第2のfinFETの横方向の湾曲を防ぐことを特徴とする、半導体構造。 - 前記第1の物質は緩和SiGeであり、前記第2の物質は緩和Si:Cであることを特徴とする、請求項17に記載の半導体構造。
- 前記キャップは窒化物から成ることを特徴とする、請求項17に記載の半導体構造。
- 前記STIは緩和されており、前記第1のfinFETは引張応力のもとにあり、前記第2のfinFETは圧縮応力のもとにあることを特徴とする、請求項17に記載の半導体構造。
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US10/733,378 US7198995B2 (en) | 2003-12-12 | 2003-12-12 | Strained finFETs and method of manufacture |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101393917B1 (ko) * | 2012-05-16 | 2014-05-12 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | Cmos 디바이스 및 그 형성 방법 |
US9768304B2 (en) | 2006-11-20 | 2017-09-19 | Globalfoundries Inc. | Method of fabricating a FINFET having a gate structure disposed at least partially at a bend region of the semiconductor fin |
TWI713086B (zh) * | 2018-07-16 | 2020-12-11 | 台灣積體電路製造股份有限公司 | 積體電路結構的形成方法和半導體結構 |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7247534B2 (en) * | 2003-11-19 | 2007-07-24 | International Business Machines Corporation | Silicon device on Si:C-OI and SGOI and method of manufacture |
US7393733B2 (en) | 2004-12-01 | 2008-07-01 | Amberwave Systems Corporation | Methods of forming hybrid fin field-effect transistor structures |
US8324660B2 (en) | 2005-05-17 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
US9153645B2 (en) | 2005-05-17 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
US7532501B2 (en) * | 2005-06-02 | 2009-05-12 | International Business Machines Corporation | Semiconductor device including back-gated transistors and method of fabricating the device |
US20070018239A1 (en) * | 2005-07-20 | 2007-01-25 | International Business Machines Corporation | Sea-of-fins structure on a semiconductor substrate and method of fabrication |
US7655511B2 (en) | 2005-11-03 | 2010-02-02 | International Business Machines Corporation | Gate electrode stress control for finFET performance enhancement |
US7510939B2 (en) * | 2006-01-31 | 2009-03-31 | International Business Machines Corporation | Microelectronic structure by selective deposition |
WO2007112066A2 (en) | 2006-03-24 | 2007-10-04 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures and related methods for device fabrication |
US7365401B2 (en) * | 2006-03-28 | 2008-04-29 | International Business Machines Corporation | Dual-plane complementary metal oxide semiconductor |
US20070238267A1 (en) * | 2006-03-28 | 2007-10-11 | International Business Machines Corporation | Epitaxy of Silicon-Carbon Substitutional Solid Solutions by Ultra-Fast Annealing of Amorphous Material |
US7681628B2 (en) * | 2006-04-12 | 2010-03-23 | International Business Machines Corporation | Dynamic control of back gate bias in a FinFET SRAM cell |
US8227316B2 (en) * | 2006-06-29 | 2012-07-24 | International Business Machines Corporation | Method for manufacturing double gate finFET with asymmetric halo |
US7462916B2 (en) * | 2006-07-19 | 2008-12-09 | International Business Machines Corporation | Semiconductor devices having torsional stresses |
US7462522B2 (en) * | 2006-08-30 | 2008-12-09 | International Business Machines Corporation | Method and structure for improving device performance variation in dual stress liner technology |
JP2008060408A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体装置 |
US8173551B2 (en) | 2006-09-07 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Defect reduction using aspect ratio trapping |
WO2008039534A2 (en) | 2006-09-27 | 2008-04-03 | Amberwave Systems Corporation | Quantum tunneling devices and circuits with lattice- mismatched semiconductor structures |
WO2008039495A1 (en) * | 2006-09-27 | 2008-04-03 | Amberwave Systems Corporation | Tri-gate field-effect transistors formed by aspect ratio trapping |
US8502263B2 (en) | 2006-10-19 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-emitter-based devices with lattice-mismatched semiconductor structures |
US8217423B2 (en) | 2007-01-04 | 2012-07-10 | International Business Machines Corporation | Structure and method for mobility enhanced MOSFETs with unalloyed silicide |
US7772048B2 (en) * | 2007-02-23 | 2010-08-10 | Freescale Semiconductor, Inc. | Forming semiconductor fins using a sacrificial fin |
US7485519B2 (en) * | 2007-03-30 | 2009-02-03 | International Business Machines Corporation | After gate fabrication of field effect transistor having tensile and compressive regions |
US7825328B2 (en) | 2007-04-09 | 2010-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitride-based multi-junction solar cell modules and methods for making the same |
US8237151B2 (en) | 2009-01-09 | 2012-08-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diode-based devices and methods for making the same |
US8304805B2 (en) | 2009-01-09 | 2012-11-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor diodes fabricated by aspect ratio trapping with coalesced films |
US9508890B2 (en) | 2007-04-09 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photovoltaics on silicon |
US8329541B2 (en) | 2007-06-15 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | InP-based transistor fabrication |
US8877576B2 (en) * | 2007-08-23 | 2014-11-04 | Infineon Technologies Ag | Integrated circuit including a first channel and a second channel |
CN101884117B (zh) | 2007-09-07 | 2013-10-02 | 台湾积体电路制造股份有限公司 | 多结太阳能电池 |
US7678637B2 (en) * | 2007-09-21 | 2010-03-16 | Texas Instruments Incorporated | CMOS fabrication process |
US7767560B2 (en) * | 2007-09-29 | 2010-08-03 | Intel Corporation | Three dimensional strained quantum wells and three dimensional strained surface channels by Ge confinement method |
US8183667B2 (en) | 2008-06-03 | 2012-05-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Epitaxial growth of crystalline material |
US8274097B2 (en) | 2008-07-01 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reduction of edge effects from aspect ratio trapping |
US8981427B2 (en) | 2008-07-15 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing of small composite semiconductor materials |
CN102160145B (zh) | 2008-09-19 | 2013-08-21 | 台湾积体电路制造股份有限公司 | 通过外延层过成长的元件形成 |
US20100072515A1 (en) | 2008-09-19 | 2010-03-25 | Amberwave Systems Corporation | Fabrication and structures of crystalline material |
US8253211B2 (en) | 2008-09-24 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor sensor structures with reduced dislocation defect densities |
JP2010118621A (ja) * | 2008-11-14 | 2010-05-27 | Nec Electronics Corp | 半導体装置及びその製造方法 |
US8058692B2 (en) | 2008-12-29 | 2011-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple-gate transistors with reverse T-shaped fins |
JP5705207B2 (ja) | 2009-04-02 | 2015-04-22 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | 結晶物質の非極性面から形成される装置とその製作方法 |
US9768305B2 (en) * | 2009-05-29 | 2017-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gradient ternary or quaternary multiple-gate transistor |
JP5166458B2 (ja) | 2010-01-22 | 2013-03-21 | 株式会社東芝 | 半導体装置及びその製造方法 |
US8551845B2 (en) | 2010-09-21 | 2013-10-08 | International Business Machines Corporation | Structure and method for increasing strain in a device |
US20120146101A1 (en) * | 2010-12-13 | 2012-06-14 | Chun-Hsien Lin | Multi-gate transistor devices and manufacturing method thereof |
CN103065963B (zh) * | 2011-10-19 | 2015-08-05 | 中芯国际集成电路制造(上海)有限公司 | 鳍式晶体管及其形成方法 |
US9048136B2 (en) | 2011-10-26 | 2015-06-02 | GlobalFoundries, Inc. | SRAM cell with individual electrical device threshold control |
US9029956B2 (en) | 2011-10-26 | 2015-05-12 | Global Foundries, Inc. | SRAM cell with individual electrical device threshold control |
CN103107192B (zh) * | 2011-11-10 | 2016-05-18 | 中芯国际集成电路制造(北京)有限公司 | 半导体装置及其制造方法 |
CN103107187B (zh) * | 2011-11-10 | 2016-04-13 | 中芯国际集成电路制造(北京)有限公司 | 半导体装置的制造方法 |
CN103165455B (zh) * | 2011-12-13 | 2015-09-09 | 中芯国际集成电路制造(上海)有限公司 | 制作鳍形场效应晶体管的方法 |
US20130200459A1 (en) * | 2012-02-02 | 2013-08-08 | International Business Machines Corporation | Strained channel for depleted channel semiconductor devices |
US8697523B2 (en) | 2012-02-06 | 2014-04-15 | International Business Machines Corporation | Integration of SMT in replacement gate FINFET process flow |
CN103367253B (zh) * | 2012-03-29 | 2015-03-11 | 中芯国际集成电路制造(上海)有限公司 | 鳍式场效应管的形成方法 |
US8853750B2 (en) | 2012-04-27 | 2014-10-07 | International Business Machines Corporation | FinFET with enhanced embedded stressor |
US9142400B1 (en) | 2012-07-17 | 2015-09-22 | Stc.Unm | Method of making a heteroepitaxial layer on a seed area |
US9564367B2 (en) * | 2012-09-13 | 2017-02-07 | Globalfoundries Inc. | Methods of forming different FinFET devices with different threshold voltages and integrated circuit products containing such devices |
US8889495B2 (en) | 2012-10-04 | 2014-11-18 | International Business Machines Corporation | Semiconductor alloy fin field effect transistor |
US8815668B2 (en) | 2012-12-07 | 2014-08-26 | International Business Machines Corporation | Preventing FIN erosion and limiting Epi overburden in FinFET structures by composite hardmask |
US9029835B2 (en) | 2012-12-20 | 2015-05-12 | Intel Corporation | Epitaxial film on nanoscale structure |
US9184233B2 (en) * | 2013-02-27 | 2015-11-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for defect passivation to reduce junction leakage for finFET device |
US8933528B2 (en) * | 2013-03-11 | 2015-01-13 | International Business Machines Corporation | Semiconductor fin isolation by a well trapping fin portion |
US8829606B1 (en) * | 2013-03-13 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ditches near semiconductor fins and methods for forming the same |
US8841178B1 (en) | 2013-03-13 | 2014-09-23 | International Business Machines Corporation | Strained silicon nFET and silicon germanium pFET on same wafer |
US8951870B2 (en) * | 2013-03-14 | 2015-02-10 | International Business Machines Corporation | Forming strained and relaxed silicon and silicon germanium fins on the same wafer |
US9040363B2 (en) | 2013-03-20 | 2015-05-26 | International Business Machines Corporation | FinFET with reduced capacitance |
US8895395B1 (en) | 2013-06-06 | 2014-11-25 | International Business Machines Corporation | Reduced resistance SiGe FinFET devices and method of forming same |
US9093275B2 (en) * | 2013-10-22 | 2015-07-28 | International Business Machines Corporation | Multi-height multi-composition semiconductor fins |
US9165929B2 (en) | 2013-11-25 | 2015-10-20 | Qualcomm Incorporated | Complementarily strained FinFET structure |
US8987069B1 (en) | 2013-12-04 | 2015-03-24 | International Business Machines Corporation | Semiconductor substrate with multiple SiGe regions having different germanium concentrations by a single epitaxy process |
US9660035B2 (en) | 2014-01-29 | 2017-05-23 | International Business Machines Corporation | Semiconductor device including superlattice SiGe/Si fin structure |
US9123585B1 (en) | 2014-02-11 | 2015-09-01 | International Business Machines Corporation | Method to form group III-V and Si/Ge FINFET on insulator |
US9129863B2 (en) * | 2014-02-11 | 2015-09-08 | International Business Machines Corporation | Method to form dual channel group III-V and Si/Ge FINFET CMOS |
US9236474B2 (en) | 2014-02-21 | 2016-01-12 | Stmicroelectronics, Inc. | Method to form strained channel in thin box SOI structures by elastic strain relaxation of the substrate |
US9660080B2 (en) | 2014-02-28 | 2017-05-23 | Stmicroelectronics, Inc. | Multi-layer strained channel FinFET |
US9530777B2 (en) * | 2014-03-04 | 2016-12-27 | Stmicroelectronics, Inc. | FinFETs of different compositions formed on a same substrate |
US9293375B2 (en) | 2014-04-24 | 2016-03-22 | International Business Machines Corporation | Selectively grown self-aligned fins for deep isolation integration |
US20150340501A1 (en) * | 2014-05-22 | 2015-11-26 | Globalfoundries Inc. | Forming independent-gate finfet with tilted pre-amorphization implantation and resulting device |
US9536900B2 (en) * | 2014-05-22 | 2017-01-03 | Globalfoundries Inc. | Forming fins of different semiconductor materials on the same substrate |
US9570360B2 (en) | 2014-08-27 | 2017-02-14 | International Business Machines Corporation | Dual channel material for finFET for high performance CMOS |
US9362182B2 (en) | 2014-11-06 | 2016-06-07 | International Business Machines Corporation | Forming strained fins of different material on a substrate |
US9324623B1 (en) | 2014-11-26 | 2016-04-26 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor device having active fins |
US9508741B2 (en) | 2015-02-10 | 2016-11-29 | International Business Machines Corporation | CMOS structure on SSOI wafer |
US9401372B1 (en) | 2015-02-10 | 2016-07-26 | International Business Machines Corporation | Dual isolation on SSOI wafer |
US9484201B2 (en) | 2015-02-23 | 2016-11-01 | International Business Machines Corporation | Epitaxial silicon germanium fin formation using sacrificial silicon fin templates |
US9496185B2 (en) | 2015-03-27 | 2016-11-15 | International Business Machines Corporation | Dual channel finFET with relaxed pFET region |
US9607901B2 (en) | 2015-05-06 | 2017-03-28 | Stmicroelectronics, Inc. | Integrated tensile strained silicon NFET and compressive strained silicon-germanium PFET implemented in FINFET technology |
US9613871B2 (en) | 2015-07-16 | 2017-04-04 | Samsung Electronics Co., Ltd. | Semiconductor device and fabricating method thereof |
US9805991B2 (en) * | 2015-08-20 | 2017-10-31 | International Business Machines Corporation | Strained finFET device fabrication |
US9548386B1 (en) | 2015-08-31 | 2017-01-17 | International Business Machines Corporation | Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices |
US9431486B1 (en) | 2015-11-30 | 2016-08-30 | International Business Machines Corporation | Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices |
US9741581B2 (en) * | 2016-01-11 | 2017-08-22 | Globalfoundries Inc. | Using tensile mask to minimize buckling in substrate |
US9870948B2 (en) * | 2016-06-09 | 2018-01-16 | International Business Machines Corporation | Forming insulator fin structure in isolation region to support gate structures |
US9773870B1 (en) | 2016-06-28 | 2017-09-26 | International Business Machines Corporation | Strained semiconductor device |
US9859426B1 (en) | 2016-06-29 | 2018-01-02 | International Business Machines Corporation | Semiconductor device including optimized elastic strain buffer |
US9917154B2 (en) | 2016-06-29 | 2018-03-13 | International Business Machines Corporation | Strained and unstrained semiconductor device features formed on the same substrate |
WO2018063372A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Supperlatice channel included in a trench |
US10622352B2 (en) | 2017-01-25 | 2020-04-14 | International Business Machines Corporation | Fin cut to prevent replacement gate collapse on STI |
US10438855B2 (en) | 2017-02-17 | 2019-10-08 | International Business Machines Corporation | Dual channel FinFETs having uniform fin heights |
WO2019206844A1 (en) * | 2018-04-22 | 2019-10-31 | Epinovatech Ab | Reinforced thin-film device |
CN110571195B (zh) * | 2018-06-05 | 2021-12-21 | 中芯国际集成电路制造(上海)有限公司 | 一种sram及其制造方法和电子装置 |
US10886367B2 (en) | 2019-01-17 | 2021-01-05 | International Business Machines Corporation | Forming FinFET with reduced variability |
US11670551B2 (en) * | 2019-09-26 | 2023-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interface trap charge density reduction |
US10910276B1 (en) | 2019-10-01 | 2021-02-02 | Globalfoundries Inc. | STI structure with liner along lower portion of longitudinal sides of active region, and related FET and method |
US11257932B2 (en) * | 2020-01-30 | 2022-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin field effect transistor device structure and method for forming the same |
Family Cites Families (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US57184A (en) * | 1866-08-14 | Improved alloy | ||
US67035A (en) * | 1867-07-23 | Improvement in tunnels | ||
US86497A (en) * | 1869-02-02 | Improvement in machine for making cord | ||
US9784A (en) * | 1853-06-14 | Fergus burden | ||
US32261A (en) * | 1861-05-07 | Bukial-case | ||
US3602841A (en) | 1970-06-18 | 1971-08-31 | Ibm | High frequency bulk semiconductor amplifiers and oscillators |
US4853076A (en) | 1983-12-29 | 1989-08-01 | Massachusetts Institute Of Technology | Semiconductor thin films |
US4665415A (en) | 1985-04-24 | 1987-05-12 | International Business Machines Corporation | Semiconductor device with hole conduction via strained lattice |
ATE59917T1 (de) | 1985-09-13 | 1991-01-15 | Siemens Ag | Integrierte bipolar- und komplementaere mostransistoren auf einem gemeinsamen substrat enthaltende schaltung und verfahren zu ihrer herstellung. |
US4958213A (en) | 1987-12-07 | 1990-09-18 | Texas Instruments Incorporated | Method for forming a transistor base region under thick oxide |
US5354695A (en) | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
US5459346A (en) | 1988-06-28 | 1995-10-17 | Ricoh Co., Ltd. | Semiconductor substrate with electrical contact in groove |
US5006913A (en) | 1988-11-05 | 1991-04-09 | Mitsubishi Denki Kabushiki Kaisha | Stacked type semiconductor device |
US5108843A (en) | 1988-11-30 | 1992-04-28 | Ricoh Company, Ltd. | Thin film semiconductor and process for producing the same |
US4952524A (en) | 1989-05-05 | 1990-08-28 | At&T Bell Laboratories | Semiconductor device manufacture including trench formation |
US5310446A (en) | 1990-01-10 | 1994-05-10 | Ricoh Company, Ltd. | Method for producing semiconductor film |
US5060030A (en) | 1990-07-18 | 1991-10-22 | Raytheon Company | Pseudomorphic HEMT having strained compensation layer |
US5081513A (en) | 1991-02-28 | 1992-01-14 | Xerox Corporation | Electronic device with recovery layer proximate to active layer |
US5371399A (en) | 1991-06-14 | 1994-12-06 | International Business Machines Corporation | Compound semiconductor having metallic inclusions and devices fabricated therefrom |
US5134085A (en) | 1991-11-21 | 1992-07-28 | Micron Technology, Inc. | Reduced-mask, split-polysilicon CMOS process, incorporating stacked-capacitor cells, for fabricating multi-megabit dynamic random access memories |
US5391510A (en) | 1992-02-28 | 1995-02-21 | International Business Machines Corporation | Formation of self-aligned metal gate FETs using a benignant removable gate material during high temperature steps |
US6008126A (en) | 1992-04-08 | 1999-12-28 | Elm Technology Corporation | Membrane dielectric isolation IC fabrication |
US5561302A (en) | 1994-09-26 | 1996-10-01 | Motorola, Inc. | Enhanced mobility MOSFET device and method |
US5679965A (en) | 1995-03-29 | 1997-10-21 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same |
US5670798A (en) | 1995-03-29 | 1997-09-23 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same |
US5557122A (en) | 1995-05-12 | 1996-09-17 | Alliance Semiconductors Corporation | Semiconductor electrode having improved grain structure and oxide growth properties |
KR100213196B1 (ko) | 1996-03-15 | 1999-08-02 | 윤종용 | 트렌치 소자분리 |
US6403975B1 (en) | 1996-04-09 | 2002-06-11 | Max-Planck Gesellschaft Zur Forderung Der Wissenschafteneev | Semiconductor components, in particular photodetectors, light emitting diodes, optical modulators and waveguides with multilayer structures grown on silicon substrates |
US5880040A (en) | 1996-04-15 | 1999-03-09 | Macronix International Co., Ltd. | Gate dielectric based on oxynitride grown in N2 O and annealed in NO |
US5825529A (en) * | 1996-06-27 | 1998-10-20 | Xerox Corporation | Gyricon display with no elastomer substrate |
US5861651A (en) | 1997-02-28 | 1999-01-19 | Lucent Technologies Inc. | Field effect devices and capacitors with improved thin film dielectrics and method for making same |
US5940736A (en) | 1997-03-11 | 1999-08-17 | Lucent Technologies Inc. | Method for forming a high quality ultrathin gate oxide layer |
US6309975B1 (en) | 1997-03-14 | 2001-10-30 | Micron Technology, Inc. | Methods of making implanted structures |
US6025280A (en) | 1997-04-28 | 2000-02-15 | Lucent Technologies Inc. | Use of SiD4 for deposition of ultra thin and controllable oxides |
US5960297A (en) | 1997-07-02 | 1999-09-28 | Kabushiki Kaisha Toshiba | Shallow trench isolation structure and method of forming the same |
US5981356A (en) | 1997-07-28 | 1999-11-09 | Integrated Device Technology, Inc. | Isolation trenches with protected corners |
JP3139426B2 (ja) | 1997-10-15 | 2001-02-26 | 日本電気株式会社 | 半導体装置 |
US6066545A (en) | 1997-12-09 | 2000-05-23 | Texas Instruments Incorporated | Birdsbeak encroachment using combination of wet and dry etch for isolation nitride |
US6274421B1 (en) | 1998-01-09 | 2001-08-14 | Sharp Laboratories Of America, Inc. | Method of making metal gate sub-micron MOS transistor |
KR100275908B1 (ko) | 1998-03-02 | 2000-12-15 | 윤종용 | 집적 회로에 트렌치 아이솔레이션을 형성하는방법 |
US6165383A (en) | 1998-04-10 | 2000-12-26 | Organic Display Technology | Useful precursors for organic electroluminescent materials and devices made from such materials |
US6361885B1 (en) | 1998-04-10 | 2002-03-26 | Organic Display Technology | Organic electroluminescent materials and device made from such materials |
US5989978A (en) | 1998-07-16 | 1999-11-23 | Chartered Semiconductor Manufacturing, Ltd. | Shallow trench isolation of MOSFETS with reduced corner parasitic currents |
JP4592837B2 (ja) | 1998-07-31 | 2010-12-08 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US6319794B1 (en) | 1998-10-14 | 2001-11-20 | International Business Machines Corporation | Structure and method for producing low leakage isolation devices |
US6235598B1 (en) | 1998-11-13 | 2001-05-22 | Intel Corporation | Method of using thick first spacers to improve salicide resistance on polysilicon gates |
US6080637A (en) | 1998-12-07 | 2000-06-27 | Taiwan Semiconductor Manufacturing Company | Shallow trench isolation technology to eliminate a kink effect |
US6117722A (en) | 1999-02-18 | 2000-09-12 | Taiwan Semiconductor Manufacturing Company | SRAM layout for relaxing mechanical stress in shallow trench isolation technology and method of manufacture thereof |
US6255169B1 (en) | 1999-02-22 | 2001-07-03 | Advanced Micro Devices, Inc. | Process for fabricating a high-endurance non-volatile memory device |
US6093621A (en) | 1999-04-05 | 2000-07-25 | Vanguard International Semiconductor Corp. | Method of forming shallow trench isolation |
US6284626B1 (en) | 1999-04-06 | 2001-09-04 | Vantis Corporation | Angled nitrogen ion implantation for minimizing mechanical stress on side walls of an isolation trench |
US6228694B1 (en) | 1999-06-28 | 2001-05-08 | Intel Corporation | Method of increasing the mobility of MOS transistors by use of localized stress regions |
US6281532B1 (en) | 1999-06-28 | 2001-08-28 | Intel Corporation | Technique to obtain increased channel mobilities in NMOS transistors by gate electrode engineering |
US6362082B1 (en) | 1999-06-28 | 2002-03-26 | Intel Corporation | Methodology for control of short channel effects in MOS transistors |
US6656822B2 (en) | 1999-06-28 | 2003-12-02 | Intel Corporation | Method for reduced capacitance interconnect system using gaseous implants into the ILD |
KR100332108B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
TW426940B (en) | 1999-07-30 | 2001-03-21 | United Microelectronics Corp | Manufacturing method of MOS field effect transistor |
US6483171B1 (en) | 1999-08-13 | 2002-11-19 | Micron Technology, Inc. | Vertical sub-micron CMOS transistors on (110), (111), (311), (511), and higher order surfaces of bulk, SOI and thin film structures and method of forming same |
US6284623B1 (en) | 1999-10-25 | 2001-09-04 | Peng-Fei Zhang | Method of fabricating semiconductor devices using shallow trench isolation with reduced narrow channel effect |
US6476462B2 (en) | 1999-12-28 | 2002-11-05 | Texas Instruments Incorporated | MOS-type semiconductor device and method for making same |
US6221735B1 (en) | 2000-02-15 | 2001-04-24 | Philips Semiconductors, Inc. | Method for eliminating stress induced dislocations in CMOS devices |
US6531369B1 (en) | 2000-03-01 | 2003-03-11 | Applied Micro Circuits Corporation | Heterojunction bipolar transistor (HBT) fabrication using a selectively deposited silicon germanium (SiGe) |
US6368931B1 (en) | 2000-03-27 | 2002-04-09 | Intel Corporation | Thin tensile layers in shallow trench isolation and method of making same |
US6493497B1 (en) | 2000-09-26 | 2002-12-10 | Motorola, Inc. | Electro-optic structure and process for fabricating same |
US6413802B1 (en) * | 2000-10-23 | 2002-07-02 | The Regents Of The University Of California | Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture |
US6501121B1 (en) | 2000-11-15 | 2002-12-31 | Motorola, Inc. | Semiconductor structure |
US7312485B2 (en) | 2000-11-29 | 2007-12-25 | Intel Corporation | CMOS fabrication process utilizing special transistor orientation |
US6563152B2 (en) | 2000-12-29 | 2003-05-13 | Intel Corporation | Technique to obtain high mobility channels in MOS transistors by forming a strain layer on an underside of a channel |
US20020086497A1 (en) | 2000-12-30 | 2002-07-04 | Kwok Siang Ping | Beaker shape trench with nitride pull-back for STI |
US6265317B1 (en) | 2001-01-09 | 2001-07-24 | Taiwan Semiconductor Manufacturing Company | Top corner rounding for shallow trench isolation |
US6403486B1 (en) | 2001-04-30 | 2002-06-11 | Taiwan Semiconductor Manufacturing Company | Method for forming a shallow trench isolation |
US6583060B2 (en) | 2001-07-13 | 2003-06-24 | Micron Technology, Inc. | Dual depth trench isolation |
US6531740B2 (en) | 2001-07-17 | 2003-03-11 | Motorola, Inc. | Integrated impedance matching and stability network |
US6498358B1 (en) | 2001-07-20 | 2002-12-24 | Motorola, Inc. | Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating |
US6908810B2 (en) | 2001-08-08 | 2005-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of preventing threshold voltage of MOS transistor from being decreased by shallow trench isolation formation |
JP2003060076A (ja) | 2001-08-21 | 2003-02-28 | Nec Corp | 半導体装置及びその製造方法 |
EP1428262A2 (en) | 2001-09-21 | 2004-06-16 | Amberwave Systems Corporation | Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same |
US20030057184A1 (en) | 2001-09-22 | 2003-03-27 | Shiuh-Sheng Yu | Method for pull back SiN to increase rounding effect in a shallow trench isolation process |
US6656798B2 (en) | 2001-09-28 | 2003-12-02 | Infineon Technologies, Ag | Gate processing method with reduced gate oxide corner and edge thinning |
US6657259B2 (en) * | 2001-12-04 | 2003-12-02 | International Business Machines Corporation | Multiple-plane FinFET CMOS |
US6461936B1 (en) | 2002-01-04 | 2002-10-08 | Infineon Technologies Ag | Double pullback method of filling an isolation trench |
US6657252B2 (en) * | 2002-03-19 | 2003-12-02 | International Business Machines Corporation | FinFET CMOS with NVRAM capability |
US7388259B2 (en) * | 2002-11-25 | 2008-06-17 | International Business Machines Corporation | Strained finFET CMOS device structures |
US6825529B2 (en) | 2002-12-12 | 2004-11-30 | International Business Machines Corporation | Stress inducing spacers |
US6717216B1 (en) | 2002-12-12 | 2004-04-06 | International Business Machines Corporation | SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device |
US6974981B2 (en) | 2002-12-12 | 2005-12-13 | International Business Machines Corporation | Isolation structures for imposing stress patterns |
US6803631B2 (en) * | 2003-01-23 | 2004-10-12 | Advanced Micro Devices, Inc. | Strained channel finfet |
US6762448B1 (en) * | 2003-04-03 | 2004-07-13 | Advanced Micro Devices, Inc. | FinFET device with multiple fin structures |
US6909186B2 (en) * | 2003-05-01 | 2005-06-21 | International Business Machines Corporation | High performance FET devices and methods therefor |
US6887798B2 (en) | 2003-05-30 | 2005-05-03 | International Business Machines Corporation | STI stress modification by nitrogen plasma treatment for improving performance in small width devices |
US7279746B2 (en) | 2003-06-30 | 2007-10-09 | International Business Machines Corporation | High performance CMOS device structures and method of manufacture |
US7078299B2 (en) * | 2003-09-03 | 2006-07-18 | Advanced Micro Devices, Inc. | Formation of finFET using a sidewall epitaxial layer |
US7119403B2 (en) | 2003-10-16 | 2006-10-10 | International Business Machines Corporation | High performance strained CMOS devices |
US8008724B2 (en) | 2003-10-30 | 2011-08-30 | International Business Machines Corporation | Structure and method to enhance both nFET and pFET performance using different kinds of stressed layers |
US6977194B2 (en) | 2003-10-30 | 2005-12-20 | International Business Machines Corporation | Structure and method to improve channel mobility by gate electrode stress modification |
US7015082B2 (en) | 2003-11-06 | 2006-03-21 | International Business Machines Corporation | High mobility CMOS circuits |
US7122849B2 (en) | 2003-11-14 | 2006-10-17 | International Business Machines Corporation | Stressed semiconductor device structures having granular semiconductor material |
US7247912B2 (en) | 2004-01-05 | 2007-07-24 | International Business Machines Corporation | Structures and methods for making strained MOSFETs |
US7205206B2 (en) * | 2004-03-03 | 2007-04-17 | International Business Machines Corporation | Method of fabricating mobility enhanced CMOS devices |
US7504693B2 (en) * | 2004-04-23 | 2009-03-17 | International Business Machines Corporation | Dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering |
US7354806B2 (en) * | 2004-09-17 | 2008-04-08 | International Business Machines Corporation | Semiconductor device structure with active regions having different surface directions and methods |
-
2003
- 2003-12-12 US US10/733,378 patent/US7198995B2/en not_active Expired - Lifetime
-
2004
- 2004-11-18 CN CNB2004100950072A patent/CN100356525C/zh active Active
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US9768304B2 (en) | 2006-11-20 | 2017-09-19 | Globalfoundries Inc. | Method of fabricating a FINFET having a gate structure disposed at least partially at a bend region of the semiconductor fin |
US10714616B2 (en) | 2006-11-20 | 2020-07-14 | Globalfoundries Inc. | FINFET having a gate structure in a trench feature in a bent fin |
KR101393917B1 (ko) * | 2012-05-16 | 2014-05-12 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | Cmos 디바이스 및 그 형성 방법 |
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US7198995B2 (en) | 2007-04-03 |
CN100356525C (zh) | 2007-12-19 |
CN1667794A (zh) | 2005-09-14 |
JP4130652B2 (ja) | 2008-08-06 |
US20050130358A1 (en) | 2005-06-16 |
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