JP2005129812A - 液冷システム - Google Patents

液冷システム Download PDF

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Publication number
JP2005129812A
JP2005129812A JP2003365411A JP2003365411A JP2005129812A JP 2005129812 A JP2005129812 A JP 2005129812A JP 2003365411 A JP2003365411 A JP 2003365411A JP 2003365411 A JP2003365411 A JP 2003365411A JP 2005129812 A JP2005129812 A JP 2005129812A
Authority
JP
Japan
Prior art keywords
cooling system
radiator
liquid
liquid cooling
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003365411A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005129812A5 (enExample
Inventor
Takashi Osanawa
尚 長縄
Rintaro Minamitani
林太郎 南谷
Shigeo Ohashi
繁男 大橋
Yoshihiro Kondo
義広 近藤
Atsushi Suzuki
敦 鈴木
Hitoshi Matsushima
松島　　均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2003365411A priority Critical patent/JP2005129812A/ja
Priority to DE602004024636T priority patent/DE602004024636D1/de
Priority to EP04005037A priority patent/EP1528849B1/en
Priority to TW093105590A priority patent/TWI265772B/zh
Priority to US10/791,772 priority patent/US7113404B2/en
Priority to KR1020040014479A priority patent/KR100610734B1/ko
Priority to CNB2004100077673A priority patent/CN100367493C/zh
Publication of JP2005129812A publication Critical patent/JP2005129812A/ja
Publication of JP2005129812A5 publication Critical patent/JP2005129812A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
    • F28F9/002—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core with fastening means for other structures
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/10—Packing paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/02—Patterned paper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/05316—Assemblies of conduits connected to common headers, e.g. core type radiators
    • F28D1/05341—Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits combined with a particular flow pattern, e.g. multi-row multi-stage radiators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0246—Arrangements for connecting header boxes with flow lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003365411A 2003-10-27 2003-10-27 液冷システム Pending JP2005129812A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003365411A JP2005129812A (ja) 2003-10-27 2003-10-27 液冷システム
DE602004024636T DE602004024636D1 (de) 2003-10-27 2004-03-03 Flüssigkeitskühlungsystem
EP04005037A EP1528849B1 (en) 2003-10-27 2004-03-03 Liquid cooling system
TW093105590A TWI265772B (en) 2003-10-27 2004-03-03 Liquid-cooling system
US10/791,772 US7113404B2 (en) 2003-10-27 2004-03-04 Liquid cooling system
KR1020040014479A KR100610734B1 (ko) 2003-10-27 2004-03-04 액랭 시스템
CNB2004100077673A CN100367493C (zh) 2003-10-27 2004-03-05 液体冷却系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003365411A JP2005129812A (ja) 2003-10-27 2003-10-27 液冷システム

Publications (2)

Publication Number Publication Date
JP2005129812A true JP2005129812A (ja) 2005-05-19
JP2005129812A5 JP2005129812A5 (enExample) 2006-07-20

Family

ID=34420088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003365411A Pending JP2005129812A (ja) 2003-10-27 2003-10-27 液冷システム

Country Status (7)

Country Link
US (1) US7113404B2 (enExample)
EP (1) EP1528849B1 (enExample)
JP (1) JP2005129812A (enExample)
KR (1) KR100610734B1 (enExample)
CN (1) CN100367493C (enExample)
DE (1) DE602004024636D1 (enExample)
TW (1) TWI265772B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011164573A (ja) * 2010-01-14 2011-08-25 Ricoh Co Ltd 画像形成装置
KR101158201B1 (ko) * 2008-12-04 2012-06-19 후지쯔 가부시끼가이샤 라디에이터, 냉각 유닛, 냉각 시스템 및 전자 기기
JP2020068301A (ja) * 2018-10-24 2020-04-30 日本電産株式会社 冷却装置
JP2022028759A (ja) * 2018-02-14 2022-02-16 日本電産サンキョー株式会社 冷却装置
JP7079038B1 (ja) 2021-12-01 2022-06-01 Ａｒｄ株式会社 コンピュータ

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100579348C (zh) * 2003-06-27 2010-01-06 日本电气株式会社 电子设备的冷却装置
JP2006039663A (ja) * 2004-07-22 2006-02-09 Hitachi Ltd 液循環システム及びこれを用いる液冷システム
KR100670273B1 (ko) * 2005-01-18 2007-01-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치용 방열 조립체 및 이를구비하는 플라즈마 디스플레이 장치
US7212404B2 (en) * 2005-04-19 2007-05-01 Inventec Corporation Integrated heat sink device
CN100446228C (zh) * 2005-09-23 2008-12-24 鸿富锦精密工业（深圳）有限公司 液冷式散热系统
CN1944978B (zh) * 2005-09-28 2010-07-28 三洋电机株式会社 液冷装置
US7295436B2 (en) * 2005-12-10 2007-11-13 Kioan Cheon Cooling system for computer components
US20070201207A1 (en) * 2006-02-24 2007-08-30 Ming-Hang Hwang Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof
US20080043425A1 (en) * 2006-08-17 2008-02-21 Justin Richard Hebert Methods and systems for cooling a computing device
WO2008148087A1 (en) * 2007-05-25 2008-12-04 Ocz Technology Group, Inc. Method and apparatus for cooling computer memory
JP4625851B2 (ja) * 2008-04-28 2011-02-02 株式会社日立製作所 冷却システム及びそれを備えた電子機器
US10048008B1 (en) * 2009-12-15 2018-08-14 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US20110186267A1 (en) * 2010-02-01 2011-08-04 Suna Display Co. Heat transfer device with anisotropic thermal conducting micro structures
JP5651991B2 (ja) * 2010-05-10 2015-01-14 富士通株式会社 ラジエータ及びそれを備えた電子機器
US8590331B2 (en) * 2010-10-13 2013-11-26 Siemens Medical Solutions Usa, Inc. Cooling unit for cooling a detection device in an imaging system and detection devices and imaging systems therefrom
JP5664397B2 (ja) * 2011-03-25 2015-02-04 富士通株式会社 冷却ユニット
CN104136873A (zh) * 2012-02-21 2014-11-05 华为技术有限公司 用于冷却产热单元的冷却系统和方法
US20140069614A1 (en) * 2012-09-13 2014-03-13 Asia Vital Components Co., Ltd. Heat dissipaion device and thermal module using same
DE102013201109A1 (de) * 2013-01-24 2014-07-24 Behr Gmbh & Co. Kg Wärmeübertragungseinrichtung
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
CN106793704A (zh) * 2017-01-09 2017-05-31 广东黑拍师光电有限公司 液体冷却一体化装置和液体冷却方法
CN107228577A (zh) * 2017-06-20 2017-10-03 太仓陶氏电气有限公司 一种自调节型工业用散热器装置
CN108022895A (zh) * 2017-12-25 2018-05-11 奇鋐科技股份有限公司 水冷排散热结构
JP6993546B2 (ja) * 2018-02-14 2022-01-13 日本電産サンキョー株式会社 冷却装置
USD975714S1 (en) * 2019-01-07 2023-01-17 EKWB d.o.o. Tube bending tool
US10925183B2 (en) * 2019-02-21 2021-02-16 Adlink Technology Inc. 3D extended cooling mechanism for integrated server
CN111386012B (zh) * 2020-02-28 2022-03-25 北京空间飞行器总体设计部 一种适用于临近空间的可变散热能力的散热器
CN113672059B (zh) * 2020-05-15 2025-01-24 亚浩电子五金塑胶（惠州）有限公司 电脑液冷系统
US12123652B2 (en) * 2020-11-02 2024-10-22 Cooler Master Co., Ltd Liquid cooling system
US11910563B2 (en) * 2021-06-21 2024-02-20 Quanta Computer Inc. Liquid cooling module with movable radiators
JP7703403B2 (ja) * 2021-09-01 2025-07-07 ニデック株式会社 放熱装置及び冷却装置
TWI889537B (zh) * 2024-09-09 2025-07-01 建準電機工業股份有限公司 散熱系統

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPH0330399A (ja) * 1989-06-27 1991-02-08 Mitsubishi Electric Corp 電子冷却装置
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
US5693871A (en) * 1996-07-12 1997-12-02 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low differential pressure generator
CN2349672Y (zh) * 1998-11-26 1999-11-17 官有莹 晶片冷却循环系统装置
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
CN2422727Y (zh) * 2000-05-12 2001-03-07 讯凯国际股份有限公司 具导热管的散热器
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
EP1160649A1 (en) * 2000-06-02 2001-12-05 Roberto Pena Gonzalez Internal refrigeration system for computers
JP2002013856A (ja) * 2000-06-29 2002-01-18 Showa Denko Kk 半導体集積回路用液冷式冷却装置
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
JP2002163042A (ja) * 2000-11-28 2002-06-07 Toshiba Corp 携帯型情報機器
JP2002368471A (ja) * 2001-06-05 2002-12-20 Matsushita Electric Ind Co Ltd 冷却装置
US20030030981A1 (en) 2001-08-09 2003-02-13 Jon Zuo Method and apparatus for pumped liquid cooling
JP2003152376A (ja) * 2001-11-12 2003-05-23 Hitachi Ltd 電子装置
JP3961844B2 (ja) 2002-02-08 2007-08-22 株式会社日立製作所 冷却液タンク
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
JP2005229030A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システムを備えた電子機器
JP2005228237A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
JP2005229032A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システムを備えた電子機器とそのラジエータ、及び、その製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101158201B1 (ko) * 2008-12-04 2012-06-19 후지쯔 가부시끼가이샤 라디에이터, 냉각 유닛, 냉각 시스템 및 전자 기기
JP2011164573A (ja) * 2010-01-14 2011-08-25 Ricoh Co Ltd 画像形成装置
JP2022028759A (ja) * 2018-02-14 2022-02-16 日本電産サンキョー株式会社 冷却装置
JP7167293B2 (ja) 2018-02-14 2022-11-08 日本電産サンキョー株式会社 冷却装置
JP2020068301A (ja) * 2018-10-24 2020-04-30 日本電産株式会社 冷却装置
US10959353B2 (en) 2018-10-24 2021-03-23 Nidec Corporation Cooling device
JP7247517B2 (ja) 2018-10-24 2023-03-29 日本電産株式会社 冷却装置
JP7079038B1 (ja) 2021-12-01 2022-06-01 Ａｒｄ株式会社 コンピュータ
JP2023081408A (ja) * 2021-12-01 2023-06-13 Ａｒｄ株式会社 コンピュータ

Also Published As

Publication number Publication date
US7113404B2 (en) 2006-09-26
CN100367493C (zh) 2008-02-06
CN1612332A (zh) 2005-05-04
EP1528849B1 (en) 2009-12-16
KR20050040681A (ko) 2005-05-03
TWI265772B (en) 2006-11-01
TW200515866A (en) 2005-05-01
DE602004024636D1 (de) 2010-01-28
KR100610734B1 (ko) 2006-08-09
EP1528849A1 (en) 2005-05-04
US20050088820A1 (en) 2005-04-28

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