CN106793704A - 液体冷却一体化装置和液体冷却方法 - Google Patents

液体冷却一体化装置和液体冷却方法 Download PDF

Info

Publication number
CN106793704A
CN106793704A CN201710012181.3A CN201710012181A CN106793704A CN 106793704 A CN106793704 A CN 106793704A CN 201710012181 A CN201710012181 A CN 201710012181A CN 106793704 A CN106793704 A CN 106793704A
Authority
CN
China
Prior art keywords
liquid
passage
fluid
fluid reservoir
integrated apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710012181.3A
Other languages
English (en)
Inventor
麦健文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Black Light Co Ltd
Original Assignee
Guangdong Black Light Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Black Light Co Ltd filed Critical Guangdong Black Light Co Ltd
Priority to CN201710012181.3A priority Critical patent/CN106793704A/zh
Priority to US15/414,578 priority patent/US20180195804A1/en
Priority to EP17171848.9A priority patent/EP3346218A1/en
Publication of CN106793704A publication Critical patent/CN106793704A/zh
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05366Assemblies of conduits connected to common headers, e.g. core type radiators
    • F28D1/05375Assemblies of conduits connected to common headers, e.g. core type radiators with particular pattern of flow, e.g. change of flow direction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/10Liquid materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • F28F23/02Arrangements for obtaining or maintaining same in a liquid state
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08Fluid driving means, e.g. pumps, fans
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了液体冷却一体化装置和液体冷却方法。所述液体冷却一体化装置,包括外壳、第一储液室、第二储液室、至少一条用于散热的第一液体通道、用于紧贴热源设备的第二液体通道、至少一条用于散热的第三液体通道和液体输送驱动循环结构;第一储液室、第二储液室、第一液体通道、第二液体通道、第三液体通道和液体输送驱动循环结构设于外壳内;第一储液室通过第一液体通道连通第二液体通道,第二液体通道通过第三液体通道连通第二储液室,第一储液室和第二储液室相互独立且通过液体输送驱动循环结构连接,液体输送驱动循环结构实现将第二储液室的液体输送到第一储液室。本发明采用以上结构,节省空间,降低了漏水的风险。

Description

液体冷却一体化装置和液体冷却方法
技术领域
本发明涉及热能转移设备技术领域,具体涉及液体冷却一体化装置和液体冷却方法。
背景技术
目前现有技术中台式计算机、服务器、便携式电脑的CPU(Central ProcessingUnit,中央处理器)都采用风扇冷却、这些产品的核心部件在工作中都大量发热,散热处理效果较差,严重影响产品的使用及其寿命。各种照明灯具在照明过程中也存在大量发热,使产品在使用过程中温度升高,严重影响产品寿命,并造成能源浪费。各种电子设备的核心部件在工作中都有大量发热,热量不带走将严重影响设备性能。在一些电脑、计算机中,一些爱好者自己动手采用水冷却,但存在使用水管管路、接头出现漏水,塑料管线在高温水中易老化等问题,并且这种水冷却是水箱、水泵、风扇分开布局,占用大量空间,所以未能大量被工业采用。
发明内容
本发明的目的在于公开了液体冷却一体化装置和液体冷却方法,解决了现有的计算机、服务器、灯具等电子产品的核心部件在使用中大量发热,造成产品使用性能降低、能源浪费的问题。
为达到上述目的,本发明采用如下技术方案:
液体冷却一体化装置,包括外壳、第一储液室、第二储液室、至少一条用于散热的第一液体通道、用于紧贴热源设备的第二液体通道、至少一条用于散热的第三液体通道和液体输送驱动循环结构;第一储液室、第二储液室、第一液体通道、第二液体通道、第三液体通道和液体输送驱动循环结构设于外壳内;第一储液室通过第一液体通道连通第二液体通道,第二液体通道通过第三液体通道连通第二储液室,第一储液室和第二储液室相互独立且通过液体输送驱动循环结构连接,液体输送驱动循环结构实现将第二储液室的液体输送到第一储液室。
进一步,所述第一液体通道和所述第三液体通道的结构相同;第一液体通道包括管道和用于散热的散热片,散热片设于管道外壁。
进一步,所述第一液体通道和所述第三液体通道平行设置;第一液体通道的上端连通所述第一储液室,第一液体通道的下端连通所述第二液体通道;所述第三液体通道的上端连通所述第二储液室,第三液体通道的下端连通第二液体通道。
进一步,还包括设于所述外壳上且用于散热的风扇,风扇设于所述第一液体通道和所述第三液体通道的一侧或两侧。
进一步,所述外壳采用利于散热的金属材料制成。
进一步,所述第一液体通道和所述第二液体通道的截面成椭圆形或方形。
进一步,包括7个所述第一液体通道4和6个所述第三液体通道6。
本发明还公开了液体冷却方法,利用所述液体冷却一体化装置,包括:所述第一储液室、所述第一液体通道、所述第二液体通道、所述第三液体通道和所述第二储液室在整个所述外壳内部形成完整的液体流路,液体输送驱动循环结构通过动力驱动液体从第二储液室进入第一储液室;通过液体输送驱动循环结构对液体的驱动,液体在外壳内部循环流动;在此过程中,第二液体通道内的液体和所述热源设备实现热传递,液体带走热源设备的热量,液体流经第一液体通道和第三液体通道时,液体的热能通过热交换分布于第一液体通道的所述散热片和第三液体通道的散热片表面实现散热;同时所述风扇的旋转带动空气加速流动,使散热片表面的热能被空气带走。
与现有技术相比,本发明的有益效果:
1、本发明所述液体冷却一体化装置采用第一储液室、第二储液室、第一液体通道、第二液体通道、第三液体通道和液体输送驱动循环结构设于外壳内的结构,全部零部件内置一体化封装,结构简单,节省外接管线,节省空间,制造精度要求低、安装要求低,提高了使用安全性,尺寸较小,可广泛应用于各种电子产品核心部件发热器件的冷却,保证电子产品的安全性。全部零部件内置一体化封装后,减少了管线接头,也就降低了漏水的风险,提高了冷却的可靠性。
2、本发明提供了一种新型的液体冷却一体化装置和液体冷却方法,该装置结构紧凑,是一种制造精度要求及安装要求低的、操作方便、安全的冷却用装置。液体冷却一体化装置可以使用各类适合散热的金属作为产品外壳,使用更扁平化的液体通道能让冷却液体更高效的接触散热片,从而极大的提升整体散热效果。冷却液体在完全密封密闭的空间内用液体输送驱动循环装置单向循环流动,热量由液体通道内带动循环。产品完全密封所以不用再担心将来需要添加液体或者发生液体泄漏的事情。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1是本发明中所述液体冷却一体化装置,实施例一的剖面主视示意图,图中箭头示意液体流向;
图2是图1的俯视示意图;
图3是图1的左视示意图。
图中,1-外壳;2-第一储液室;3-第二储液室;4-第一液体通道;41-管道;42-用于散热的散热片;5-第二液体通道;6-第三液体通道;7-液体输送驱动循环结构;8-风扇;9-热源设备。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例一
如图1至图3所示实施例一液体冷却一体化装置,包括外壳1、第一储液室2、第二储液室3、至少一条用于散热的第一液体通道4、用于紧贴热源设备9的第二液体通道5、至少一条用于散热的第三液体通道6和液体输送驱动循环结构7;第一储液室、第二储液室3、第一液体通道4、第二液体通道5、第三液体通道6和液体输送驱动循环结构7设于外壳1内。第一储液室2通过第一液体通道4连通第二液体通道5,第二液体通道5通过第三液体通道6连通第二储液室3,第一储液室2和第二储液室3相互独立且通过液体输送驱动循环结构7连接,液体输送驱动循环结构7实现将第二储液室3的液体输送到第一储液室2。第一液体通道4和第三液体通道6的结构相同。第一液体通道4包括管道41和用于散热的散热片42,散热片42设于管道外壁。实施例一包括7个第一液体通道4和6个第三液体通道6。第一液体通道4和第三液体通道6平行设置;第一液体通道4的上端连通第一储液室2,第一液体通道4的下端连通第二液体通道5;第三液体通道6的上端连通第二储液室3,第三液体通道6的下端连通第二液体通道5。
实施例一还包括设于外壳1上且用于散热的风扇8,风扇8设于第一液体通道4和第三液体通道6的一侧或两侧(如图3所示),实施例一通过风扇8的旋转带动空气加速流动,使第一液体通道4和第三液体通道6的散热片表面的热能被空气带走。作为对实施例一的进一步说明,外壳1采用利于散热的金属材料制成,第一液体通道4和第二液体通道5的截面成椭圆形、方形或其它扁平结构,能让液体更高效的接触散热片。
实施例一的其它结构参见现有技术。
实施例二
现说明利用实施例一的液体冷却方法,包括:第一储液室2、第一液体通道4、第二液体通道5、第三液体通道6和第二储液室3在整个外壳1内部形成完整的液体流路,液体输送驱动循环结构7通过动力驱动液体从第二储液室3进入第一储液室2;通过液体输送驱动循环结构7对液体的驱动,液体在外壳1内部循环流动;在此过程中,第二液体通道5内的液体和热源设备9实现热传递,液体带走热源设备9的热量,液体流经第一液体通道4和第三液体通道6时,液体的热能通过热交换分布于第一液体通道4的散热片和第三液体通道6的散热片表面实现散热;同时风扇的旋转带动空气加速流动,使散热片表面的热能被空气带走。
本发明并不局限于上述实施方式,如果对本发明的各种改动或变型不脱离本发明的精神和范围,倘若这些改动和变型属于本发明的权利要求和等同技术范围之内,则本发明也意图包含这些改动和变型。

Claims (8)

1.液体冷却一体化装置,其特征是:包括外壳、第一储液室、第二储液室、至少一条用于散热的第一液体通道、用于紧贴热源设备的第二液体通道、至少一条用于散热的第三液体通道和液体输送驱动循环结构;第一储液室、第二储液室、第一液体通道、第二液体通道、第三液体通道和液体输送驱动循环结构设于外壳内;第一储液室通过第一液体通道连通第二液体通道,第二液体通道通过第三液体通道连通第二储液室,第一储液室和第二储液室相互独立且通过液体输送驱动循环结构连接,液体输送驱动循环结构实现将第二储液室的液体输送到第一储液室。
2.根据权利要求1所述液体冷却一体化装置,其特征是:所述第一液体通道和所述第三液体通道的结构相同;第一液体通道包括管道和用于散热的散热片,散热片设于管道外壁。
3.根据权利要求2所述液体冷却一体化装置,其特征是:所述第一液体通道和所述第三液体通道平行设置;第一液体通道的上端连通所述第一储液室,第一液体通道的下端连通所述第二液体通道;所述第三液体通道的上端连通所述第二储液室,第三液体通道的下端连通第二液体通道。
4.根据权利要求3所述液体冷却一体化装置,其特征是:还包括设于所述外壳上且用于散热的风扇,风扇设于所述第一液体通道和所述第三液体通道的一侧或两侧。
5.根据权利要求4所述液体冷却一体化装置,其特征是:所述外壳采用利于散热的金属材料制成。
6.根据权利要求4所述液体冷却一体化装置,其特征是:所述第一液体通道和所述第二液体通道的截面成椭圆形或方形。
7.根据权利要求4所述液体冷却一体化装置,其特征是:包括7个所述第一液体通道4和6个所述第三液体通道。
8.液体冷却方法,其特征是,利用权利要求4至7任意一项所述液体冷却一体化装置,包括:所述第一储液室、所述第一液体通道、所述第二液体通道、所述第三液体通道和所述第二储液室在整个所述外壳内部形成完整的液体流路,液体输送驱动循环结构通过动力驱动液体从第二储液室进入第一储液室;通过液体输送驱动循环结构对液体的驱动,液体在外壳内部循环流动;在此过程中,第二液体通道内的液体和所述热源设备实现热传递,液体带走热源设备的热量,液体流经第一液体通道和第三液体通道时,液体的热能通过热交换分布于第一液体通道的所述散热片和第三液体通道的散热片表面实现散热;同时所述风扇的旋转带动空气加速流动,使散热片表面的热能被空气带走。
CN201710012181.3A 2017-01-09 2017-01-09 液体冷却一体化装置和液体冷却方法 Pending CN106793704A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201710012181.3A CN106793704A (zh) 2017-01-09 2017-01-09 液体冷却一体化装置和液体冷却方法
US15/414,578 US20180195804A1 (en) 2017-01-09 2017-01-24 Integrated liquid cooling device and method thereof
EP17171848.9A EP3346218A1 (en) 2017-01-09 2017-05-19 An integrated liquid cooling device and a method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710012181.3A CN106793704A (zh) 2017-01-09 2017-01-09 液体冷却一体化装置和液体冷却方法

Publications (1)

Publication Number Publication Date
CN106793704A true CN106793704A (zh) 2017-05-31

Family

ID=58950407

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710012181.3A Pending CN106793704A (zh) 2017-01-09 2017-01-09 液体冷却一体化装置和液体冷却方法

Country Status (3)

Country Link
US (1) US20180195804A1 (zh)
EP (1) EP3346218A1 (zh)
CN (1) CN106793704A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116528574A (zh) * 2023-07-04 2023-08-01 荣耀终端有限公司 散热系统及电子设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7238401B2 (ja) * 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
JP2019179832A (ja) * 2018-03-30 2019-10-17 日本電産株式会社 冷却装置
CN112930098A (zh) * 2021-01-27 2021-06-08 东莞汉旭五金塑胶科技有限公司 一体式液冷散热器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1601731A (zh) * 2003-09-25 2005-03-30 株式会社日立制作所 冷却模块
US20060185378A1 (en) * 2005-02-18 2006-08-24 Cooler Master Co. Ltd. Liquid-cooling heat dissipation assembly
US20070023167A1 (en) * 2005-07-29 2007-02-01 Tay-Jian Liu Integrated liquid cooling system for electronic components
CN101146429A (zh) * 2006-09-15 2008-03-19 刘胜 电子器件的散热器
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
CN201563334U (zh) * 2009-11-16 2010-08-25 陈创军 一种整体式微型液冷散热系统
CN206350290U (zh) * 2017-01-09 2017-07-21 广东黑拍师光电有限公司 液体冷却一体化装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US6809928B2 (en) * 2002-12-27 2004-10-26 Intel Corporation Sealed and pressurized liquid cooling system for microprocessor
TW577586U (en) * 2003-01-22 2004-02-21 Hon Hai Prec Ind Co Ltd Liquid cooling device
JP2005129812A (ja) * 2003-10-27 2005-05-19 Hitachi Ltd 液冷システム
CN100371854C (zh) * 2004-12-24 2008-02-27 富准精密工业(深圳)有限公司 液冷式散热装置
TWM277977U (en) * 2005-04-22 2005-10-11 Cooler Master Co Ltd Water-cooling heat exchanger and heat dissipation device thereof
TWI272056B (en) * 2005-08-12 2007-01-21 Foxconn Tech Co Ltd Integrated liquid cooling system
US7466550B2 (en) * 2006-11-03 2008-12-16 Xigmatek Co., Ltd Integrated heat dissipating assembly
US9927181B2 (en) * 2009-12-15 2018-03-27 Rouchon Industries, Inc. Radiator with integrated pump for actively cooling electronic devices
US20110272120A1 (en) * 2010-03-04 2011-11-10 Joshi Yogendra K Compact modular liquid cooling systems for electronics
US20140008039A1 (en) * 2012-07-03 2014-01-09 Antec, Inc. Liquid-cooling heat dissipation apparatus for electronic elements

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1601731A (zh) * 2003-09-25 2005-03-30 株式会社日立制作所 冷却模块
US20050067145A1 (en) * 2003-09-25 2005-03-31 Shinji Matsushita Liquid cooling module
US20060185378A1 (en) * 2005-02-18 2006-08-24 Cooler Master Co. Ltd. Liquid-cooling heat dissipation assembly
US20070023167A1 (en) * 2005-07-29 2007-02-01 Tay-Jian Liu Integrated liquid cooling system for electronic components
CN101146429A (zh) * 2006-09-15 2008-03-19 刘胜 电子器件的散热器
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
CN201563334U (zh) * 2009-11-16 2010-08-25 陈创军 一种整体式微型液冷散热系统
CN206350290U (zh) * 2017-01-09 2017-07-21 广东黑拍师光电有限公司 液体冷却一体化装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116528574A (zh) * 2023-07-04 2023-08-01 荣耀终端有限公司 散热系统及电子设备
CN116528574B (zh) * 2023-07-04 2023-11-14 荣耀终端有限公司 散热系统及电子设备

Also Published As

Publication number Publication date
US20180195804A1 (en) 2018-07-12
EP3346218A1 (en) 2018-07-11

Similar Documents

Publication Publication Date Title
CN106793704A (zh) 液体冷却一体化装置和液体冷却方法
CN103996665B (zh) 一种采用脉动流及波壁微通道的强化散热装置
CN206350290U (zh) 液体冷却一体化装置
CN101594739A (zh) 器件埋入式电路板散热装置及加工方法
CN207301955U (zh) 一种电脑主机的散热装置
CN207096911U (zh) 一种计算机散热壳体
BR102012003095B1 (pt) Aparelho de igualação de temperatura que esguicha fluido para condução térmica utilizado em equipamento elétrico
CN207006078U (zh) 一种液冷风冷组合散热系统
CN106852092B (zh) 一种新型机械泵液冷散热系统
CN206657316U (zh) 一种计算机新型散热机箱
CN204598549U (zh) 一种水冷和风冷组合式散热器
CN107069142A (zh) 管路热管理装置及系统
CN203086912U (zh) 一种大功率模块水冷散热板
CN207719189U (zh) 一种cpu高热散热装置
CN205812614U (zh) 一种液态金属散热机箱
CN108598623A (zh) 一种基于相变热交换的锂离子电池储能快速散热装置及方法
CN101707192A (zh) 散热封装结构及其大功率器件管芯的封装方法
CN206022349U (zh) 一种热管型相变散热装置
CN205900529U (zh) 一种绝缘栅极型功率管双重散热装置
CN108649296A (zh) 一种基于液态金属导热的锂离子电池储能快速散热装置及方法
CN206551462U (zh) 一种塑料管冷却水槽用冷却循环系统
CN206224359U (zh) 液冷散热模块
CN106642407A (zh) 基于热超导散热板的电控器及空调室外机
CN207040118U (zh) 可快速换部件的移动式机柜级服务器系统的散热装置
CN206412176U (zh) 一种液体冷却变压器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170531