WO2022100106A1 - 可插拔设备、信息通信设备、散热系统和制造方法 - Google Patents

可插拔设备、信息通信设备、散热系统和制造方法 Download PDF

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Publication number
WO2022100106A1
WO2022100106A1 PCT/CN2021/103259 CN2021103259W WO2022100106A1 WO 2022100106 A1 WO2022100106 A1 WO 2022100106A1 CN 2021103259 W CN2021103259 W CN 2021103259W WO 2022100106 A1 WO2022100106 A1 WO 2022100106A1
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WO
WIPO (PCT)
Prior art keywords
liquid
pluggable
pipe joint
liquid cooling
information communication
Prior art date
Application number
PCT/CN2021/103259
Other languages
English (en)
French (fr)
Inventor
李成
王连强
杨勇
何勇涛
张正涛
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2023528386A priority Critical patent/JP2023550719A/ja
Priority to KR1020237018704A priority patent/KR20230097167A/ko
Priority to EP21890637.8A priority patent/EP4236641A4/en
Publication of WO2022100106A1 publication Critical patent/WO2022100106A1/zh
Priority to US18/316,770 priority patent/US20230280553A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Definitions

  • the present application relates to the field of heat dissipation technology, and in particular, to a pluggable device, an information communication device, a heat dissipation system and a manufacturing method.
  • Pluggable devices such as optical modules for photoelectric conversion, are used in conjunction with optical communication equipment in optical fiber communication.
  • the fiber optic connector is inserted.
  • the optical module generates heat during operation.
  • a heat sink is usually installed on the outer surface of the casing of the optical cage of the switch. In this way, the heat generated by the optical module is transferred to the radiator through the housing of the optical cage, and is radiated to the outside by the radiator.
  • the application provides a pluggable device, an information communication device, a heat dissipation system and a manufacturing method, which can overcome the problems in the related art, and the technical solutions are as follows:
  • a pluggable device in one aspect, includes a housing, a circuit board, a heating element and a liquid cooling element;
  • the circuit board, the heating element and the liquid cooling element are stacked and located in the casing in sequence, and the two pipe joints of the liquid cooling element are both fixed to the shell wall of the casing;
  • the two pipe joints of the liquid cooling element are configured to be respectively connected with the liquid discharge pipe joint and the liquid inlet pipe joint of the liquid cooling radiator element.
  • the water pump of the liquid cooling radiator runs, and the water tank of the liquid cooling radiator runs.
  • the low-temperature liquid is sucked in and discharged into the heat pipe of the liquid-cooling part.
  • the low-temperature liquid absorbs the heat of the liquid-cooling part and the temperature rises.
  • the liquid whose temperature rises flows into the water tank for cooling. Pump suction.
  • the liquid circulates between the liquid cooling part and the liquid cooling heat sink to cool the liquid cooling part to increase the temperature difference between the liquid cooling part and the heating element, and the liquid cooling part contacts the heating element, which can speed up the liquid Heat transfer between cold parts and heating elements, which in turn enhances heat dissipation for pluggable devices.
  • both pipe joints of the liquid cooling element are located at positions of the housing close to the exposed end of the pluggable device, and the exposed end of the pluggable device is When the pluggable device is inserted into the information communication device, it protrudes from the end of the information communication device.
  • the position close to the exposed end of the pluggable device may be any position where the pluggable device protrudes from the panel of the information communication device after the pluggable device is inserted into the information communication device.
  • the liquid-cooled heat sink is located outside the information communication device where the pluggable device is inserted, for example, the liquid-cooled heat sink is located in a cabinet where the information and communication device is located, or the liquid-cooled heat sink is located in a computer room where the information and communication device is located middle. Then, the two pipe joints of the liquid cooling element can be located near the exposed end of the pluggable device, so that after the pluggable device is inserted into the information communication equipment, the two pipe joints are exposed and can communicate with the liquid outside the information communication equipment.
  • the drain pipe joint of the cooling radiator is connected with the liquid inlet pipe joint.
  • the liquid-cooled heat sink is located in the information communication device to which the pluggable device is inserted, and the liquid-cooled heat-dissipation pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink are located at the panel of the information communication device. Then, the two pipe joints of the liquid cooling element can be located near the exposed port of the pluggable equipment, so that after the pluggable equipment is inserted into the information communication equipment, the two pipe joints are exposed and can be connected with the information communication equipment panel.
  • the discharge pipe joint is connected to the liquid inlet pipe joint.
  • the two pipe joints of the liquid cooling element are both located at positions of the housing close to the insertion end of the pluggable device, and the insertion end of the pluggable device is When the pluggable device is inserted into the information communication device, the end protrudes into the inside of the information communication device.
  • the liquid-cooled heat sink is located in the information communication device into which the pluggable device is inserted, and the liquid-cooled heat-dissipation pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink are located inside the information communication device. Then, the two pipe joints of the liquid cooling element can be located at the position close to the insertion end of the pluggable device, so that after the pluggable device is inserted into the information communication equipment, the two pipe joints are located inside the information communication equipment and can be connected with the information communication equipment.
  • the drain pipe joint inside the communication device is connected with the liquid inlet pipe joint.
  • a thermal interface material is filled between the heating element and the liquid cooling member.
  • the thermal interface material may be silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet, or thermally conductive adhesive.
  • the liquid cooling element is located on the surface of the heating element away from the circuit board.
  • the liquid cooling element and the heating element are closely attached.
  • a thermal interface material can be filled between the liquid cooling element and the heating element to reduce the gap between the liquid cooling element and the heating element. high contact thermal resistance, speeding up the heat transfer between the liquid cooling part and the heating element.
  • the heating element is at least one of a main function device, a control chip and a power management component of the pluggable device.
  • the heating element may be a component that can generate more heat during the operation of the pluggable device.
  • the heating element may be at least one of a main functional device, a control chip and a power management device of the pluggable device.
  • an information communication device in another aspect, includes a chassis, an interface component and a liquid-cooled heat sink;
  • Both the interface component and the liquid-cooled heat sink are located in the chassis, and the socket of the interface component is located at the panel of the chassis;
  • the drain pipe joint and the liquid inlet pipe joint of the liquid cooling radiator are configured to be respectively connected with the two pipe joints of the pluggable equipment inserted in the interface part, and the pluggable equipment is the above-mentioned pluggable equipment. Pluggable devices described above.
  • the information communication device includes a liquid-cooled heat sink, a liquid-cooled heat-dissipation pipe joint and a liquid inlet pipe joint, which can be respectively connected with two pipe joints of a pluggable device inserted on the information communication device connected.
  • the liquid used for cooling can flow between the liquid cooling part of the pluggable device and the liquid cooling radiating part of the information communication device, so as to absorb the temperature of the liquid cooling part, cool the liquid cooling part, increase the temperature of the liquid cooling part and increase the temperature of the liquid cooling part.
  • the temperature difference between the heating elements prompts the liquid cooling element to quickly absorb the heat generated by the heating element, thereby enhancing the effect of heat dissipation for the pluggable device.
  • both the drain pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink are located at the panel of the machine frame.
  • the two pipe joints of the liquid cooling element may be located near the exposed end of the pluggable device, then the liquid cooling pipe joint and the liquid inlet pipe joint of the liquid cooling element may be located at the panel of the chassis , so that after the pluggable device is inserted into the information communication device, the drain pipe joint and the liquid inlet pipe joint located at the frame panel can be respectively connected with the two pipe joints protruding from the frame panel.
  • both the drain pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink are located inside the machine frame and correspond to the positions of the interface components.
  • the two pipe joints of the liquid cooling element are located near the insertion end of the pluggable device, then the liquid cooling pipe joint and the liquid inlet pipe joint of the liquid cooling element can be located inside the frame, and Corresponding to the position of the interface component, after the pluggable device is inserted into the information communication device, the liquid discharge pipe joint and the liquid inlet pipe joint located inside the frame can be respectively connected with the two pipe joints located inside the frame.
  • the number of the interface components is multiple, and the number of the liquid-cooled heat sink is at least one.
  • an information communication device has a plurality of interface components so that the information communication device can be connected with a plurality of pluggable devices.
  • the number of interface components may be multiple, and the number of liquid-cooled heat sinks may be at least one.
  • the interface components and the liquid-cooled heat sink may be in one-to-one correspondence, so that one liquid-cooled heat sink can dissipate heat for the pluggable device in one interface component.
  • one liquid-cooled heat sink may be opposite to multiple interface components, so that one liquid-cooled heat sink can dissipate heat for the pluggable devices in the multiple interface components.
  • a heat dissipation system in another aspect, includes an information communication device, a liquid-cooled heat sink, and the above-mentioned pluggable device;
  • the pluggable device is inserted into the interface part of the information communication device, and the two pipe joints of the pluggable device are respectively connected to the liquid discharge pipe joint and the liquid inlet pipe joint of the liquid cooling radiator.
  • the heat dissipation system includes a liquid-cooled heat sink and a pluggable device with the liquid-cooled part.
  • the pluggable device is inserted into the information communication device.
  • the drain pipe joint of the liquid-cooled heat sink and the inlet The liquid pipe joints are respectively connected with the two pipe joints of the liquid cooling part.
  • the liquid used for cooling can flow between the liquid cooling part of the pluggable device and the liquid cooling radiating part of the information communication device, so as to absorb the temperature of the liquid cooling part, cool the liquid cooling part, increase the temperature of the liquid cooling part and increase the temperature of the liquid cooling part.
  • the temperature difference between the heating elements prompts the liquid cooling element to quickly absorb the heat generated by the heating element, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the liquid-cooled heat sink is located in the frame of the information communication device, and the liquid-cooled heat-dissipation pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink are located in the frame of the machine frame. at the panel.
  • the two pipe joints of the liquid cooling element are located at positions close to the optical interface of the pluggable device, then the liquid cooling element can be located in the frame of the information communication equipment, and the row of the liquid cooling element Both the liquid pipe joint and the liquid inlet pipe joint are located at the panel of the machine frame, so that after the pluggable equipment is inserted into the information communication equipment, the liquid discharge pipe joint and the liquid inlet pipe joint located on the machine frame panel can be respectively connected to the machine frame.
  • the two pipe joints of the frame panel are connected.
  • the liquid-cooled heat sink is located in a computer room where the information communication device is located.
  • the liquid-cooled heat sink may also be located in a computer room where the information and communication equipment is located, for example, in a cabinet of the computer room, or may be located in an air duct between two cabinets.
  • a method for manufacturing a pluggable device comprising:
  • the two pipe joints are configured to be respectively connected with the liquid-cooling radiator element's liquid-discharge pipe joint and the liquid-inlet pipe joint.
  • the pluggable device manufactured according to the above method includes a liquid cooling part, the liquid cooling part is located in the casing of the pluggable device and is in contact with the heating element in the casing;
  • the joint is located on the shell wall of the shell, and the two pipe joints can be used to connect with the discharge pipe joint and the liquid inlet pipe joint of the liquid-cooled heat sink.
  • the liquid used for cooling can flow between the liquid cooling part and the liquid cooling heat sink to absorb the temperature of the liquid cooling part, cool the liquid cooling part, increase the temperature difference between the liquid cooling part and the heating element, and promote the liquid cooling part.
  • the cold part quickly absorbs the heat generated by the heating element, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the information communication device in the above solution may be a switch, a router, an Access Point (AP) device, a blade server, etc., wherein the specific product of the information communication device is not limited in this embodiment, and it may be a pluggable device for the above-mentioned Any device the device is plugged into.
  • AP Access Point
  • Fig. 1 is the application schematic diagram of a kind of liquid cooling heat dissipation technology provided by this application;
  • FIG. 2 is a schematic structural diagram of a pluggable device including a liquid cooling element provided by the present application
  • FIG. 3 is a schematic structural diagram of a liquid cooling part of a pluggable device provided by the present application.
  • FIG. 4 is a schematic structural diagram of a pluggable device provided by the present application.
  • FIG. 5 is a schematic structural diagram of a liquid-cooled heat sink provided by the present application.
  • FIG. 6 is a schematic structural diagram of a liquid-cooled heat sink provided by the present application.
  • FIG. 7 is a schematic structural diagram of the connection between a liquid-cooled heat sink provided by the present application and a liquid-cooled member of a pluggable device;
  • FIG. 8 is a schematic structural diagram of the connection between a liquid-cooled heat sink provided by the present application and a liquid-cooled component of a pluggable device;
  • FIG. 9 is a schematic structural diagram of the connection between a liquid-cooled heat sink provided by the present application and a liquid-cooled component of a pluggable device;
  • FIG. 10 is a schematic structural diagram of an information communication device including a liquid-cooled heat sink provided by the present application.
  • Liquid cooling radiator 51, Drain pipe joint; 52, Inlet pipe joint; 53, Water pump; 54, Water tank; 55, Connecting pipe; 56, Drain pipe; 57, Inlet pipe; 58, Radiator ;
  • Machine frame 7. Interface components; 8. Optical interface; 9. Electrical interface; 10. Infusion tube; 100. Pluggable equipment.
  • the pluggable device may be a device that is inserted into an information communication device and generates more heat during operation.
  • the pluggable device may be an optical module, or for example , the pluggable device can also be a pluggable hard disk, etc.
  • the specific product of the pluggable device is not limited in this embodiment, and it may be any device that generates a lot of heat during operation.
  • the information communication device may be a device in the field of information and communication technology, which may be referred to as an ICT (Information Communications Technology) device for short, and is a device into which a pluggable device is inserted.
  • the pluggable device is an optical module
  • the inserted information communication device may be an optical communication device, such as a switch, an access point (Access Point, AP) device, and a router.
  • the pluggable device is a pluggable hard disk
  • the inserted information communication device may be a computer device, a blade server, or the like.
  • this embodiment also does not limit the specific product of the information communication device, which may be any device that can be inserted into the above-mentioned pluggable device.
  • Pluggable devices will generate heat during operation.
  • This solution uses liquid cooling technology to dissipate heat for pluggable devices, which can enhance the effect of heat dissipation for pluggable devices.
  • the pluggable device is an optical module, which is a component that converts optical signals and electrical signals. It is used in conjunction with optical communication equipment in optical fiber communication.
  • one end of the optical module is inserted into the interface component (The interface component may also be called an optical cage), and the other end of the optical module is inserted into the optical fiber connector of the optical cable.
  • the optical module will generate heat during operation, and the liquid cooling technology is used to dissipate heat for the optical module, which can enhance the effect of heat dissipation for the optical module.
  • the liquid cooling heat dissipation technology includes a liquid cooling part 4 and a liquid cooling heat dissipation part 5, and the liquid cooling part 4 and the liquid cooling heat dissipation part 5 pass through pipes. connected to form a closed circulation loop, in which the liquid flows to achieve a cooling effect, wherein the arrow in FIG. 1 is a possible flow direction of the liquid in the circulation loop.
  • the liquid cooling element 4 is used to absorb the heat of the heating element 3
  • the liquid cooling element 5 is used to promote the liquid to circulate between the liquid cooling element 4 and the liquid cooling element 5, and can also be used to reduce the temperature of the liquid.
  • the liquid cooling technology is applied to the pluggable equipment to dissipate heat for the pluggable equipment.
  • the size of the pluggable equipment such as the optical module is small, and the liquid cooling element 4 can be located in the shell of the pluggable equipment.
  • Contact with the heating element inside the pluggable device to absorb the heat of the heating element, and the liquid-cooled heat sink 5 can be located outside the shell of the pluggable device, for example, can be located in the information and communication device where the pluggable device is inserted, It can also be located in the computer room where the information communication equipment to which the pluggable equipment is inserted is located. This scheme will be described in detail below.
  • the pluggable device 100 includes a housing 1 , a circuit board 2 , a heating element 3 and a liquid cooling element 4 .
  • the circuit board 2 , the heating element 3 and the liquid cooling element 4 are stacked in sequence in the housing 1 .
  • the heating element 3 is located on the surface of the circuit board 2
  • the liquid cooling element 4 is located on the surface of the heating element 3 away from the circuit board 2 .
  • the liquid cooling element 4 has two pipe joints 41 . Both pipe joints 41 are fixed to the shell wall of the housing 1 and are configured to be connected with the liquid cooling pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 respectively.
  • the heating element 3 may be a component that can generate more heat during the operation of the pluggable device 100 .
  • the heating element 3 may be at least one of a main functional device, a control chip and a power management device of the pluggable device 100 .
  • the main functional device is a device for the pluggable device to realize its main function.
  • the pluggable device is an optical module
  • the functional device can be an optical device, which is used to realize the conversion of optical signals and electrical signals.
  • the heating element 3 may be a main functional device, a control chip, or a power management device.
  • the heating element 3 may be an assembly including a main function device and a control chip, or an assembly including a main function device and a power management device, or an assembly including a control chip and a power management device.
  • the heating element 3 may be an assembly including a main functional device, a control chip and a power management device.
  • the heating element 3 is not limited in this embodiment, and can be determined according to the working power of each component in the pluggable device.
  • a component whose working power is higher than a set threshold is determined as a heating element.
  • the heating element 3 shown in FIG. 2 can be used as an example as an assembly including a main functional device, a control chip and a power management device.
  • the liquid cooling element 4 is a component capable of absorbing the heat generated by the heating element 3 .
  • the liquid cooling element 4 is located on the surface of the heating element 3 away from the circuit board 2 . In order to enable the liquid cooling element 4 to quickly absorb the heat of the heating element 3 , correspondingly, between the liquid cooling element 4 and the heating element 3 Tight fit.
  • a thermal interface material (Thermal Interface Material, TIM) can be filled between the liquid cooling element 4 and the heating element 3 to reduce the liquid cooling element 4
  • TIM Thermal Interface Material
  • the thermal interface material may be silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet, or thermally conductive adhesive.
  • the liquid cooling member 4 may be a liquid cooling plate having a plate-like structure.
  • the structure of the liquid cooling member 4 may be shown in FIG. 3 , including a base plate 42 , a heat pipe 43 and two pipe joints 41 .
  • the substrate 42 is a plate-like structure capable of absorbing heat, and may be an aluminum substrate or a metal plate with relatively high thermal conductivity such as a copper substrate.
  • the heat pipe 43 is a tubular structure capable of absorbing heat, and may be a copper pipe or a metal pipe with relatively high thermal conductivity such as an aluminum pipe.
  • the heat pipe 43 is located in the base plate 42 , or the heat pipe 43 is laid on the surface of the base plate 42 , etc.
  • This embodiment does not limit the fixing method between the heat pipe 43 and the base plate 42 .
  • Both ends of the heat pipe 43 are installed with pipe joints 41 , and the two pipe joints 41 are configured to be connected to the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 respectively.
  • the drain pipe joint 51 is also a kind of pipe joint, through which the liquid discharged from the liquid cooling radiator 5 passes, so it is called a drain pipe joint.
  • liquid inlet pipe joint 52 is also a kind of pipe joint, through which the liquid entering the liquid cooling radiator 5 passes, so it is called a liquid inlet pipe joint.
  • the liquid cooling member 4 may also be a liquid cooling pipe having a tubular structure, and pipe joints 41 are installed at both ends of the liquid cooling pipe.
  • the specific structure of the liquid cooling element 4 is not limited in this embodiment, and it can be used to absorb the heat of the heating element 3.
  • the liquid cooling element 4 with a plate-like structure can be used as an example in the drawings.
  • the pipe joint 41 of the liquid cooling element 4 is fixed on the shell wall of the casing 1 of the pluggable device, for example, a pipe
  • the outwardly facing end of the joint 41 is flush with the shell wall of the housing 1 , and for example, the outwardly facing end of the pipe joint 41 protrudes from the housing 1 .
  • the two pipe joints 41 of the liquid cooling element 4 may both be located at positions of the housing 1 close to the exposed end of the pluggable device 100, and the exposed end of the pluggable device The end protruding from the information communication device when the pluggable device is inserted into the information communication device.
  • the pluggable device is an optical module.
  • both ends of the optical module along the length direction have an optical interface 8 and an electrical interface 9 respectively, and the end where the optical interface 8 is located is marked as the exposed end of the optical module.
  • the end where the electrical interface 9 is located is marked as the insertion end of the optical module.
  • the optical interface 8 is used for inserting the optical fiber connector
  • the electrical interface 9 is used for inserting into the optical cage of the optical communication equipment.
  • the two pipe joints 41 of the liquid cooling element 4 may both be located at a position of the housing 1 close to the optical interface 8 of the optical module.
  • the position of the optical interface 8 close to the optical module may be any position where the optical module protrudes from the panel of the optical communication device after the optical module is inserted into the optical communication device.
  • the two pipe joints 41 of the liquid cooling element 4 may also be located at the positions of the housing 1 close to the insertion end of the pluggable device 100 .
  • the end is the end that extends into the interior of the information communication device when the pluggable device is inserted into the information communication device.
  • the pluggable device is an optical module, and the two pipe joints 41 of the liquid cooling element 4 are both located at a position of the housing 1 close to the electrical interface 9 of the optical module.
  • one pipe joint 41 of the liquid cooling element 4 may be located at a position of the housing 1 close to the exposed end of the pluggable device, and the other pipe joint 41 of the liquid cooling element 4 It may be located at a position of the housing 1 close to the insertion end of the pluggable device.
  • the two pipe joints 41 of the liquid cooling element may also be located at positions between the exposed end and the insertion end of the pluggable device.
  • the specific positions of the two pipe joints 41 of the liquid cooling element 4 in the housing 1 are not limited in this embodiment, and can be selected flexibly according to the relationship between the liquid cooling element and the information communication device.
  • the liquid-cooled heat sink 5 is located outside the information communication device where the pluggable device is inserted, for example, the liquid-cooled heat sink 5 is located in the cabinet where the information communication device is located, or the liquid-cooled heat sink 5 is located in the computer room where the information communication device is located. . Then, the two pipe joints 41 of the liquid cooling element 4 can be located at positions close to the exposed end of the pluggable device, so that after the pluggable device is inserted into the information communication equipment, the two pipe joints 41 are exposed and can be connected with the information communication equipment.
  • the drain pipe joint 51 of the external liquid cooling heat sink 5 is connected to the liquid inlet pipe joint 52 .
  • the liquid-cooled heat sink 5 is located in the information communication device into which the pluggable device is inserted, and the liquid-cooled heat-dissipation pipe joint 51 and the liquid-intake pipe joint 52 of the liquid-cooled heat dissipation member 5 are located at the panel of the information communication device. Then, the two pipe joints 41 of the liquid cooling element 4 can be located at positions close to the exposed end of the pluggable device, so that after the pluggable device is inserted into the information communication equipment, the two pipe joints 41 are exposed and can be connected with the information communication equipment.
  • the drain pipe joint 51 at the panel is connected with the liquid inlet pipe joint 52 .
  • the liquid-cooled heat sink 5 is located in the information communication device into which the pluggable device is inserted, and the liquid-cooled heat-dissipation pipe joint 51 and the liquid inlet pipe joint 52 of the liquid-cooled heat dissipation member 5 are located inside the information communication device. Then, the two pipe joints 41 of the liquid cooling element 4 can be located at positions close to the insertion end of the pluggable device, so that after the pluggable device is inserted into the information communication device, the two pipe joints 41 are located inside the information communication device, It can be connected to the discharge pipe joint 51 and the liquid inlet pipe joint 52 located inside the information communication device.
  • the pluggable device can be integrated into the information communication device. In this way, the pluggable device does not need to be pulled out from the information communication device, so that the two pipe joints 41 of the pluggable device are always connected to the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 respectively inside the information communication equipment.
  • the pluggable device is still a pluggable type, and the positions of the discharge pipe joint 51 and the liquid inlet pipe joint 52 inside the information communication equipment correspond to the positions of the interface components of the information communication equipment.
  • the two pipe joints 41 of the pluggable device can be respectively connected with the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 located inside the information communication equipment .
  • the liquid cooling element 5 is a component for promoting the liquid to circulate between the liquid cooling element 4 and the liquid cooling element 5 .
  • the liquid-cooled heat sink 5 includes a drain pipe joint 51 , a liquid inlet pipe joint 52 and a water pump 53 . Since the liquid will evaporate during the circulation between the liquid cooling element 4 and the liquid cooling cooling element 5, correspondingly, the liquid cooling cooling element 5 not only includes the drain pipe joint 51, the liquid inlet pipe joint 52 and the water pump 53, but also includes the water tank 54 , the water tank 54 is used to store liquid.
  • the liquid in the water tank 54 may be one of deionized water, electronic fluoride liquid, and refrigerant.
  • the water pump 53 and the water tank 54 can also be connected through the connecting pipe 55 . Since the water pump 53 sucks liquid from the water tank 54 , the connecting pipe 55 is correspondingly connected to the liquid inlet of the water pump 53 and the outlet of the water tank 54 . between the liquid ports.
  • the drain pipe joint 51 can be directly installed at the liquid outlet of the water pump 53, or, as shown in FIG. , a drain pipe 56 is installed at the liquid outlet of the water pump 53 , and a drain pipe joint 51 is installed at the end of the drain pipe 56 away from the liquid outlet of the water pump 53 .
  • the liquid inlet pipe joint 52 of the liquid cooling heat sink 5 can be directly installed at the liquid inlet of the water tank 54, or, as shown in FIG. 5, the liquid inlet pipe joint 52 can also be installed at the liquid inlet of the water tank 54 through the liquid inlet pipe 57 At the mouth, for example, a liquid inlet pipe 57 is installed at the liquid inlet of the water tank 54 , and a liquid inlet pipe joint 52 is installed at the end of the liquid inlet pipe 57 away from the liquid inlet of the water tank 54 .
  • the liquid inlet of the radiator 58 and the liquid inlet pipe joint 52 are directly connected, or, the liquid inlet of the radiator 58 and the liquid inlet pipe joint 52 are connected through a liquid inlet pipe 57 .
  • the liquid outlet of the radiator 58 is directly connected to the liquid inlet of the water tank 54 , or the liquid outlet of the radiator 58 and the liquid inlet of the water tank 54 are connected through a connecting pipe 55 .
  • the specific structure of the liquid-cooled heat sink 5 is not limited in this embodiment, and the structure shown in FIG. 5 can be used as an example.
  • the two pipe joints 41 of the liquid cooling element 4 are respectively connected with the liquid cooling pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling heat dissipation element 5.
  • the two pipe joints 41 can be respectively connected with the liquid cooling heat dissipation pipe joint 51.
  • the discharge pipe joint 51 of the component 5 and the liquid inlet pipe joint 52 are directly connected.
  • the two pipe joints 41 can also be connected to the liquid-cooling radiator 5 with the liquid-cooling pipe joint 51 and the liquid-inlet pipe joint 52 through pipes, respectively.
  • one pipe joint 41 and one liquid-discharge pipe joint 51 They are connected by an infusion pipe 10
  • the other pipe joint 41 and the liquid inlet pipe joint 52 are connected by an infusion pipe 10 .
  • this embodiment does not limit the specific connection between the pipe joint of the liquid cooling element 4 and the pipe joint of the liquid cooling radiator element 5 .
  • a closed circulation loop can be formed between the liquid cooling element 4 and the liquid cooling cooling element 5 , and the liquid flows in the circulation loop to dissipate heat for the heating element 3 .
  • a liquid-cooled heat sink 5 can dissipate heat for a pluggable device 100 , as shown in FIG. 7 .
  • one liquid-cooled heat sink 5 can also dissipate heat for multiple pluggable devices 100, and the multiple pluggable devices 100 can be connected to the liquid-cooled heat sink 5 in parallel.
  • the heat dissipation of the devices 100 is independent of each other, or, the multiple pluggable devices 100 may also be connected in series on the liquid-cooled heat sink 5, and the heat dissipation of the multiple pluggable devices 100 has a cascade relationship. For example, as shown in FIG.
  • a liquid-cooled heat sink 5 dissipates heat for two pluggable devices 100 , the two pluggable devices 100 are connected in parallel on the liquid-cooled heat sink 5 , and the heat dissipation of the two pluggable devices 100 Independent.
  • a liquid-cooled heat sink 5 dissipates heat for two pluggable devices 100 , and the two pluggable devices 100 are connected in series on the liquid-cooled heat sink 5 . Heat dissipation has a cascading relationship.
  • liquid-cooled heat sink 5 is used for heat dissipation of several pluggable devices, and can be flexibly set according to actual needs.
  • the water pump 53 of the liquid cooling radiator 5 runs, and the The low temperature liquid is sucked in 54, and the low temperature liquid is discharged into the heat pipe 43 of the liquid cooling part 4, the low temperature liquid absorbs the heat of the liquid cooling part 4 and the temperature rises, and the liquid whose temperature rises flows to the water tank 54 for cooling, and the temperature is lowered. The latter liquid is sucked by the water pump 53 again.
  • the liquid circulates between the liquid cooling element 4 and the liquid cooling cooling element 5 to cool the liquid cooling element 4, so as to increase the temperature difference between the liquid cooling element 4 and the heating element 3, while the liquid cooling element 4 and the heating element 3 contact, which can accelerate the heat transfer between the liquid cooling element 4 and the heating element 3, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the liquid used for temperature reduction circulates between the liquid cooling element 4 and the liquid cooling cooling element 5, which can reduce the waste of liquid and save resources.
  • the pluggable device includes a liquid cooling part 4, which is located in the casing of the pluggable device and contacts the heating element 3 in the casing, and the two pipe joints of the liquid cooling part 4 41 is located on the shell wall of the housing, and the two pipe joints 41 can be used to connect with the liquid-cooling radiator 5's discharge pipe joint 51 and liquid inlet pipe joint 52 .
  • the liquid used for cooling can flow between the liquid cooling element 4 and the liquid cooling cooling element 5 to absorb the temperature of the liquid cooling element 4, cool the liquid cooling element 4, and increase the gap between the liquid cooling element 4 and the heating element 3.
  • the temperature difference between the two makes the liquid cooling element 4 quickly absorb the heat generated by the heating element 3, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the embodiment of the present application further provides an information communication device, which is a device for inserting a pluggable device and having the above-mentioned liquid-cooled heat sink 5.
  • the pluggable device is an optical module
  • the information communication device is an optical communication device, which may be, for example, a switch device, an access point (Access Point, AP) device, and the like.
  • the information communication device includes a chassis 6, an interface part 7 and a liquid-cooled heat sink 5; the interface part 7 and the liquid-cooled heat sink 5 are both located in the chassis 6, and the socket of the interface part 7 is located in the chassis 6; the drain pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 are configured to be respectively connected with the two pipe joints 41 of the pluggable device inserted in the interface part 7.
  • the pluggable The pluggable device is the above-mentioned pluggable device.
  • the interface component 7 may also be referred to as an optical cage.
  • the socket of the interface part 7 is located at the panel of the chassis 6 , so that the socket of the interface part 7 is exposed so that the pluggable device can be inserted into the interface part 7 .
  • the two pipe joints 41 of the liquid cooling element 4 of the pluggable equipment can be respectively connected to the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 .
  • the two pipe joints 41 of the liquid cooling element 4 may be located at positions close to the exposed end of the pluggable device. Then, as shown in FIG. 9 , the drain pipe joints 51 of the liquid cooling element 5 and The liquid inlet pipe joint 52 can be located at the panel of the machine frame 6, so that after the pluggable device is inserted into the information communication device, the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 located at the front panel of the machine frame 6 can be respectively connected with the The two pipe joints 41 on the panel of the machine frame 6 are connected.
  • the two pipe joints 41 of the liquid cooling element 4 are located at positions close to the insertion end of the pluggable device. Then, the liquid cooling pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling element 5 can be It is located inside the machine frame 6 and corresponds to the position of the interface part 7, so that after the pluggable device is inserted into the information communication device, the drain pipe joint 51 and the liquid inlet pipe joint 52 located inside the machine frame 6 can be respectively connected with those located in the machine frame 6. The two pipe joints 41 inside the frame 6 are connected.
  • the drain pipe joint 51 and the liquid inlet pipe joint 52 are specifically located at the panel of the machine frame 6 or inside the machine frame 6, which is not limited, and can be based on the two pipe joints 41 of the pluggable equipment location to flexibly choose.
  • an information communication device has a plurality of interface parts 7 so that the information communication device can be connected with a plurality of pluggable devices.
  • the number of the interface components 7 may be multiple, and the number of the liquid cooling element 5 may be at least one.
  • the interface part 7 and the liquid-cooled heat sink 5 may be in one-to-one correspondence, or one liquid-cooled heat sink 5 may be opposite to a plurality of interface parts 7 .
  • the information communication device includes a liquid-cooled heat sink 5, a liquid-cooled heat-dissipation pipe joint 51 and a liquid inlet pipe joint 52, which can be respectively connected with the The two pipe joints 41 are connected.
  • the liquid used for cooling can flow between the liquid cooling element 4 of the pluggable device and the liquid cooling radiator 5 of the information communication equipment, so as to absorb the temperature of the liquid cooling element 4, cool the liquid cooling element 4, and increase the temperature of the liquid cooling element 4.
  • the temperature difference between the liquid cooling element 4 and the heating element 3 prompts the liquid cooling element 4 to quickly absorb the heat generated by the heating element 3, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the embodiment of the present application also provides a heat dissipation system, which includes an information communication device, a liquid-cooled heat sink 5 and the above-mentioned pluggable device; the pluggable device is inserted into the interface part 7 of the information communication device , the two pipe joints 41 of the pluggable device are respectively connected with the discharge pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 .
  • the pluggable device may be an optical module, then, the information communication device to which the pluggable device is inserted may be an optical communication device.
  • the liquid cooling element 5 may be located in the frame 6 of the information communication device.
  • the two pipe joints 41 of the liquid cooling element 4 are located near the exposed end of the pluggable device.
  • the liquid-cooled heat sink 5 can be located in the frame 6 of the information communication equipment, and the liquid-cooled heat-dissipation pipe joint 51 and the liquid inlet pipe joint 52 of the liquid-cooled heat-dissipation member 5 are both located at the panel of the machine frame 6, so as to facilitate the After the pluggable device is inserted into the information communication device, the drain pipe joint 51 and the liquid inlet pipe joint 52 located at the panel of the frame 6 can be respectively connected with the two pipe joints 41 protruding from the panel of the frame 6 .
  • the liquid cooling element 5 may be located in the frame 6 of the information communication device.
  • the two pipe joints 41 of the liquid cooling element 4 are located at positions close to the insertion end of the pluggable device, then,
  • the liquid-cooled heat sink 5 may be located in the frame 6 of the information communication device, and the drain pipe joint 51 and the liquid inlet pipe joint 52 of the liquid-cooled heat sink 5 may be located inside the machine frame 6 and correspond to the position of the interface part 7 . , so that after the pluggable device is inserted into the information communication device, the drain pipe joint 51 and the liquid inlet pipe joint 52 inside the machine frame 6 can be connected to the two pipe joints 41 inside the machine frame 6 respectively.
  • the liquid cooling element 5 may also be located in the equipment room where the information communication equipment is located, for example, in a cabinet of the equipment room, or may be located in an air duct between two cabinets.
  • the heat dissipation system includes a liquid-cooled heat sink 5 and a pluggable device with a liquid-cooled member 4.
  • the pluggable device is inserted into the information and communication equipment.
  • the drain pipe of the liquid-cooled heat sink 5 The joint 51 and the liquid inlet pipe joint 52 are respectively connected with the two pipe joints 41 of the liquid cooling element 4 .
  • the liquid used for cooling can flow between the liquid cooling part 4 of the pluggable device and the liquid cooling heat sink 5 of the information communication device, so as to absorb the temperature of the liquid cooling part 4, cool the liquid cooling part 4, and increase the temperature of the liquid cooling part 4.
  • the temperature difference between the liquid cooling element 4 and the heating element 3 prompts the liquid cooling element 4 to quickly absorb the heat generated by the heating element 3, thereby enhancing the effect of heat dissipation for the pluggable device.
  • the embodiment of the present application also provides a method for manufacturing a pluggable device, the method may include the following steps:
  • the circuit board 2 is installed in the housing 1 .
  • the size of the circuit board 2 matches the size of the casing 1 so that the circuit board 2 can be fixed in the casing 1 .
  • the heating element 3 is soldered on the surface of the circuit board 2 .
  • the heating element 3 is a component with high working power in the pluggable device, which can generate more heat during operation.
  • it can be the main function device, control chip and power management component of the pluggable device. at least one.
  • the heating element 3 can be soldered on the surface of the circuit board 2 by tin.
  • the liquid cooling element 4 is installed on the surface of the heating element 3 away from the circuit board 2 , and the two pipe joints 41 of the liquid cooling element 4 are fixed to the shell wall of the housing 1 .
  • the two pipe joints 41 are configured to be respectively connected to the liquid discharge pipe joint 51 and the liquid inlet pipe joint 52 of the liquid cooling radiator 5 .
  • a thermal interface material may be filled between the liquid cooling element 4 and the heating element 3 to speed up the Heat transfer between the liquid cooling element 4 and the heating element 3 .
  • the manufactured pluggable device includes a liquid cooling part 4, the liquid cooling part 4 is located in the housing of the pluggable device, and is in contact with the heating element 3 in the housing.
  • the pipe joints 41 are located on the shell wall of the casing, and the two pipe joints 41 can be used to connect with the discharge pipe joints 51 and the liquid inlet pipe joints 52 of the liquid cooling radiator 5 .
  • the liquid used for cooling can flow between the liquid cooling element 4 and the liquid cooling cooling element 5 to absorb the temperature of the liquid cooling element 4, cool the liquid cooling element 4, and increase the gap between the liquid cooling element 4 and the heating element 3.
  • the temperature difference between the two causes the liquid cooling element 4 to quickly absorb the heat generated by the heating element 3, thereby enhancing the effect of heat dissipation for pluggable devices such as optical modules.

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Abstract

本申请公开了一种可插拔设备、信息通信设备、散热系统和制造方法，属于散热技术领域。所述可插拔设备包括壳体、线路板、发热元件和液冷件；所述线路板、所述发热元件和所述液冷件依次叠加位于所述壳体中，所述液冷件的两个管接头均固定于所述壳体的壳壁；所述液冷件的两个管接头，被配置为分别与液冷散热件的排液管接头和进液管接头相连。采用本申请，用于降温的液体能够在液冷件和液冷散热件之间流动，以吸收液冷件的温度，为液冷件降温，增大液冷件和发热元件之间的温差，促使液冷件快速吸收发热元件产生的热量，进而增强为可插拔设备进行散热的效果。

Description

可插拔设备、信息通信设备、散热系统和制造方法
本申请要求于2020年11月13日提交的申请号为202011266492.0、发明名称为“散热方法、散热结构及设备”，以及于2021年2月26日提交的申请号为202110221094.5、发明名称为“可插拔设备、信息通信设备、散热系统和制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域，特别涉及一种可插拔设备、信息通信设备、散热系统和制造方法。
背景技术
可插拔设备，如进行光电转换的光模块，在光纤通信中配合光通信设备使用，例如，光模块的一端插在交换机的光笼子(即接口部件)中，光模块的另一端供光缆的光纤连接头插入。
光模块在工作中会产生热量，为了给光模块散热，通常会在交换机的光笼子的壳体外表面安装散热器。这样，光模块产生的热量经由光笼子的壳体传递至散热器，由散热器向外散发。
但是插入光笼子的光模块与光笼子的壳体之间具有间隙，光笼子的壳体和散热器之间也具有间隙，导致为光模块进行散热的效果较差。
发明内容
本申请提供了一种可插拔设备、信息通信设备、散热系统和制造方法，能够克服相关技术中的问题，所述技术方案如下：
一方面，提供了一种可插拔设备，所述可插拔设备包括壳体、线路板、发热元件和液冷件；
所述线路板、所述发热元件和所述液冷件依次叠加位于所述壳体中，所述液冷件的两个管接头均固定于所述壳体的壳壁；
所述液冷件的两个管接头，被配置为分别与液冷散热件的排液管接头和进液管接头相连。
在一种示例中，可插拔设备的两个管接头分别与液冷散热件的排液管接头和进液管接头连接以后，液冷散热件的水泵运行，可以从液冷散热件的水箱中吸入低温液体，并将低温液体排入到液冷件的热管中，低温液体吸收液冷件的热量而温度升高，温度升高的液体又流向水箱中进行降温，降温后的液体再次被水泵吸入。
这样，液体在液冷件和液冷散热件之间循环流动，为液冷件降温，以增大液冷件和发热元件之间的温差，而液冷件与发热元件接触，进而能够加快液冷件和发热元件之间的热量传 递，进而增强为可插拔设备进行散热的效果。
在一种可能的实现方式中，所述液冷件的两个管接头均位于所述壳体的靠近所述可插拔设备的外露端的位置处，所述可插拔设备的外露端为所述可插拔设备插入信息通信设备时伸出于所述信息通信设备的端部。
其中，靠近可插拔设备的外露端的位置可以是，可插拔设备插入信息通信设备后，可插拔设备的伸出于信息通信设备面板的任意位置。
在一种示例中，液冷散热件位于可插拔设备所插的信息通信设备的外部，如液冷散热件位于信息通信设备所在的机柜中，或者液冷散热件位于信息通信设备所在的机房中。那么，液冷件的两个管接头可以位于可插拔设备的靠近外露端的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头外露，能够与位于信息通信设备外部的液冷散热件的排液管接头和进液管接头相连。
在另一种示例中，液冷散热件位于可插拔设备所插的信息通信设备中，且液冷散热件的排液管接头和进液管接头位于信息通信设备的面板处。那么，液冷件的两个管接头可以位于可插拔设备的靠近外露端口的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头外露，能够与位于信息通信设备面板处的排液管接头和进液管接头相连。
在一种可能的实现方式中，所述液冷件的两个管接头均位于所述壳体的靠近所述可插拔设备的插入端的位置处，所述可插拔设备的插入端为所述可插拔设备插入信息通信设备时伸入于所述信息通信设备内部的端部。
在一种示例中，液冷散热件位于可插拔设备所插的信息通信设备中，且液冷散热件的排液管接头和进液管接头位于信息通信设备的内部。那么，液冷件的两个管接头可以位于可插拔设备的靠近插入端的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头位于信息通信设备的内部，能够与位于信息通信设备内部的排液管接头和进液管接头相连。
在一种可能的实现方式中，所述发热元件和所述液冷件之间填充有热界面材料。
其中，热界面材料可以是硅脂、硅胶、散热垫片、相变化材料、相变化金属片或者导热胶等。
在一种示例中，液冷件位于发热元件的远离线路板的表面，为了促使液冷件能够快速吸收发热元件的热量，相应的，液冷件和发热元件之间紧密贴合。为了进一步减少液冷件和发热元件之间的接触热阻，相应的，液冷件和发热元件之间可以填充热界面材料(Thermal Interface Material，TIM)，以减少液冷件和发热元件之间的接触热阻，加快液冷件和发热元件之间的热传递。
在一种可能的实现方式中，所述发热元件为所述可插拔设备的主功能器件、控制芯片和电源管理件中的至少一种。
其中，发热元件可以是可插拔设备在运行中，能产生较多热量的元器件。
例如，发热元件可以为可插拔设备的主功能器件、控制芯片和电源管理件中的至少一种。
另一方面，提供了一种信息通信设备，所述信息通信设备包括机框、接口部件和液冷散热件；
所述接口部件和所述液冷散热件均位于所述机框中，且所述接口部件的插口位于所述机框的面板处；
所述液冷散热件的排液管接头和进液管接头，被配置为分别与插在所述接口部件中的可插拔设备的两个管接头相连，所述可插拔设备为上述所述的可插拔设备。
在一种示例中，该信息通信设备包括液冷散热件，液冷散热件的排液管接头和进液管接头，能够分别与插在信息通信设备上的可插拔设备的两个管接头相连。这样，用于降温的液体能够在可插拔设备的液冷件和信息通信设备的液冷散热件之间流动，以吸收液冷件的温度，为液冷件降温，增大液冷件和发热元件之间的温差，促使液冷件快速吸收发热元件产生的热量，进而增强为可插拔设备进行散热的效果。
在一种可能的实现方式中，所述液冷散热件的排液管接头和进液管接头均位于所述机框的面板处。
在一种示例中，液冷件的两个管接头可以位于可插拔设备的靠近外露端的位置处，那么，液冷散热件的排液管接头和进液管接头可以位于机框的面板处，以便于可插拔设备插入信息通信设备以后，位于机框面板处的排液管接头和进液管接头能够分别与伸出于机框面板的两个管接头相连。
在一种可能的实现方式中，所述液冷散热件的排液管接头和进液管接头均位于所述机框的内部，且对应接口部件的位置处。
在一种示例中，液冷件的两个管接头位于可插拔设备的靠近插入端的位置处，那么，液冷散热件的排液管接头和进液管接头可以位于机框的内部，且对应接口部件的位置处，以便于可插拔设备插入信息通信设备以后，位于机框内部的排液管接头和进液管接头能够分别与位于机框内部的两个管接头相连。
在一种可能的实现方式中，所述接口部件的数量为多个，所述液冷散热件的数量为至少一个。
在一种示例中，一个信息通信设备具有多个接口部件，以便于信息通信设备能够与多个可插拔设备连接。相应的，接口部件的数量可以为多个，而液冷散热件的数量可以为至少一个。
其中，接口部件和液冷散热件可以是一一对应，使得一个液冷散热件可以为一个接口部件中的可插拔设备进行散热。
或者，也可以是一个液冷散热件与多个接口部件相对，使得一个液冷散热件可以为多个接口部件中的可插拔设备进行散热。
另一方面，提供了一种散热系统，所述散热系统包括信息通信设备、液冷散热件和上述所述的可插拔设备；
所述可插拔设备插在所述信息通信设备的接口部件中，所述可插拔设备的两个管接头分别与所述液冷散热件的排液管接头和进液管接头相连。
在一种示例中，该散热系统包括液冷散热件和具有液冷件的可插拔设备，可插拔设备插 在信息通信设备，需要散热时，液冷散热件的排液管接头和进液管接头，分别与液冷件的两个管接头相连。这样，用于降温的液体能够在可插拔设备的液冷件和信息通信设备的液冷散热件之间流动，以吸收液冷件的温度，为液冷件降温，增大液冷件和发热元件之间的温差，促使液冷件快速吸收发热元件产生的热量，进而增强为可插拔设备进行散热的效果。
在一种可能的实现方式中，所述液冷散热件位于所述信息通信设备的机框中，且所述液冷散热件的排液管接头和进液管接头均位于所述机框的面板处。
在一种示例中，液冷件的两个管接头位于可插拔设备的靠近光接口的位置处，那么，液冷散热件可以位于信息通信设备的机框中，且液冷散热件的排液管接头和进液管接头均位于机框的面板处，以便于可插拔设备插入信息通信设备以后，位于机框面板处的排液管接头和进液管接头能够分别与伸出于机框面板的两个管接头相连。
在一种可能的实现方式中，所述液冷散热件位于所述信息通信设备所在的机房中。
在一种示例中，液冷散热件也可以位于信息通信设备所在的机房中，例如，位于机房的机柜中，也可以位于两个机柜之间的风道中。
另一方面，提供了一种可插拔设备的制造方法，包括：
将线路板安装在壳体中；
将发热元件焊接在所述线路板的表面；
将液冷件安装在所述发热元件的远离所述线路板的表面，并将所述液冷件的两个管接头均固定在所述壳体的壳壁；
其中，所述两个管接头被配置为分别与液冷散热件的排液管接头和进液管接头相连。
在一种示例中，按照上述方法制造出的可插拔设备包括液冷件，液冷件位于可插拔设备的壳体中，与壳体中的发热元件接触，液冷件的两个管接头位于壳体的壳壁，两个管接头能够用来与液冷散热件的排液管接头和进液管接头相连。这样，用于降温的液体能够在液冷件和液冷散热件之间流动，以吸收液冷件的温度，为液冷件降温，增大液冷件和发热元件之间的温差，促使液冷件快速吸收发热元件产生的热量，进而增强为可插拔设备进行散热的效果。
以上方案中的信息通信设备可以是交换机、路由器、接入点(Access Point，AP)设备和刀片服务器等，其中本实施例对信息通信设备的具体产品不做限定，可以是供上述可插拔设备插入的任意设备。
附图说明
图1是本申请提供的一种液冷散热技术的应用示意图；
图2是本申请提供的一种包括液冷件的可插拔设备的结构示意图；
图3是本申请提供的一种可插拔设备的液冷件的结构示意图；
图4是本申请提供的一种可插拔设备的结构示意图；
图5是本申请提供的一种液冷散热件的结构示意图；
图6是本申请提供的一种液冷散热件的结构示意图；
图7是本申请提供的一种液冷散热件和可插拔设备的液冷件连接的结构示意图；
图8是本申请提供的一种液冷散热件和可插拔设备的液冷件连接的结构示意图；
图9是本申请提供的一种液冷散热件和可插拔设备的液冷件连接的结构示意图；
图10是本申请提供的一种包括液冷散热件的信息通信设备的结构示意图。
图例说明
1、壳体；2、线路板；3、发热元件；
4、液冷件；41、管接头；42、基板；43、热管；
5、液冷散热件；51、排液管接头；52、进液管接头；53、水泵；54、水箱；55、连接管；56、排液管；57、进液管；58、散热器；
6、机框；7、接口部件；8、光接口；9、电接口；10、输液管；100、可插拔设备。
具体实施方式
本申请实施例提供了一种可插拔设备，可插拔设备可以是插入到信息通信设备中，在工作中，产生较多热量的设备，例如，可插拔设备可以是光模块，又例如，可插拔设备也可以是可插拔硬盘等。其中，本实施例对可插拔设备的具体产品不做限定，可以是在工作中产生较多热量的任意设备。
其中，信息通信设备可以是信息和通信技术领域中的设备，可以简称ICT(Information Communications Technology)设备，是可插拔设备所插入的设备。例如，可插拔设备为光模块，那么所插的信息通信设备可以为光通信设备，如交换机、接入点(Access Point，AP)设备和路由器等。又例如，可插拔设备为可插拔硬盘，那么所插的信息通信设备可以是计算机设备和刀片服务器等。其中，本实施例对信息通信设备的具体产品也不做限定，可以是供上述可插拔设备插入的任意设备。
可插拔设备在工作中会产生热量，本方案利用液冷散热技术，为可插拔设备散热，能够增强为可插拔设备进行散热的效果。
例如，可插拔设备为光模块，光模块是一种进行光信号和电信号转换的部件，在光纤通信中配合光通信设备使用，例如，光模块的一端插在光通信设备的接口部件(接口部件也可以称为光笼子)中，光模块的另一端供光缆的光纤连接头插入。而光模块在工作中会产生热量，利用液冷散热技术，为光模块散热，能够增强为光模块进行散热的效果。
为便于介绍本方案，首先介绍液冷散热技术，如图1所示，液冷散热技术中包括液冷件4和液冷散热件5，液冷件4和液冷散热件5之间通过管道连接，形成闭合的循环回路，液体在该循环回路中流动，以达到降温效果，其中图1中的箭头为液体在循环回路中的一种可能的流动方向。其中，液冷件4用于吸收发热元件3的热量，液冷散热件5用于促使液体在液冷件4和液冷散热件5之间流通，还能用于降低液体的温度等。
本方案中将液冷散热技术应用在可插拔设备中，为可插拔设备散热，可插拔设备如光模块的体积较小，液冷件4可以位于可插拔设备的壳体中，与可插拔设备内部的发热元件接触，以吸收发热元件的热量，而液冷散热件5可以位于可插拔设备的壳体外，例如，可以位于可插拔设备所插的信息通信设备中，也可以位于可插拔设备所插的信息通信设备所在的机房中。下面将详细介绍本方案。
如图2所示，该可插拔设备100包括壳体1、线路板2、发热元件3和液冷件4。线路板2、发热元件3和液冷件4依次叠加位于壳体1中，示例性地，发热元件3位于线路板2的表面，液冷件4位于发热元件3的远离线路板2的表面。液冷件4具有两个管接头41，两个管接头41均固定于壳体1的壳壁，被配置为分别与液冷散热件5的排液管接头51和进液管接头52相连。
其中，发热元件3可以是可插拔设备100在运行中，能产生较多热量的元器件。
例如，发热元件3可以是可插拔设备100的主功能器件、控制芯片和电源管理件中的至少一种。其中，主功能器件是可插拔设备实现其主要功能的器件，例如，可插拔设备为光模块，那么功能器件可以为光器件，用于实现光信号和电信号的转换。
示例性地，发热元件3可以是主功能器件，也可以是控制芯片，还可以是电源管理件。又示例性地，发热元件3可以是包括主功能器件和控制芯片的组件，也可以是包括主功能器件和电源管理件的组件，还可以是包括控制芯片和电源管理件的组件。又示例性地，发热元件3可以是包括主功能器件、控制芯片和电源管理件的组件。
其中，本实施例对发热元件3不做限定，可以根据可插拔设备中各个元器件的工作功率确定，例如，将工作功率高于设定阈值的元器件确定为发热元件。为便于介绍，可以以如图2所示的发热元件3为包括主功能器件、控制芯片和电源管理件的组件进行示例。
其中，液冷件4是一种能够吸收发热元件3产生的热量的部件。
在一种示例中，液冷件4位于发热元件3的远离线路板2的表面，为了促使液冷件4能够快速吸收发热元件3的热量，相应的，液冷件4和发热元件3之间紧密贴合。
为了进一步减少液冷件4和发热元件3之间的接触热阻，相应的，液冷件4和发热元件3之间可以填充热界面材料(Thermal Interface Material，TIM)，以减少液冷件4和发热元件3之间的接触热阻，加快液冷件4和发热元件3之间的热传递。
其中，热界面材料可以是硅脂、硅胶、散热垫片、相变化材料、相变化金属片或者导热胶等。
在一种示例中，液冷件4可以是具有板状结构的液冷板，例如，液冷件4的结构可以参考图3所示，包括基板42、热管43和两个管接头41。基板42是能够吸收热量的板状结构，在材质上可以是铝基板，也可以是铜基板等热导率比较高的金属板。热管43是能够吸收热量的管状结构，在材质上可以是铜管，也可以是铝管等热导率比较高的金属管。热管43位于基板42中，或者，热管43铺设在基板42的表面等，本实施例对热管43和基板42之间的固定方式不做限定。热管43的两端均安装有管接头41，两个管接头41被配置为分别与液冷散热件5的排液管接头51和进液管接头52相连。
其中，排液管接头51也是一种管接头，液冷散热件5排出的液体由此通过，故称为排液管接头。
同样，进液管接头52也是一种管接头，进入到液冷散热件5的液体由此通过，故称为进液管接头。
在另一种示例中，液冷件4也可以是具有管状结构的液冷管，液冷管的两端均安装有管接头41。其中，本实施例对液冷件4的具体结构不做限定，能够用来吸收发热元件3的热量即可，附图中可以以板状结构的液冷件4进行示例。
为了使液冷件4的管接头41能够与位于可插拔设备外部的液冷散热件5相连，相应的， 管接头41固定于可插拔设备的壳体1的壳壁上，例如，管接头41的朝外的端部与壳体1的壳壁齐平，又例如，管接头41的朝外的端部伸出于壳体1。
关于液冷件4的两个管接头41的位置，液冷件4的两个管接头41可以均位于壳体1的靠近可插拔设备100的外露端的位置处，可插拔设备的外露端为可插拔设备插入信息通信设备时伸出于信息通信设备的端部。
例如，可插拔设备为光模块，如图4所示，光模块沿着长度方向的两端分别具有光接口8和电接口9，光接口8所在的端部记为光模块的外露端，电接口9所在的端部记为光模块的插入端。其中，光接口8用于供光纤连接头插入，电接口9用于插入光通信设备的光笼子中。
那么，液冷件4的两个管接头41可以均位于壳体1的靠近光模块的光接口8的位置处。其中，靠近光模块的光接口8的位置可以是，光模块插入光通信设备后，光模块的伸出于光通信设备面板的任意位置。
关于液冷件4的两个管接头41的位置，液冷件4的两个管接头41也可以均位于壳体1的靠近可插拔设备100的插入端的位置处，可插拔设备的插入端为可插拔设备插入信息通信设备时伸入于信息通信设备内部的端部。例如，可插拔设备为光模块，液冷件4的两个管接头41均位于壳体1的靠近光模块的电接口9的位置处。
关于液冷件4的两个管接头41的位置，液冷件4的一个管接头41可以位于壳体1的靠近可插拔设备的外露端的位置处，液冷件4的另一个管接头41可以位于壳体1的靠近可插拔设备的插入端的位置处。
当然，液冷件的两个管接头41也可以位于可插拔设备的外露端和插入端之间的位置处。
其中，本实施例对液冷件4的两个管接头41在壳体1的具体位置不做限定，可以根据液冷散热件和信息通信设备之间的关系灵活选择。
例如，液冷散热件5位于可插拔设备所插的信息通信设备的外部，如液冷散热件5位于信息通信设备所在的机柜中，或者液冷散热件5位于信息通信设备所在的机房中。那么，液冷件4的两个管接头41可以位于可插拔设备的靠近外露端的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头41外露，能够与位于信息通信设备外部的液冷散热件5的排液管接头51和进液管接头52相连。
又例如，液冷散热件5位于可插拔设备所插的信息通信设备中，且液冷散热件5的排液管接头51和进液管接头52位于信息通信设备的面板处。那么，液冷件4的两个管接头41可以位于可插拔设备的靠近外露端的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头41外露，能够与位于信息通信设备面板处的排液管接头51和进液管接头52相连。
又例如，液冷散热件5位于可插拔设备所插的信息通信设备中，且液冷散热件5的排液管接头51和进液管接头52位于信息通信设备的内部。那么，液冷件4的两个管接头41可以位于可插拔设备的靠近其插入端的位置处，以便于可插拔设备插入信息通信设备以后，两个管接头41位于信息通信设备的内部，能够与位于信息通信设备内部的排液管接头51和进液管接头52相连。
其中，对于液冷件4的两个管接头41位于可插拔设备的靠近插入端的位置处的方案，可插拔设备可以集成在信息通信设备中。这样可插拔设备无需从信息通信设备中拔出，使得可插拔设备的两个管接头41分别与位于信息通信设备内部的排液管接头51和进液管接头52始终保持相连状态。
或者，可插拔设备依然是可插拔式，而位于信息通信设备内部的排液管接头51和进液管接头52的位置与信息通信设备的接口部件的位置相对应。当可插拔设备插入信息通信设备的接口部件中，且插到底时，可插拔设备的两个管接头41能够分别与位于信息通信设备内部的排液管接头51和进液管接头52相连。
其中，液冷散热件5是一种用于促使液体在液冷件4和液冷散热件5之间流通的部件。
参考图5所示，液冷散热件5包括排液管接头51、进液管接头52和水泵53。由于液体在液冷件4和液冷散热件5之间流通中会发生蒸发，相应的，液冷散热件5不仅包括排液管接头51、进液管接头52和水泵53，还包括水箱54，水箱54用于存储液体。
其中，水箱54中的液体可以是去离子水、电子氟化液、制冷剂中的一种。
如图5所示，水泵53和水箱54之间也可以通过连接管55相连，由于水泵53从水箱54中吸入液体，相应的，连接管55连接在水泵53的进液口和水箱54的出液口之间。排液管接头51可以直接安装在水泵53的出液口处，或者，如图5所示，排液管接头51也可以通过排液管56安装在水泵53的出液口处，示例性地，水泵53的出液口处安装有排液管56，排液管56的远离水泵53的出液口的端部安装有排液管接头51。
液冷散热件5的进液管接头52可以直接安装在水箱54的进液口处，或者，如图5所示，进液管接头52也可以通过进液管57安装在水箱54的进液口处，示例性地，水箱54的进液口处安装有进液管57，进液管57的远离水箱54的进液口的端部安装有进液管接头52。
在另一种示例中，为了快速降低流入液冷散热件5中的液体的温度，相应的，如图6所示，液冷散热件5还可以包括散热器58，散热器58位于水箱54的进液口和进液管接头52之间。示例性地，散热器58的进液口和进液管接头52直接相连，或者，散热器58的进液口和进液管接头52之间通过进液管57相连。散热器58的出液口和水箱54的进液口直接相连，或者，散热器58的出液口和水箱54的进液口之间通过连接管55相连。
其中，本实施例对液冷散热件5的具体结构不做限定，可以以如图5所示的结构进行示例。
如上述所述，液冷件4的两个管接头41分别与液冷散热件5的排液管接头51和进液管接头52相连，相应的，两个管接头41可以分别与液冷散热件5的排液管接头51和进液管接头52直接相连。或者，两个管接头41也可以分别与液冷散热件5的排液管接头51和进液管接头52通过管道相连，例如，如图7所示，一个管接头41和排液管接头51之间通过一根输液管10相连，另一个管接头41和进液管接头52之间通过一根输液管10相连。
其中，本实施例对液冷件4的管接头和液冷散热件5的管接头之间的具体连接方式不做限定，可以以如图7所示的，通过输液管10相连进行示例。
这样，液冷件4和液冷散热件5之间能够形成闭合的循环回路，液体在该循环回路中流动，为发热元件3散热。
在一种示例中，一个液冷散热件5可以为一个可插拔设备100进行散热，可以参见如图7所示。在另一种示例中，一个液冷散热件5也可以为多个可插拔设备100进行散热，这多个可插拔设备100可以并联在液冷散热件5上，这多个可插拔设备100的散热相互独立，或者，这多个可插拔设备100也可以串联在液冷散热件5上，这多个可插拔设备100的散热具有级联关系。例如，如图8所示，一个液冷散热件5为两个可插拔设备100散热，这两个可 插拔设备100并联在液冷散热件5上，两个可插拔设备100的散热相互独立。又例如，如图9所示，一个液冷散热件5为两个可插拔设备100散热，这两个可插拔设备100串联在液冷散热件5上，两个可插拔设备100的散热具有级联关系。
其中，本实施例对一个液冷散热件5为几个可插拔设备进行散热不做限定，可以根据实际需求灵活设置。
基于上述所述，可插拔设备的两个管接头41分别与液冷散热件5的排液管接头51和进液管接头52连接以后，液冷散热件5的水泵53运行，可以从水箱54中吸入低温液体，并将低温液体排入到液冷件4的热管43中，低温液体吸收液冷件4的热量而温度升高，温度升高的液体又流向水箱54中进行降温，降温后的液体再次被水泵53吸入。这样，液体在液冷件4和液冷散热件5之间循环流动，为液冷件4降温，以增大液冷件4和发热元件3之间的温差，而液冷件4与发热元件3接触，进而能够加快液冷件4和发热元件3之间的热量传递，进而增强为可插拔设备进行散热的效果。
而且，用于降温的液体在液冷件4和液冷散热件5之间循环流动，能够减少液体的浪费，节约资源。
在本申请示例中，该可插拔设备包括液冷件4，液冷件4位于可插拔设备的壳体中，与壳体中的发热元件3接触，液冷件4的两个管接头41位于壳体的壳壁，两个管接头41能够用来与液冷散热件5的排液管接头51和进液管接头52相连。这样，用于降温的液体能够在液冷件4和液冷散热件5之间流动，以吸收液冷件4的温度，为液冷件4降温，增大液冷件4和发热元件3之间的温差，促使液冷件4快速吸收发热元件3产生的热量，进而增强为可插拔设备进行散热的效果。
本申请实施例，还提供了一种信息通信设备，该信息通信设备是用于供可插拔设备插入，且具有上述所述的液冷散热件5的设备，例如，可插拔设备为光模块，那么，该信息通信设备为光通信设备，示例性地，可以是交换机设备和接入点(Access Point，AP)设备等。
如图9所示，该信息通信设备包括机框6、接口部件7和液冷散热件5；接口部件7和液冷散热件5均位于机框6中，且接口部件7的插口位于机框6的面板处；液冷散热件5的排液管接头51和进液管接头52，被配置为分别与插在接口部件7中的可插拔设备的两个管接头41相连，该可插拔设备为上述所述的可插拔设备。
其中，接口部件7也可以称为光笼子。
在一种示例中，接口部件7的插口位于机框6的面板处，以便于接口部件7的插口外露，使得可插拔设备能够插入接口部件7中。可插拔设备插入接口部件7中以后，可插拔设备的液冷件4的两个管接头41能够分别与液冷散热件5的排液管接头51和进液管接头52相连。
在一种示例中，液冷件4的两个管接头41可以位于可插拔设备的靠近其外露端的位置处，那么，如图9所示，液冷散热件5的排液管接头51和进液管接头52可以位于机框6的面板处，以便于可插拔设备插入信息通信设备以后，位于机框6面板处的排液管接头51和进液管接头52能够分别与伸出于机框6面板的两个管接头41相连。
在另一种示例中，液冷件4的两个管接头41位于可插拔设备的靠近其插入端的位置处，那么，液冷散热件5的排液管接头51和进液管接头52可以位于机框6的内部，且对应接口部件7的位置处，以便于可插拔设备插入信息通信设备以后，位于机框6内部的排液管接头 51和进液管接头52能够分别与位于机框6内部的两个管接头41相连。
其中，本实施例对排液管接头51和进液管接头52具体在机框6的面板处，还是在机框6的内部，不做限定，可以根据可插拔设备的两个管接头41的位置来灵活选择。
通常情况下，一个信息通信设备具有多个接口部件7，以便于信息通信设备能够与多个可插拔设备连接。相应的，如图9所示，接口部件7的数量可以为多个，而液冷散热件5的数量可以为至少一个。其中，接口部件7和液冷散热件5可以是一一对应，也可以是一个液冷散热件5与多个接口部件7相对。
在本申请示例中，该信息通信设备包括液冷散热件5，液冷散热件5的排液管接头51和进液管接头52，能够分别与插在信息通信设备上的可插拔设备的两个管接头41相连。这样，用于降温的液体能够在可插拔设备的液冷件4和信息通信设备的液冷散热件5之间流动，以吸收液冷件4的温度，为液冷件4降温，增大液冷件4和发热元件3之间的温差，促使液冷件4快速吸收发热元件3产生的热量，进而增强为可插拔设备进行散热的效果。
本申请实施例，还提供了一种散热系统，该散热系统包括信息通信设备、液冷散热件5和上述所述的可插拔设备；可插拔设备插在信息通信设备的接口部件7中，可插拔设备的两个管接头41分别与液冷散热件5的排液管接头51和进液管接头52相连。
其中，可插拔设备可以是光模块，那么，可插拔设备所插的信息通信设备可以是光通信设备。
在一种示例中，液冷散热件5可以位于信息通信设备的机框6中，例如，液冷件4的两个管接头41位于可插拔设备的靠近其外露端的位置处，那么，如图9所示，液冷散热件5可以位于信息通信设备的机框6中，且液冷散热件5的排液管接头51和进液管接头52均位于机框6的面板处，以便于可插拔设备插入信息通信设备以后，位于机框6面板处的排液管接头51和进液管接头52能够分别与伸出于机框6面板的两个管接头41相连。
在另一种示例中，液冷散热件5可以位于信息通信设备的机框6中，例如，液冷件4的两个管接头41位于可插拔设备的靠近其插入端的位置处，那么，液冷散热件5可以位于信息通信设备的机框6中，且液冷散热件5的排液管接头51和进液管接头52可以位于机框6的内部，且对应接口部件7的位置处，以便于可插拔设备插入信息通信设备以后，位于机框6内部的排液管接头51和进液管接头52能够分别与位于机框6内部的两个管接头41相连。
在另一种示例中，液冷散热件5也可以位于信息通信设备所在的机房中，例如，位于机房的机柜中，也可以位于两个机柜之间的风道中。
在本申请示例中，该散热系统包括液冷散热件5和具有液冷件4的可插拔设备，可插拔设备插在信息通信设备，需要散热时，液冷散热件5的排液管接头51和进液管接头52，分别与液冷件4的两个管接头41相连。这样，用于降温的液体能够在可插拔设备的液冷件4和信息通信设备的液冷散热件5之间流动，以吸收液冷件4的温度，为液冷件4降温，增大液冷件4和发热元件3之间的温差，促使液冷件4快速吸收发热元件3产生的热量，进而增强为可插拔设备进行散热的效果。
本申请实施例，还提供了一种可插拔设备的制造方法，该方法可以包括如下步骤：
首先，将线路板2安装在壳体1中。
其中，线路板2的尺寸与壳体1的尺寸相匹配，以便于线路板2能固定在壳体1中。
然后，将发热元件3焊接在线路板2的表面。
其中，发热元件3为可插拔设备中工作功率较高的元器件，在工作中能够产生较多的热量，例如，可以是可插拔设备的主功能器件、控制芯片和电源管理件中的至少一种。
在一种示例中，发热元件3可以通过锡焊接在线路板2的表面。
之后，将液冷件4安装在发热元件3的远离线路板2的表面，并将液冷件4的两个管接头41均固定在壳体1的壳壁。
其中，两个管接头41被配置为分别与液冷散热件5的排液管接头51和进液管接头52相连。
在一种示例中，为了吸收液冷件4和发热元件3之间的装配间隙，以减少接触热阻，相应的，液冷件4和发热元件3之间还可以填充热界面材料，以加快液冷件4和发热元件3之间的热量传递。
在本申请示例中，制造出的可插拔设备包括液冷件4，液冷件4位于可插拔设备的壳体中，与壳体中的发热元件3接触，液冷件4的两个管接头41位于壳体的壳壁，两个管接头41能够用来与液冷散热件5的排液管接头51和进液管接头52相连。这样，用于降温的液体能够在液冷件4和液冷散热件5之间流动，以吸收液冷件4的温度，为液冷件4降温，增大液冷件4和发热元件3之间的温差，促使液冷件4快速吸收发热元件3产生的热量，进而增强为可插拔设备如光模块进行散热的效果。
以上所述仅为本申请一个实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (12)

  1. 一种可插拔设备(100)，其特征在于，所述可插拔设备(100)包括壳体(1)、线路板(2)、发热元件(3)和液冷件(4)；
    所述线路板(2)、所述发热元件(3)和所述液冷件(4)依次叠加位于所述壳体(1)中，所述液冷件(4)的两个管接头(41)均固定于所述壳体(1)的壳壁；
    所述液冷件(4)的两个管接头(41)，被配置为分别与液冷散热件(5)的排液管接头(51)和进液管接头(52)相连。
  2. 根据权利要求1所述的可插拔设备(100)，其特征在于，所述液冷件(4)的两个管接头(41)均位于所述壳体(1)的靠近所述可插拔设备(100)的外露端的位置处；
    所述可插拔设备(100)的外露端为所述可插拔设备(100)插入信息通信设备时伸出于所述信息通信设备的端部。
  3. 根据权利要求1所述的可插拔设备(100)，其特征在于，所述液冷件(4)的两个管接头(41)均位于所述壳体(1)的靠近所述可插拔设备(100)的插入端的位置处；
    所述可插拔设备(100)的插入端为所述可插拔设备(100)插入信息通信设备时伸入于所述信息通信设备内部的端部。
  4. 根据权利要求1至3任一所述的可插拔设备(100)，其特征在于，所述发热元件(3)和所述液冷件(4)之间包括热界面材料。
  5. 根据权利要求1至4任一所述的可插拔设备(100)，其特征在于，所述发热元件(3)为所述可插拔设备(100)的主功能器件、控制芯片和电源管理件中的至少一种。
  6. 一种信息通信设备，其特征在于，所述信息通信设备包括机框(6)、接口部件(7)和液冷散热件(5)；
    所述接口部件(7)和所述液冷散热件(5)均位于所述机框(6)中，且所述接口部件(7)的插口位于所述机框(6)的面板处；
    所述液冷散热件(5)的排液管接头(51)和进液管接头(52)，被配置为分别与插在所述接口部件(7)中的可插拔设备(100)的两个管接头(41)相连，所述可插拔设备(100)为权利要求1至5任一所述的可插拔设备(100)。
  7. 根据权利要求6所述的信息通信设备，其特征在于，所述液冷散热件(5)的排液管接头(51)和进液管接头(52)均位于所述机框(6)的面板处。
  8. 根据权利要求6或7所述的信息通信设备，其特征在于，所述接口部件(7)的数量为多个，所述液冷散热件(5)的数量为至少一个。
  9. 一种散热系统，其特征在于，所述散热系统包括信息通信设备、液冷散热件(5)和权利要求1至5任一所述的可插拔设备(100)；
    所述可插拔设备(100)插在所述信息通信设备的接口部件(7)中，所述可插拔设备(100)的两个管接头(41)分别与所述液冷散热件(5)的排液管接头(51)和进液管接头(52)相连。
  10. 根据权利要求9所述的散热系统，其特征在于，所述液冷散热件(5)位于所述信息通信设备的机框(6)中，且所述液冷散热件(5)的排液管接头(51)和进液管接头(52)均位于所述机框(6)的面板处。
  11. 根据权利要求9所述的散热系统，其特征在于，所述液冷散热件(5)位于所述信息通信设备所在的机房中。
  12. 一种可插拔设备(100)的制造方法，其特征在于，包括：
    将线路板(2)安装在壳体(1)中；
    将发热元件(3)焊接在所述线路板(2)的表面；
    将液冷件(4)安装在所述发热元件(3)的远离所述线路板(2)的表面，并将所述液冷件(4)的两个管接头(41)均固定在所述壳体(1)的壳壁；
    其中，所述两个管接头(41)被配置为分别与液冷散热件(5)的排液管接头(51)和进液管接头(52)相连。
PCT/CN2021/103259 2020-11-13 2021-06-29 可插拔设备、信息通信设备、散热系统和制造方法 WO2022100106A1 (zh)

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