JP2005123643A5 - - Google Patents

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Publication number
JP2005123643A5
JP2005123643A5 JP2004356786A JP2004356786A JP2005123643A5 JP 2005123643 A5 JP2005123643 A5 JP 2005123643A5 JP 2004356786 A JP2004356786 A JP 2004356786A JP 2004356786 A JP2004356786 A JP 2004356786A JP 2005123643 A5 JP2005123643 A5 JP 2005123643A5
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JP
Japan
Prior art keywords
semiconductor device
electrode
semiconductor
adhesive
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004356786A
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English (en)
Japanese (ja)
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JP4247623B2 (ja
JP2005123643A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004356786A priority Critical patent/JP4247623B2/ja
Priority claimed from JP2004356786A external-priority patent/JP4247623B2/ja
Publication of JP2005123643A publication Critical patent/JP2005123643A/ja
Publication of JP2005123643A5 publication Critical patent/JP2005123643A5/ja
Application granted granted Critical
Publication of JP4247623B2 publication Critical patent/JP4247623B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004356786A 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器 Expired - Fee Related JP4247623B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27261398 1998-09-09
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000-569448A Division JPWO2000014802A1 (ja) 1998-09-09 1999-09-03 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (3)

Publication Number Publication Date
JP2005123643A JP2005123643A (ja) 2005-05-12
JP2005123643A5 true JP2005123643A5 (enExample) 2006-10-12
JP4247623B2 JP4247623B2 (ja) 2009-04-02

Family

ID=34621720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004356786A Expired - Fee Related JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Country Status (1)

Country Link
JP (1) JP4247623B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295763A (ja) * 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
EP3907769A1 (en) * 2020-05-08 2021-11-10 Koninklijke Philips N.V. Sensor comprising an interconnect and an interventional medical device using the same

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